Avnet Launches XRF8 System-on-Module for Multi-Channel RF Applications

Tiera Oliver

May 4, 2021

Chenbro Announces Chassis Reference Motherboard Program for Intel Ice Lake Processor Platform with Ma Labs

Chenbro

Ma Labs

May 4, 2021

Taipei, Taiwan — Chenbro (TWSE: 8210) announced its reference motherboard program, launching in collaboration with Ma Labs (USA), which will provide pre-tested 3 rd Generation Intel Xeon Scalable (codename ‘Ice Lake’) server barebone solutions for the North American market.

Logic Design Solutions Introduces the First NVMe HOST IP on POLARFIRE SoC FPGA

Tiera Oliver

May 4, 2021

VadaTech Announces a QorIQ P5040 Processor AMC with PCIe Interface

Tiera Oliver

May 3, 2021

The GENE-CML5 3.5" Subcompact Board From AAEON Offers Functionality to Support Industrial and AI Applications

Tiera Oliver

April 27, 2021

IoT Security and the Protection of IP at the Edge

Jake Schaffner

April 26, 2021

u-blox ALEX-R5 LTE-M module with IoT Security-as-a-Service receives 2021 IoT Evolution Industrial IoT Product of the Year Award

u-blox

April 26, 2021

When the Chips Are Down: Feedback from the Semiconductor Shortage

Brandon Lewis , Rich Nass , Perry Cohen

April 23, 2021

AAEON Releases BOXER-8253AI Compact Rugged Platforms

Perry Cohen

April 23, 2021

DEV KIT WEEKLY: Maxim Integrated Health Sensor Platform 3.0 Kit

Brandon Lewis

April 23, 2021

This isn’t the first Maxim Integrated development kit we’ve reviewed on Dev Kit Weekly, nor the first one that focuses on the healthcare sector. Back in 2019, we took a look at the company’s MAX86150EVSYS kit that targets mobile heart rate monitoring using ECG and PPG sensors. The Health Sensor Platform 3.0 takes that concept into a wearable form factor that integrates those same sensors, as well as a skin temperature sensor, that make it an ideal starting point for those of you developing personal fitness devices, patient health monitors, and so on.

ADLINK, Altium Partner to Offer Automated SMARC Carrier Design Process

Perry Cohen

April 22, 2021

TSMC Certifies Aprisa Place-And-Route Solution from Siemens on TSMC‘s N6 process

Tiera Oliver

April 22, 2021

Eurotech Collaborating with Infineon, Microsoft, and GlobalSign, Developing Solution for Secure Connected Device Rollout

Perry Cohen

April 19, 2021

aicas GmbH, SiFive Collaborate to Integrate RISC-V CPU architecture, JamaicaVM Java-Based Software Management

Perry Cohen

April 19, 2021

Renesas Strengthens RL78 Family of Low-Power MCUs with 16-Bit General-Purpose RL78/G23

Tiera Oliver

April 19, 2021

TQMLX2160A: the highspeed giant by TQ

TQ-Group

NXP Semiconductors

April 19, 2021

Embedded Cortex®-A72 module based on LX2160A with enhanced data and networking performance.

Industry High 98% Efficiency Demonstrated by AImotive and Nextchip

Tiera Oliver

April 19, 2021

Edge Management: The Next Big IoT Challenge

James White

April 19, 2021

Techniques to Improve UX for Success in Embedded Markets

Jason Clarke

April 16, 2021

STMicro Using OctaBus Flash Memory from Macronix

Perry Cohen

April 15, 2021

Embedded Systems: The Big Picture

Ian Ferguson

April 14, 2021

Accelerate AI Applications Using VITIS AI on Xilinx ZynqMP UltraScale+ FPGA

Vaibhav Kothari

April 13, 2021

u-blox, ArduSimple Release SimpleRTK2B-SBC

Perry Cohen

April 12, 2021

Automotive-Grade MEMS Mics Raise the Standard for In-Cabin Audio

Rich Nass

April 12, 2021