Embedded Computing Design

Longsys(301308.SZ), a branded semiconductor enterprise, will exhibit at COMPUTEX 2025 from May 20 to 23 at the Taipei Nangang Exhibition Center, under the theme “Storage Meets AI.” As artificial intelligence continues to drive innovation across devices and infrastructure, Longsys will unveil a comprehensive portfolio of high-performance, high-capacity, and highly reliable storage solutions built for AI-era applications.

Entries are judged using a 15-point rubric that assesses design excellence, relative performance, and market impact/disruption. Judging is managed by the ECD Content Team.

Advanced electronics devices today require compact and reliable interconnect solutions that support high-density performance and efficient data transmission speeds, and remain adaptable in evolving, high-performance medical, automotive, industrial, and consumer applications.

In this episode of Embedded Insiders, we’re joined by Carnegie Mellon professor and founder of Efficient Computer, Brandon Lucia. Brandon dives into his company's general-purpose processor, designed to deliver 100x more energy efficiency than any chip on the market today. He also shares insights from his academic work and the challenges impacting the next generation of engineers navigating today’s fast-evolving technological landscape.

Next-generation energy systems demand advanced solutions capable of delivering efficient power conversion, reliable system performance, and exceptional thermal stability, all in a compact and accurate design for modern power semiconductor technologies.

Lately, we are seeing increased interest in XGS-PON, GPON, and 10GE point-to-point (P2P) fiber networks, particularly as they enable seamless service delivery across residential, business, and mobile backhaul applications within a unified access infrastructure. One product that’s geared to enhance such networks is the Iskratel Lumia C16 compact, high-density Combo Optical Line Terminal (OLT), developed by Kontron. Designed for maximum deployment flexibility, it enables seamless service delivery across the aforementioned application spaces.

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Electronic devices and systems play a critical role in today’s medical equipment and communication networks. Modern electronics design requires reliable electromagnetic interference (EMI) and electromagnetic compatibility (EMC) in the environments they operate within to keep up with the evolution of advanced systems.

In this episode of Embedded Insiders, Editor-in-Chief Ken Briodagh sits down with Marten Smith, Principal Segment Manager for the Medical and Health Segment at Microchip Technology. Together, they explore how Microchip supports innovation in the medical field, navigates stringent security standards, and tackles the challenges of certifying new medical devices. They also discuss how advancements in AI are paving the way for improved patient care.

Navitas Semiconductor, a power semiconductor company focused on gallium nitride (GaN) power ICs and silicon carbide (SiC) technology, has announced its high-power GaNSafe ICs achieve automotive qualification for both AEC-Q100 and AEC-Q101, showcasing GaN’s next inflection into the automotive market.

Productivity and efficiency are essential for today’s professionals, who need tools to keep up with demanding, ever-changing work environments. Portable, durable, and reliable solutions are key to allowing them to work freely and effectively, wherever work takes them.

Heilind Electronics offers a line of portable printers designed to meet these needs. The Brady M410 and M510 printers cater to professionals in industrial (non-robotics), computing, data communications, telecommunications, test, measurement, and laboratory settings. The M410 printer is designed for handheld, industrial-grade printing use cases, and the M510 is designed as a durable desktop solution for workstations and assembly.

Registration for COMPUTEX 2025 Keynote is now open. The exhibition will take place from May 20th to 23rd at the Taipei Nangang Exhibition Center Halls 1 and 2. A day before the show, on May 19th, the COMPUTEX Keynote will take place, highlighting NVIDIA, Qualcomm, Hon Hai Technology Group (Foxconn), MediaTek, and NXP introducing the next generation of industrial developments.

Today’s developers are expected to bring the power and performance of machine learning to the edge. This is possible with the help of a development platform capable of evaluating and prototyping applications like edge computing, industrial automation, smart devices, and automotive applications, which increasingly demand use cases like low power consumption and machine learning acceleration.

The BG29 Bluetooth LE SoC from Silicon Labs is designed for miniaturized connected medical wearables, CGMs, insulin patches, and smart implants. The SoC solution promotes an ultra-compact design measuring 2.6 x 2.8 mm and is available in both QFN and WLCSP packages.

In this episode of Embedded Insiders, Scott Bibaud, President and CEO of Atomera, explores the rising costs of semiconductor manufacturing and the challenges of scaling to advanced nodes like 3nm and 2nm. He breaks down the diminishing performance gains and the complexity of high-volume semiconductor architectures.

Next, Rich and Scot Morrison, Vice President of Shift Left Software Product Management at Siemens EDA, discuss the growing specialization of chip design—and why development tools must evolve to keep up.

But first, Rich and I examine Moore’s Law and whether the push for ever-smaller chips is truly the best path forward.

At the global industry show embedded world 2025 in Nuremburg, Germany earlier this month, there was lots of talk about how important memory has become to embedded systems. The drive toward implementing technological trends like AI and neural network computing is driving the necessity for reliable and robust memory and storage solutions.

The BMR316 series from Flex Power Modules is designed to deliver efficient and high-performance power conversion to artificial intelligence (AI), machine learning (ML), and hyperscale computing applications that require intermediate bus voltage regulation.

In this episode of Embedded Insiders, we’re joined by Jonathan Moore, Director of Advanced Systems at Exida, and John Ellis, USA President and Head of Product at Codethink. These industry leaders share their insights on the future of automotive technology, focusing on software engineering for 2025, along with key discussions on trust, safety, and evolving industry standards.

But first, Rich and Ken are back from embedded world 2025 in Nuremberg to share highlights for those who couldn’t attend. They’ll cover the annual Best-in-Show awards, hands-on workshops, and emerging technologies shaping the future.