Embedded Computing Design

AI is advancing rapidly, enhancing everyday devices like phones, vehicles, smart cameras and sensors. However, AI development and deployment still largely relies on the cloud, raising the question: how can we make advanced AI accessible to everyone?

In this episode of Embedded Insiders, Rich and I sit down with Sid Sheth, CEO and co-founder of d-Matrix, to explore the ongoing generative AI boom—why it’s becoming increasingly unsustainable, and how d-Matrix is addressing the challenge with a chiplet-based compute architecture built specifically for AI inference.

Next, Ken brings us up to speed on some of the week’s top embedded industry headlines, with updates from ASUS IoT, LG, and Microelectronics UK.

But first, Rich, Ken, and I share our thoughts on the state of generative AI and AI inference. 

Learn about the latest Bluetooth offering from Infineon in the AIROC™️ CYW20829 Bluetooth®️ LE MCU. See if it is right for your applications with the latest Bluetooth®️ LE 5.4 support, up to 2300 meters range without an external PA, ultra-low latency with an average of 1 ms sub event interval, and more.

In this episode of Embedded Insiders, we’re joined by Bahar Sadeghi, Technical Director at CCC, and Alysia Johnson, CCC President, to talk about the latest expansion of the CCC Digital Key™ Certification Program, which now includes support for Bluetooth Low Energy (BLE) and Ultra-Wideband (UWB) technologies.

Listen to our application engineer and his team unveil our Bluetooth LE Long Range Capabilities and the outcomes of our extensive testing on the CYW20829 device.

In smart buildings, smart homes, or any other IoT-enabled, connected, and (crucially) lit smart infrastructure, the lighting is often the first and best place to start. Smart lighting can result in greater energy efficiency at a lower cost than almost any other initiative. This ROI, delivered early and quickly, has made lighting a smart and strategic beginning to intelligent design for years.

Today, there is a continuous need for low-power wireless connectivity solutions that can provide energy efficiency and high performance in demanding applications, ranging from smart homes and lighting to portable medical devices and AI/ML. These solutions are often faced with performing complex tasks while supporting communication protocols reliably and flexibly.

Nordic Semiconductor, a low-power wireless connectivity solutions provider, recently announced the acquisition of its long-term partner, Memfault Inc., a cloud platform provider for large-scale deployments of connected products. This marks a major leap in Nordic’s evolution from a hardware supplier to a complete solution partner, according to the announcement.

In this episode of Embedded Insiders, Editor-in-Chief Ken Briodagh dives into the transformative role of AI in Smart Manufacturing and the impact of 5G connectivity on enterprise operations with Telit Cinterion’s Bill Dykas, Senior Product Line Manager, and Stan Gray, SVP of IoT Broadband and High Cat Vertical Sales.

But first, Rich, Ken, and I unpack the recent "OpenAI for Government" initiative—a collaboration between OpenAI and the U.S. Department of Defense. Is this a bold step toward smarter public-sector technology, or does it raise serious concerns about security and oversight?

The agriculture industry is undergoing a transformation, driven by the convergence of automation, AI, and advanced connectivity technologies. As farming faces increasing challenges, particularly the growing labor shortages, autonomous agricultural machinery is emerging as more than just an innovation.

In a recent announcement that could have major impacts on the mobile computing space, Micron is shipping qualification samples of its first 1γ (1-gamma) node-based low-power double data rate 5X (LPDDR5X) memory.

In the world of healthcare technology, it’s critical to put patient needs first, and one of the best ways to do just that is to make it easier for doctors, nurses, and every medical professional to do their jobs.

When I first began directly interacting with my devices, I felt a direct connection to the devices. After a while, they “understood” me, almost knowing what actions I would take before I took them. It’s that direct connection that today’s human interface devices (HIDs) actually provide. And it’s not just a “feeling” anymore. Now, it’s reality. The HIDs serve as a bridge between us and our digital world, turning our hands, gestures, and movements into something a computer can react to instantly.

Edge AI innovation has never been more important to the Embedded Computing industry. The tools, platforms, and yes, applications that are enabled by artificial intelligence are moving ever closer to the edge, making it and the devices operating there ever smarter.

In our world of embedded systems and wireless connectivity, there’s no shortage of synthetic tests and perfectly controlled lab scenarios. But as any engineer worth their oscilloscope knows, the real challenge lies in the real world. It’s the real world where unexpected conditions arise, and where products earn their stripes, or show their flaws. At Infineon, we’ve always leaned into practical evaluation, and our latest deep dive into Bluetooth^® Low Energy (LE) throughput with the AIROC™ CYW20829 Bluetooth LE MCU follows that same hands-on philosophy.

System modularization means different things to different people. In the embedded-computing arena, it typically refers to the design approach in which a complex embedded system is divided into smaller, self-contained, and interchangeable hardware or software modules. Each module is responsible for a specific function and interacts with other modules through well-defined interfaces.

Analog Devices, Inc. announced the formation of the OpenGMSL™ Association, an initiative designed to revolutionize the future of in-vehicle connectivity. 

Centralized compute platforms are steadily replacing traditional domain-based E/E architectures in software-defined vehicles (SDVs). At the core of these platforms are high-performance system-on-chips (SoCs) that manage increasingly complex vehicle functions—from advanced driver-assistance systems (ADAS) to infotainment.

LE Audio brings in a suite of changes, including a new generic audio framework and a new audio codec. The latest spec introduces ISOC channels, and at a high level, this enables lower latency between devices, bidirectional communication, and broadcasting. This broadcasting feature is a big change in LE Audio since it will enable one-to-many devices capability, whereas before Classic Audio was limited to point-to-point communication.

Healthcare and medical technology have been growing in importance in both the embedded computing world and in patient care, and Infineon is making sure that these innovations are both as safe and secure as possible across use cases and applications. The market for medical electronics is currently expanding at a compound annual growth rate (CAGR) of 10 percent worldwide, according to recent studies.