Embedded Computing Design

In this episode of Embedded Insiders, Editor-in-Chief Ken Briodagh dives into the transformative role of AI in Smart Manufacturing and the impact of 5G connectivity on enterprise operations with Telit Cinterion’s Bill Dykas, Senior Product Line Manager, and Stan Gray, SVP of IoT Broadband and High Cat Vertical Sales.

But first, Rich, Ken, and I unpack the recent "OpenAI for Government" initiative—a collaboration between OpenAI and the U.S. Department of Defense. Is this a bold step toward smarter public-sector technology, or does it raise serious concerns about security and oversight?

The agriculture industry is undergoing a transformation, driven by the convergence of automation, AI, and advanced connectivity technologies. As farming faces increasing challenges, particularly the growing labor shortages, autonomous agricultural machinery is emerging as more than just an innovation.

In a recent announcement that could have major impacts on the mobile computing space, Micron is shipping qualification samples of its first 1γ (1-gamma) node-based low-power double data rate 5X (LPDDR5X) memory.

In the world of healthcare technology, it’s critical to put patient needs first, and one of the best ways to do just that is to make it easier for doctors, nurses, and every medical professional to do their jobs.

When I first began directly interacting with my devices, I felt a direct connection to the devices. After a while, they “understood” me, almost knowing what actions I would take before I took them. It’s that direct connection that today’s human interface devices (HIDs) actually provide. And it’s not just a “feeling” anymore. Now, it’s reality. The HIDs serve as a bridge between us and our digital world, turning our hands, gestures, and movements into something a computer can react to instantly.

Edge AI innovation has never been more important to the Embedded Computing industry. The tools, platforms, and yes, applications that are enabled by artificial intelligence are moving ever closer to the edge, making it and the devices operating there ever smarter.

In our world of embedded systems and wireless connectivity, there’s no shortage of synthetic tests and perfectly controlled lab scenarios. But as any engineer worth their oscilloscope knows, the real challenge lies in the real world. It’s the real world where unexpected conditions arise, and where products earn their stripes, or show their flaws. At Infineon, we’ve always leaned into practical evaluation, and our latest deep dive into Bluetooth^® Low Energy (LE) throughput with the AIROC™ CYW20829 Bluetooth LE MCU follows that same hands-on philosophy.

System modularization means different things to different people. In the embedded-computing arena, it typically refers to the design approach in which a complex embedded system is divided into smaller, self-contained, and interchangeable hardware or software modules. Each module is responsible for a specific function and interacts with other modules through well-defined interfaces.

Analog Devices, Inc. announced the formation of the OpenGMSL™ Association, an initiative designed to revolutionize the future of in-vehicle connectivity. 

Centralized compute platforms are steadily replacing traditional domain-based E/E architectures in software-defined vehicles (SDVs). At the core of these platforms are high-performance system-on-chips (SoCs) that manage increasingly complex vehicle functions—from advanced driver-assistance systems (ADAS) to infotainment.

LE Audio brings in a suite of changes, including a new generic audio framework and a new audio codec. The latest spec introduces ISOC channels, and at a high level, this enables lower latency between devices, bidirectional communication, and broadcasting. This broadcasting feature is a big change in LE Audio since it will enable one-to-many devices capability, whereas before Classic Audio was limited to point-to-point communication.

Healthcare and medical technology have been growing in importance in both the embedded computing world and in patient care, and Infineon is making sure that these innovations are both as safe and secure as possible across use cases and applications. The market for medical electronics is currently expanding at a compound annual growth rate (CAGR) of 10 percent worldwide, according to recent studies.

The demand for rugged, reliable industrial edge computing solutions continues to grow as industries evolve and applications increasingly operate in harsher and more remote environments. Solutions like these need to be connected, modular, and advanced enough to succeed in varying conditions.  

MACTRON is a company that has always known where its specializations give it innovative advantages. Right in its name, the company focused on M.A.C.: Medical, Automation, and Commercial product lines. Tron refers to how the company sees the transformative nature of its products and solutions.

In this episode of Embedded Insiders, we’re joined by RISC-V’s newest CEO, Andrea Gallo, who outlines his vision for the company’s future. From accelerating ecosystem growth to his expectations for current architectures, Gallo shares his strategy to shape the next chapter of RISC-V.

A key watchword of electronics design for the last decade has been efficiency. Finding efficiencies in design processes accelerates time to market. Innovations providing more efficient pathways for data, energy, and heat make for lower costs of operation, longer product lifecycles, and reduced environmental impact. None of this is new.

Bluetooth® Low Energy (LE) has quietly become one of the most critical enablers in the smart home ecosystem. While Wi-Fi grabs the headlines and Zigbee or Thread often get mentioned in hub-centric conversations, it’s Bluetooth® LE that’s powering many of the real-time, personal, and low-power interactions that make today’s smart homes feel intuitive and responsive.

AI at the Edge was a key theme at this year’s COMPUTEX in Taipei, Taiwan, and as a company specializing in AI at the Edge  across many verticals, the company showcased       a wide variety of products and solutions at the show.

In a big announcement for the RISC-V community, SiFive and Red Hat have made public a new collaboration between the two to bring Red Hat Enterprise Linux support to RISC-V. More, according to the release, Red Hat Enterprise Linux 10 is now available in developer preview on the SiFive HiFive Premier P550 platform.

MSI has long been well-known for its prowess as a maker of high-performance computing for gaming and PC, but at this year’s COMPUTEX in Taipei, Taiwan, the computing company showed off its muscle in AIoT, Intelligent Transportation management, and server-side AI.