Embedded Computing Design

In this episode of Embedded Insiders, Winston Leung, Senior Product Marketing Manager at QNX, and Jay Thomas, Director of Field Development at LDRA join the podcast to discuss the fusion of robotics and automation in modern manufacturing, and how functional safety is shaping this transformative shift.

Wirepas is joining Embedded World 2025 with its partners Cthings.co, N-iX, Haltian, and Wapice, all share the vision of better IoT.  At the partner booth 4A-300 visitors will get a chance to explore partner solutions.

As AI and edge-computing capabilities are increasingly being integrated into critical defense, aerospace, medical, smart security, and energy applications, the need for advanced AI inferencing, high-bandwidth video streams, and overall efficiency and reliability in a rugged, compact form factor is paramount.

On this episode of Embedded Insiders, Ken sits down with Rozalia Beica, Field CTO at Rapidus Corporation, to explore the rise of chiplet integration, Rapidus' U.S. expansion, the transformative role of AI in semiconductors, and the growing importance of advanced packaging in the industry. Stay tuned for insights into how Rapidus is shaping the future of semiconductor technology.

Engineers in automotive and industrial industries need flexibility, reliability, and simplified solutions to help them prototype and develop with ease. Whether that be flexibility between basic and highly complex systems, consistent reliability in these safety-critical systems, or simplified hardware and software integration, all are important to achieving success from conception to production.

In this episode of Embedded Insiders, Alex Iuorio, Avnet’s Senior Vice President of Global Supplier Development, delves into the findings of the 2025 Avnet Insights engineering survey. This year’s report focuses on Artificial Intelligence, examining what engineers expect from the market, the challenges they anticipate, and how AI is influencing product design.

xMEMS Labs released the xMEMS XMC-2400 µCooling chip, billed as the first-ever all-silicon, active micro-cooling fan designed for ultramobile devices and innovative artificial intelligence (AI) solutions.

Veterinary care is evolving, and Enclustra’s Mercury+ MP1 module, powered by Microchip® PolarFire® technology, is at the forefront of this innovation. This advanced FPGA System-on-Module is built for portability, efficiency, and high performance, redefining what’s possible in veterinary ultrasound.

There’s no slowing down the development of IoT devices today. From wearable medical devices and fitness trackers to smart home accessories and industrial applications, the growing number of IoT devices for AI and ML Edge applications can benefit from low-power, advanced connectivity and robust processing capabilities.

In a recent release, Biwin has introduced its next-generation Mini SSD, a new form factor designed to open new opportunities in data storage thanks to its compact design, high performance, and reliability.

High-speed interconnect industry-standard interfaces for communications between processors, accelerators, memory, storage, and other IO devices.

Today’s demanding IoT and multimedia applications, like smart homes, wearables, and industrial IoT devices, are often deployed in increasingly crowded wireless environments, requiring high-speed data transmission, reduced latency, and secure communication for users to achieve a seamless wireless connectivity experience.

In this episode of Embedded Insiders, Bruce Franklin, Senior Director of Automotive at Micron, joins us to share his 2025 predictions for the automotive industry. He dives into the role of embedded memory and storage in robotaxis, key considerations for manufacturers, and how these advancements will shape the future of self-driving cars and next-generation architectures.

In a new release, PIMIC, a maker of ultra-low-power AI semiconductor technology, unveiled its Clarity NC100, a Deep Neural Network (DNN)-based Environmental Noise Cancellation (ENC) chip.

Autonomous mobile robots (AMRs) are transforming the way work is carried out, from repetitive tasks on factory floors to operations in healthcare, retail, agriculture, and beyond.

Sealevel Systems produces some of the most rugged embedded computers that you may ever come across. And for many applications, they are a perfect fit. But if your application requirements are slightly lower, like you don’t need to deal with the highest levels of shock and vibration or the most extreme temperatures, Sealevel now has an offering for you. And it comes at a price point that’s likely easier on your budget. Hear more about the company’s new line in this video with Doug Trent, Sealevel Systems’ Inside Sales Manager.

In this episode of Embedded Insiders, Dunstan Power, Director of ByteSnap Design, unpacks the strategic and practical implications of Europe’s investment in the semiconductor industry. Dunstan shares his perspective on how this funding could bolster Europe’s chip manufacturing capabilities, address global supply chain challenges and foster innovation for companies like ByteSnap and its clients.

Video processing, communication, and machine learning inferencing applications are often deployed across a range of industries and tasked with managing edge computing workloads requiring large memories, DSP resources, and a variety of high bandwidth interfaces. To support these applications, a next-generation small FPGA platform offers reconfigurability, high performance, and the ability to integrate advanced resources in a compact form factor.

If you're an enthusiast, developer, or professional in embedded systems, AI, or IoT, embedded world Exhibition&Conference is an event you can’t afford to miss.

AI-powered applications, gaming devices, and other media solutions today must meet the increasing demands for AI acceleration, next-generation connectivity standards, overall efficiency, and low power consumption. To meet these demands, Intel produced the Intel® Core™ Ultra Processors.