Embedded Computing Design

As you visit embedded world North America, make sure to stop by Booth 9056 where Opal Kelly will be demonstrating its FrontPanel 6, a next generation development platform built on web technologies. Utilizing JavaScript, HTML, and CSS, design teams can create FPGA-connected applications that run directly in the browser.

Designing systems that incorporate Edge intelligence but find themselves in constrained spaces present a series of intertwined challenges that require careful balancing of performance, size, and reliability. One of the most pressing issues a developer must deal with is thermal management and associated power density. This is because high-performance CPUs like the Intel Core 3 and the heavy workloads generated tend to produce significant amounts of heat. And in compact enclosures, there’s typically very little room for airflow.

In this episode of Embedded Insiders, Erik Kling, President & Head of IoT Americas at Vodafone IoT, discusses the connectivity gaps in remote healthcare and how cellular IoT connectivity supports challenges across industrial, supply chain, and healthcare industries. 

The 20822 Bluetooth module is the perfect ready-to-use solution for those looking to streamline Bluetooth development in their products.

In this episode of Embedded Insiders, Rich and Jeff Baldwin, Director of Engineering at Sealevel Systems, discuss the process of designing systems for harsh environments and how Sealevel’s expertise helps customers get started with safe and reliable solutions.

Our next segment is sponsored by Infineon Technologies. Rich Nass is joined by Erik Wood, Infineon’s Senior Director of Microcontroller Cryptography and Product Security, and the two discuss quantum computing and how the experts at Infineon are working to keep systems secure.

Infineon’s 20822 module is the ideal turnkey solution delivering a ton of performance and power efficiency in a cost-effective package that contains everything developers will need to integrate Bluetooth into their products.

In this episode of Embedded Insiders, we’re joined by Product Marketing Manager at Microchip, Pramit Nandy, to discuss the current trends and challenges surrounding energy-efficient motor control. Specifically, the shift between various motor types, control algorithms, and, of course, the importance of SiC and GaN. 

In this episode of Embedded Insiders, Contributing Editor Rich Nass chats with Earle Foster, Senior Vice President of Sales at Sealevel Systems, about how to build embedded systems without starting from scratch. They explore when to rely on fully custom and off-the-shelf components, and where semi-custom solutions are most suitable.

Later, Ken talks with Soracom Co-Founder and CTO Kenta Yasukawa about the company’s latest GenAI developments, with a brief mention of our upcoming AI at the Edge Day.

But first, Ken and I break down the latest news on NVIDIA’s H20 chip and developing export regulations around advanced AI chips.

Trenz Electronic was recently announced as an “AMD Partner of the Year 2024”.  The company develops, manufactures, sales, and integrates FPGA and embedded systems delivering a wide range of modules, development boards, and custom solutions utilized for industrial automation medical technology, and aerospace.

Munich, Germany. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is taking a major step forward in the wireless human input device (HID) space. The company just announced that its AIROC™ CYW20829 Bluetooth® LE microcontroller (MCU) and SDK have been verified under Intel’s “Engineered for Intel® Evo™” laptop accessory program, making it the first Bluetooth HID solution to earn that distinction. That’s a big deal.

Ditch the dongle with Engineered for Intel Evo, a verified program that meets Intel’s strict direct-to-host wireless connection requirements. Powered by Infineon’s CYW20829, the first program co-engineered with Intel at the chip and SDK level, physical security is enhanced while meeting CRA and RED certifications. This innovation brings significant advancement to the wireless connectivity space, streamlining development and elevating the user experience.

With the rising popularity of eBikes and eScooters, having wireless access to vital information, such as speed and map directions, is key to ensuring rider safety. With so many applications to choose from, this demo will focus on 20829’s peripheral support for automotive industry standards, such as CAN and LIN, while highlighting its versatility both as an MCU and Bluetooth LE chip.

Making patient care the focus of technological innovation is about meeting patient needs, yes, but often it’s also about making sure medical professionals have the tools available to do their jobs more easily and efficiently.

To keep pace with the surging demands of modern automation and digital transformation, manufacturers now demand edge AI platforms that are not just powerful but intelligent, rugged, and scalable by design.

The embedded computing community and industry have made embedded world the global platform and thought leadership meeting point for experts, key players and major associations in the embedded space. This year, that community and industry expertise is coming to Anaheim, California for the second embedded world North America, taking place November 4-6 at the Anaheim Convention Center.

In this episode of Embedded Insiders, we’re joined by Piyush Sevalia, Executive Vice President of Marketing at SiTime, to discuss the evolving landscape of precision timing solutions and the shift from quartz to silicon-based MEMS. 

Next, Ken is back with another edition of ICYMI, where he updates us on some of the top embedded news stories, and this week we’ve got news from Shelly Group, Emerson, and Cincoze.

But first, Ken and I share our opinions on today’s modern precision timing solutions. 

Want to get started with the latest Bluetooth 5.4 supported Bluetooth LE MCU? View everything you need to get started with the AIROC™️ CYW20829 Bluetooth®️ LE MCU Evaluation Kit here.

The requirements for today’s microcontrollers are increasing, with growing demands for improved power efficiency, real-time networking capabilities, and reliable processing and compatibility for vision and audio tasks. Applications relying on these must often shift away from traditional MCUs and toward modern microcontrollers that are capable of handling higher-performance computing, AI acceleration, and more.

Phoenix AZ, July 29th 2025 – Due to significant growth in edge AI, OpenSystems Media has launched the AI at the Edge E-Newsletter starting in August 2025.  Each issue will contain the latest blogs,  webinars, news, videos, podcasts and products covering the latest trends in industrial edge AI and machine learning topics.

As the threat landscape shifts toward faster, more agile strike capabilities, so too must our defensive architectures. From traditional ballistic missiles to hypersonic glide vehicles and unmanned aerial systems (UAS), the spectrum of challenges is broad and intensifying. The Golden Dome initiative is at the forefront of addressing these threats by rethinking how speed, agility, and multi-domain readiness intersect.