Embedded Computing Design

Trenz Electronic was recently announced as an “AMD Partner of the Year 2024”.  The company develops, manufactures, sales, and integrates FPGA and embedded systems delivering a wide range of modules, development boards, and custom solutions utilized for industrial automation medical technology, and aerospace.

Munich, Germany. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is taking a major step forward in the wireless human input device (HID) space. The company just announced that its AIROC™ CYW20829 Bluetooth® LE microcontroller (MCU) and SDK have been verified under Intel’s “Engineered for Intel® Evo™” laptop accessory program, making it the first Bluetooth HID solution to earn that distinction. That’s a big deal.

Ditch the dongle with Engineered for Intel Evo, a verified program that meets Intel’s strict direct-to-host wireless connection requirements. Powered by Infineon’s CYW20829, the first program co-engineered with Intel at the chip and SDK level, physical security is enhanced while meeting CRA and RED certifications. This innovation brings significant advancement to the wireless connectivity space, streamlining development and elevating the user experience.

With the rising popularity of eBikes and eScooters, having wireless access to vital information, such as speed and map directions, is key to ensuring rider safety. With so many applications to choose from, this demo will focus on 20829’s peripheral support for automotive industry standards, such as CAN and LIN, while highlighting its versatility both as an MCU and Bluetooth LE chip.

Making patient care the focus of technological innovation is about meeting patient needs, yes, but often it’s also about making sure medical professionals have the tools available to do their jobs more easily and efficiently.

To keep pace with the surging demands of modern automation and digital transformation, manufacturers now demand edge AI platforms that are not just powerful but intelligent, rugged, and scalable by design.

The embedded computing community and industry have made embedded world the global platform and thought leadership meeting point for experts, key players and major associations in the embedded space. This year, that community and industry expertise is coming to Anaheim, California for the second embedded world North America, taking place November 4-6 at the Anaheim Convention Center.

In this episode of Embedded Insiders, we’re joined by Piyush Sevalia, Executive Vice President of Marketing at SiTime, to discuss the evolving landscape of precision timing solutions and the shift from quartz to silicon-based MEMS. 

Next, Ken is back with another edition of ICYMI, where he updates us on some of the top embedded news stories, and this week we’ve got news from Shelly Group, Emerson, and Cincoze.

But first, Ken and I share our opinions on today’s modern precision timing solutions. 

Want to get started with the latest Bluetooth 5.4 supported Bluetooth LE MCU? View everything you need to get started with the AIROC™️ CYW20829 Bluetooth®️ LE MCU Evaluation Kit here.

The requirements for today’s microcontrollers are increasing, with growing demands for improved power efficiency, real-time networking capabilities, and reliable processing and compatibility for vision and audio tasks. Applications relying on these must often shift away from traditional MCUs and toward modern microcontrollers that are capable of handling higher-performance computing, AI acceleration, and more.

Phoenix AZ, July 29th 2025 – Due to significant growth in edge AI, OpenSystems Media has launched the AI at the Edge E-Newsletter starting in August 2025.  Each issue will contain the latest blogs,  webinars, news, videos, podcasts and products covering the latest trends in industrial edge AI and machine learning topics.

As the threat landscape shifts toward faster, more agile strike capabilities, so too must our defensive architectures. From traditional ballistic missiles to hypersonic glide vehicles and unmanned aerial systems (UAS), the spectrum of challenges is broad and intensifying. The Golden Dome initiative is at the forefront of addressing these threats by rethinking how speed, agility, and multi-domain readiness intersect.

AI is advancing rapidly, enhancing everyday devices like phones, vehicles, smart cameras and sensors. However, AI development and deployment still largely relies on the cloud, raising the question: how can we make advanced AI accessible to everyone?

In this episode of Embedded Insiders, Rich and I sit down with Sid Sheth, CEO and co-founder of d-Matrix, to explore the ongoing generative AI boom—why it’s becoming increasingly unsustainable, and how d-Matrix is addressing the challenge with a chiplet-based compute architecture built specifically for AI inference.

Next, Ken brings us up to speed on some of the week’s top embedded industry headlines, with updates from ASUS IoT, LG, and Microelectronics UK.

But first, Rich, Ken, and I share our thoughts on the state of generative AI and AI inference. 

Learn about the latest Bluetooth offering from Infineon in the AIROC™️ CYW20829 Bluetooth®️ LE MCU. See if it is right for your applications with the latest Bluetooth®️ LE 5.4 support, up to 2300 meters range without an external PA, ultra-low latency with an average of 1 ms sub event interval, and more.

In this episode of Embedded Insiders, we’re joined by Bahar Sadeghi, Technical Director at CCC, and Alysia Johnson, CCC President, to talk about the latest expansion of the CCC Digital Key™ Certification Program, which now includes support for Bluetooth Low Energy (BLE) and Ultra-Wideband (UWB) technologies.

Listen to our application engineer and his team unveil our Bluetooth LE Long Range Capabilities and the outcomes of our extensive testing on the CYW20829 device.

In smart buildings, smart homes, or any other IoT-enabled, connected, and (crucially) lit smart infrastructure, the lighting is often the first and best place to start. Smart lighting can result in greater energy efficiency at a lower cost than almost any other initiative. This ROI, delivered early and quickly, has made lighting a smart and strategic beginning to intelligent design for years.

Today, there is a continuous need for low-power wireless connectivity solutions that can provide energy efficiency and high performance in demanding applications, ranging from smart homes and lighting to portable medical devices and AI/ML. These solutions are often faced with performing complex tasks while supporting communication protocols reliably and flexibly.

Nordic Semiconductor, a low-power wireless connectivity solutions provider, recently announced the acquisition of its long-term partner, Memfault Inc., a cloud platform provider for large-scale deployments of connected products. This marks a major leap in Nordic’s evolution from a hardware supplier to a complete solution partner, according to the announcement.