Embedded Computing Design

During embedded world, Wind River (Hall 5, Booth 253) will showcase its intelligent edge software that is facilitating new possibilities with AI at the edge from cloud based, cloud native, DevOps solutions to real-time and open-source technologies.

The Embedded Computing Design editorial staff is pleased to present this year’s embedded world Best-in-Show nominees in the following categories:

Reliability, flexibility, and security are some of the many demanding requirements of today’s embedded, IoT, and operational technology applications. But it’s often difficult to acquire all of these capabilities in one solution that also integrates seamlessly into existing systems.

Today, the demand for real-time data processing and large language model (LLM) integration is infiltrating varying industries as IoT devices and edge computing capabilities continue to proliferate. To support this demand, a solution that enables advanced computing, a scalable infrastructure, and a compact design to handle complex workloads is a must.

The demand for AI applications in automation and robotics is rapidly growing, driven by the need for devices that can locally process data, enable real-time decision-making, and efficiently execute complex AI models.

The world of software development is advancing rapidly, and today’s developers are responsible for ensuring the reliability, quality, flexibility, and overall efficiency of modern, advanced systems. But managing and monitoring a wide variety of system insights across the software lifecycle can be overwhelming without the proper assistance.

Today’s growing industrial environments and workflows benefit from rugged, reliable, and flexible solutions tailored to meet various interactive and touch-enabled needs.

In this episode of Embedded Insiders, Winston Leung, Senior Product Marketing Manager at QNX, and Jay Thomas, Director of Field Development at LDRA join the podcast to discuss the fusion of robotics and automation in modern manufacturing, and how functional safety is shaping this transformative shift.

Wirepas is joining Embedded World 2025 with its partners Cthings.co, N-iX, Haltian, and Wapice, all share the vision of better IoT.  At the partner booth 4A-300 visitors will get a chance to explore partner solutions.

As AI and edge-computing capabilities are increasingly being integrated into critical defense, aerospace, medical, smart security, and energy applications, the need for advanced AI inferencing, high-bandwidth video streams, and overall efficiency and reliability in a rugged, compact form factor is paramount.

On this episode of Embedded Insiders, Ken sits down with Rozalia Beica, Field CTO at Rapidus Corporation, to explore the rise of chiplet integration, Rapidus' U.S. expansion, the transformative role of AI in semiconductors, and the growing importance of advanced packaging in the industry. Stay tuned for insights into how Rapidus is shaping the future of semiconductor technology.

Engineers in automotive and industrial industries need flexibility, reliability, and simplified solutions to help them prototype and develop with ease. Whether that be flexibility between basic and highly complex systems, consistent reliability in these safety-critical systems, or simplified hardware and software integration, all are important to achieving success from conception to production.

In this episode of Embedded Insiders, Alex Iuorio, Avnet’s Senior Vice President of Global Supplier Development, delves into the findings of the 2025 Avnet Insights engineering survey. This year’s report focuses on Artificial Intelligence, examining what engineers expect from the market, the challenges they anticipate, and how AI is influencing product design.

xMEMS Labs released the xMEMS XMC-2400 µCooling chip, billed as the first-ever all-silicon, active micro-cooling fan designed for ultramobile devices and innovative artificial intelligence (AI) solutions.

Veterinary care is evolving, and Enclustra’s Mercury+ MP1 module, powered by Microchip® PolarFire® technology, is at the forefront of this innovation. This advanced FPGA System-on-Module is built for portability, efficiency, and high performance, redefining what’s possible in veterinary ultrasound.

There’s no slowing down the development of IoT devices today. From wearable medical devices and fitness trackers to smart home accessories and industrial applications, the growing number of IoT devices for AI and ML Edge applications can benefit from low-power, advanced connectivity and robust processing capabilities.

In a recent release, Biwin has introduced its next-generation Mini SSD, a new form factor designed to open new opportunities in data storage thanks to its compact design, high performance, and reliability.

High-speed interconnect industry-standard interfaces for communications between processors, accelerators, memory, storage, and other IO devices.

Today’s demanding IoT and multimedia applications, like smart homes, wearables, and industrial IoT devices, are often deployed in increasingly crowded wireless environments, requiring high-speed data transmission, reduced latency, and secure communication for users to achieve a seamless wireless connectivity experience.

In this episode of Embedded Insiders, Bruce Franklin, Senior Director of Automotive at Micron, joins us to share his 2025 predictions for the automotive industry. He dives into the role of embedded memory and storage in robotaxis, key considerations for manufacturers, and how these advancements will shape the future of self-driving cars and next-generation architectures.