Embedded Computing Design

You asked for high performance in a small, rugged design. Now you have it.

Embedded World is here, but it looks very different this year. The pandemic has caused the show to turn virtual, so meetings take place via electronic means rather than face-to-face.

With time to market pressures constantly increasing, technology organizations are moving away from traditional waterfall development workflows and towards Agile/DevOps software development practices.

Security is vital. However, there are many different ways to approach security.

We’ve been hearing about the benefits of Edge computing and the ability to perform AI at that Edge for quite some time.

Just when you thought you had plugged all the holes, more vulnerability points pop up.

FPGAs represent a comfort zone for many design engineers.

Alliance Memory recently expanded its offering of high-speed CMOS mobile low-power SDRAMs with new LPDDR4 devices that all feature on-chip ECC.

What do you get when you cross high-bandwidth memory with artificial intelligence (AI)?

The fear (that’s probably too strong of a word) surrounding silicon carbide (SiC) power semiconductors has subsided for the most part.

Wind River has been king of the RTOS hill for a long time. We can debate whether they are still the reigning king.

I detect a disconnect—display technology continues to evolve. Not necessarily at breakneck speed, but fast enough that you want to upgrade your technology every few (five?) years.

The push today is to move AI out to the Edge. But can we handle the processing that’s required for AI out on the Edge?

I recently attended a roundtable discussion held by Texas Instruments to talk about their latest technology, a wireless battery-management system (BMS) for electric vehicles (EVs).

New version of IoT IDE adds lots of features.

Should you fear the quantum security apocalypse? Do you even know it is and what it means and how it can occur? If you have any doubt, I suggest you listen to this week’s Embedded Executives podcast.

“One of the major advantages of the COM-HPC architecture is that you can share the same module and use it across different applications,” offers Joel Finkel of Intel.

The beauty of an open standard like COM-HPC is that it’s interchangeable between different vendors and also between different technologies,” says Christian Eder, congatec.

“By using this computer and module philosophy, you end up with a very flexible system," said Chris Engels of Avnet Integrated. "The result is a system that’s widely usable over a long period of time."

An interview with Burrell Best of Samtec, an overview of the signal integrity and platform integrity subgroup activities enabling COM-HPC.