The Road to Embedded World: Advantech
May 12, 2022
Blog
Advantech is one of those global embedded computer companies, so their road is not a simple A to B. point to point connection. That said, with facilities all around the globe, the company will have lots to show up the upcoming embedded world exhibition, specifically in Hall 1, Booth 1-207.
For starters, the company will have its SOM-C350 COM-HPC client size C module on display. The module includes an Intel Alder Lake-S desktop socket type CPU for up to 16 cores. Its dual-channel DDR5 SODIMM memory maxes out at 128 Gbytes.
A second SOM that will be on display in the Advantech stand is the SOM-D580, which is a server size D module, designed with Intel Xeon D-2700 microprocessors (up to 20 cores). It boasts 32 lanes of PCIe Gen 4 and 17 lanes of PCIe Gen 3.
At press time, Advantech was hoping to show its latest module, the SOM-E780, based on an AMD EYPC 7003 server-grade CPU. Built to the COM-HPC server size E form factor, it holds up to 512 Gbytes of DDR4 memory and provides up to 79 PCIe Gen4 lanes which, according to the company, is up to 14 more than what’s included in the COM-HPC standard.
Be sure to check out the other stops we’ve made on the road to embedded world: Texas Instruments, AVerMedia, WINSYSTEMS, Diamond Systems, MACTRON GROUP, MiTAC, Neousys Technology, SECO, and iBase Technology.
Rich Nass is a regular contributor to Embedded Computing Design. He has appeared on more than 500 episodes of the popular Embedded Executive podcast series, and is a regular contributor to the Embedded Insiders podcast.
Rich has been in the engineering OEM industry for more than 35 years, and is a recognized expert in the areas of embedded computing, Edge AI, industrial computing, the IoT, and cyber-resiliency and safety and security issues. He writes and speaks regularly on these topics and more.
Rich is currently the Liaison to Industry for the Embedded World North America Exhibition and Conference, and has held similar positions with the global Embedded World Conference and Exhibition.
Previously, Rich was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events. In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites.
Nass holds a BSEE degree from the New Jersey Institute of Technology.
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