Embedded Computing Design

Think you are going to embedded world 2023? Well, maybe think your way over to hall 4 booth 476 to visit Think Silicon’s experts as they demonstrate its ultra-low power graphics IP and deep learning accelerator for the endpoint.

Everyone should be “reinforcing your security resilience” and Scalarr may have the cyber security solutions you are looking for. Scalarr will be presenting at embedded world 2023 in hall 3 booth 107 showcasing its AI EdgeLabs, an advanced AI-powered cybersecurity solution for Edge/IoT distributed environment.

GIGAIPC, an embedded solution-focused subsidiary of GIGABYTE, will be demonstrating its innovative industrial and embedded computing products at hall 1 booth 283 during embedded world 2023. Highlights from GIGAIPC’s booth will be its smart retail and digital signage solutions.

“Today we are unveiling the world’s first MCU AI Developer Cloud, which works hand-in-glove with our STM32Cube.AI ecosystem. This new tool brings the possibility to remotely benchmark models on STM32 hardware through the cloud to save on workload and cost” said Ricardo De Sa Earp, Executive Vice President General-Purpose Microcontroller Sub-Group, STMicroelectronics. 

Boston, Massachusetts. The Industry IoT Consortium (IIC) released its Optimal Use of Cloud and Edge in Industrial Machine-Vision Applications whitepaper. Readers will read a simple guide to help them through the development of integrated machine vision along with industrial cloud and edge computing solutions.

Thalwil, Switzerland. u-blox has released the u-blox JODY-W4 an automotive-grade module integrating Wi-Fi 6E and Bluetooth LE Audio functionality in all its variations. Included are three antenna ports (13.8 x 19.8 x 2.5 mm), Infineon chipset (89570 / 89570B), and pin cooperation with other u-blox JODY family support. The right out of the box solution is ideal for the challenges of cost, multiple interfaces, and complex designs.

This next stop is in my home state and it is always great to be back, unless it is winter. We are visiting Samtec and getting some insider information on Samtec’s high-performance interconnects for embedded computing applications. It’s highlight at embedded world 2023 will be PICMG COM-HPC, other Standards-based interconnect solutions, and its latest RF solutions.

On this stop at Mender, we are going to learn about its solution to provide secure, risk tolerant, and efficient over-the-air updates for all device software. Mender’s experts will be at embedded world 2023 and demonstrating live updates on devices.

Growing up in Indiana as a Notre Dame football fan, I remember seeing the hard fought games when the Irish would face the Spartans or Wolverines. Michigan was always a nice destination for me to visit and get some serene camping in while there. And definitely don’t forget the Mackinaw Peaches. Today we are visiting Acromag and learning what they are delivering to its booth (Hall 1, Booth 115), and its solutions will last way longer than the two weeks.

Modern power distribution units (PDUs) – devices that are commonly used to deliver power to server racks – can be managed remotely. While convenient and often efficient, these power delivery systems also represent an attack vector for bad actors looking to infiltrate networks, data centers, and anything connected to them.

NVIDIA partner Cogniteam revealed one platform as a new means to develop and manage the robot and its IoT environment by utilizing reliable Internet of Robotic Things (IoRT) devices, based on the Nimbus’ library of developed field-deployed software components. This reduces the prototype development time by 60%.

 

By incorporating supportive crypto hardware, we arrive at a True PUF-based Crypto Coprocessor. The all-in-one integrated solution can take care of all required security functions throughout the product lifecycle. Such compact design can also maintain a security boundary for keeping sensitive information or assets intact. Finally, products and services become secure as protection from the hardware level extends all the way to OS and APPs.

KIRKLAND, Washington. Alliance Memory stated it has extended its portfolio of CMOS DDR4 SDRAMs with a 16Gb device in the 96-ball FBGA form factor, the AS4C1G16D4-062BCN. The DDR4 SDRAM operates at a low +1.2V (±0.06V). It was developed and qualified for utilization in 5g designs, computing applications, surveillance systems, smart meters, human-machine interfaces (HMI), digital signal controllers, and PNDs.

ZAYA will be located in hall 4A booth 620 during embedded world 2023 highlighting its secure and certified development solutions for RISC-V powered products. Visit ZAYA’s experts and learn about the Zaya RISCV-V TEE and RISC-V Security Monitor. ZAYA is PSA Certified, and it achieved the First & Only PSA Certification for a RISC-V Powered Chipset, called Blaitek’s BL808 Chipset.

Visidon, and Inuitive announced a solution for reliable, and real-time low light technology. The solution solves the problem of traditional noise reduction algorithms for edge devices, such as robotics, consumer electronic devices with cameras, and surveillance systems. Integrating Intuitive’s NU4100 vision-on-chip processor and its AI image processing and depth sending with Visidon’s low light enhancement technology moves vision technology closer to next-generation.

Ignion is on a mission to make RF easy, and at Embedded World 2023 Ignion will be showcasing the tools and products that are proof of its commitment to simplicity. Be sure to stop by and visit the experts at Ignion and find the RF solution that works for you.

If you are searching and needing AIoT hardware service solutions, make sure to visit hall 3 booth 530 at embedded world 2023, where Seeed will be highlighting its edge computing systems. Seeed provides open technology and agile manufacturing services, with the mission to make hardware more accessible and lower the threshold for hardware innovation.

The need for storage is only going to grow with data and more data being used for the consumer, corporate, and industrial segments. BIWIN Storage Technology CO., Ltd. will be highlighting its reliable flash storage at embedded worl 2023.  BIWIN is known for its independent development capabilities in hardware, software, firmware and storage algorithms.

Hsinchu, Taiwan and Uppsala, Sweden. Andes Technology and IAR collaborated on  ILITEK’s Touch and Display Driver Integration (TDDI) SoC, ILI6600A. The SOC integrates the Andes N25F-SE ISO 26262 certified V5 RISC-V CPU core, and the IAR certified Embedded Workbench toolchain for RISC-V.

CONTACT Software is working on innovating Asset Administration Shell (AAS) as a new member of IDTA - International Digital Twin Association. The open-source project has a goal to standardize AAS in industry solutions. The shell builds the architecture for end-to-end data cycles between companies, plants, and IT platforms. The AAS connects and defines a device twin to enable a better collaboration amongst manufacturers, suppliers, and customers.