Embedded Computing Design

Chicago, Illinois -- Newark recently conducted an element14 Community poll to measure the current opinion on Industry 5.0 that states that robots and other machines will begin to work alongside humans by utilizing IoT and big data. Results showed various insights on industry experts believing Industry 5.0, while a valid thought, is just premature talk.
 

Tualatin, Oregon. The newest member of VersaLogic’s line of rugged computers, its Swift, featuring Intel’s Coffee Lake Refresh 9th-generation Xeon processor (6 cores and Hyper-Threading) with up to 32GB of error-correcting memory, enhanced 128 GB NVMe SSD storage, and TPM 2.0 security. Functional error-correcting memory is ideal for mission-critical applications and aeronautics applications at higher altitudes. The platform was engineered and tested for defense, aerospace, and medical applications.

AAEON introduced its RTC-1010RK, the latest innovation to its 10.1" rugged mobile tablet with integrated Rockchip RK3399 processor. The platform leverages a quad-core Arm Cortex-A53 and a dual-core Arm Cortex-A72. The RTC-1010RK is designed for challenging deployment environments such as field inspection, warehouse management, and factory automation.

Micron Technology, Inc. revealed it is sampling the automotive-grade Micron 4150AT SSD, the first quad-port SSD capable of interfacing with up to four systems on chips (SoCs) to centralize storage for software-defined intelligent vehicles. It delivers single-root input/output virtualization (SR-IOV), a PCIe Generation 4 interface, and ruggedized automotive design supporting the environment with data center-level flexibility and power.

EKF* introduced the 7L600, its first ModBlox7-based product at Embedded World. The 7L600 is a single-pair Ethernet (SPE) switch combining modularity with superior computing power and innovative interfaces. The switch is designed as a multifunctional gateway in a wide range of IIoT or retrofit applications and able to act as an edge computer for (real-time) data pre-processing and data collection leveraging an on-board ARM CPU.

DEEPX plans to develop its first-generation AI chip portfolio to concentrate intelligent video analytics and security system market. DEEPX plans an exhibition at COMPUTEX 2024 where it will demonstrate the acceleration of its on-device AI solutions.

TAITRA (Taiwan External Trade Development Council) will host Dr. Rick Tsai, Vice Chairman and CEO of MediaTek, as he delivers a keynote at COMPUTEX 2024 on June 4. Dr. Tsai will speak on how the latest silicon advancements and connectivity standards are creating AI everywhere.

COMPUTEX, a global AIoT & startup show, will be held this year from June 4 to 7 at Taipei Nangang Exhibition Center Halls 1 and 2. Computex will host an impressive list of keynote speakers, including experts from AMD, Qualcomm Incorporated, Intel, MediaTek, Supermicro, NXP Semiconductors, and Delta. Industry professionals are encouraged to register online to view what innovations are being designed within AIoT.

Cincoze will exhibit at Automate 2024 (South Hall, Stand 1062) in Chicago, USA, on May 6–9, 2024. On display will be its range of world-class industrial embedded computing products focused on the theme “Comprehensive AI Edge Computing Solutions” encompassing the full spectrum of industrial application environments in four dedicated zones, including the Rugged Embedded Computers, Industrial Panel PCs & Monitors, Embedded GPU.

SYSGO released its support for RISC-V via its embedded Linux ELinOS version 7.2. The platform fully supports Microchip's PolarFire SoC Icicle. The ratification also sees fixes for the 2038 bug for all architectures.

Minneapolis, Minnesota. Digi International released its latest addition to its remote monitoring and control portfolio, Digi Connect Sensor XRT-M powered by Digi Axess. The solution delivers reliable and seamless remote monitoring and management. Developers can utilize both edge and cloud-based control options with an intuitive interface simplifying data management and enhancing efficiency.

 

San Jose, California. Innominds announced the availability of its iDhi, an enterprise and industrial IoT Edge Compute box. This Edge AI Platform is built around the Innominds ISQ5165/ISQ8250 small-form-factor System on Modules (SoM) and is powered by the Qualcomm QRB5165/QCS8250 processors delivering up to 15 TOPS. The platform accommodates multiple M.2 slots for integrating AI accelerator modules.

 

SB Components introduced its LoRaWAN Series that simplifies the integration of IoT with a portfolio consisting of gateways and nodes compatible with TheThingsStack and Chirpstack making non-cellular LPWAN networks an easier challenge.

Efinix recently commented that its Titanium Ti375 high performance FPGA is now shipping in sample quantities to early access customers. Manufactured using advanced 16 nm process technology, the Ti375 exemplifies the innovation behind Titanium FPGAs. These FPGAs deliver enhanced performance and efficiency, featuring high-density, low power consumption, and substantial compute power within compact package footprints, varying from 35,000 to 1 million logic elements. Specifically, the Ti375 model boasts a capacity of 375K logic elements.

Wirral, United Kingdom. LDRA released its domain-specific software productivity packages for the LDRA tool suite. With these packages, designers can simplify processes and reduce costs by replacing disparate traceability, software analysis, and compliance reporting tools with a unified solution. Tailored to meet the functional safety and security standards of embedded industries including aerospace, automotive, industrial controls, rail transportation, energy, consumer devices, and medical devices.

Lanner Electronics released its compact edge AI platform, the EAI-I133, engineered for edge AI facilitating AI inferencing in smart retail and spatial contexts. The fanless EAI-I133 delivers a broad range of connectivity options including 2x 2.5 GbE LAN ports, 1x GbE LAN port, 2x COM ports, and 4x USB 3.2 ports for efficacy in connectivity. Its compact form factor supports LTE, 5G Sub6, and WiFi wireless connectivity via M.2 slot expansion enabling versatile networking solutions.

Ceva, Inc. released Ceva-Waves Links, an innovative lineup of multi-protocol wireless platform IPs. The IPs are designed to support the most recent wireless standards, catering to the increasing demand for chips with enhanced connectivity features targeting Smart Edge devices in consumer IoT, Industrial, automotive, and personal computing.

Embedded Computing Design’s Road to embedded world will highlight a host of embedded suppliers who will be showcasing their latest products and technologies at embedded world, April 9th to 11th in Nuremberg, Germany. embedded world is the largest global gathering of its kind. Check back regularly to see where the Road to embedded world takes us.

Embedded Computing Design’s Road to embedded world will highlight a host of embedded suppliers who will be showcasing their latest products and technologies at embedded world, April 9th to 11th in Nuremberg, Germany. embedded world is the largest global gathering of its kind. Check back regularly to see where the Road to embedded world takes us.

Embedded Computing Design’s Road to embedded world will highlight a host of embedded suppliers who will be showcasing their latest products and technologies at embedded world, April 9th to 11th in Nuremberg, Germany. embedded world is the largest global gathering of its kind. Check back regularly to see where the Road to embedded world takes us.