Embedded Computing Design

Munich, Germany. Infineon Technologies is expanding its Edge AI portfolio with its DEEPCRAFT AI Suite, a comprehensive set of software, tools, and solutions that aid customers with seamless integration of AI into their products.

While attending embedded world North America, make sure to visit APLEX at Booth 9060, where the focus is on four major solution areas including Panel PCs, Stainless Steel Series, Edge Computing, and Button-Integrated Panel PC .

Infineon Technologies now supports the AI pupose 800 Volt direct current (VDC) power architecture announced by NVIDIA during Computex 2025. The move from 54 V data center power infrastructure to a centralized 800 VDC architecture enables reduced power losses, higher efficiency and reliability.

During embedded world North America 2025, Critical Link (Booth 3065) will showcase its MitySOM-A5E FPGA system on module (SoM) featuring Altera Agilex 5. The SoM offers up to 656KLE FPGA fabric, dual core ARM Cortex-A55 and Cortex-A76, 24 transceivers, dual banks of RAM, and a wide range of user-friendly interfaces. Available is an MitySOM-A5E Mini for size and budget constraints.

NEXCOM is participating in the embedded world North America 2025 exhibition taking place from November 4^th to 6^th at the Anaheim Convention Center in California. Centered around the theme, “Unleashing the Ingenuity of SD Edge Computing,” booth 6015 will showcase NEXCOM’s solutions in software-defined edge applications across two segments, AIoT Solutions and AI Computing.

ATTEND released its ISO 20860-1/2, SAE/USCAR-2, and USCAR-17 compliant FAKRA and Mini-FAKRA RF connector and cable assembly series designed for stable signal transmission in automotive telematics, ADAS, and industrial wireless systems.

Ynvisible plans to demonstrate how it is redefining what’s possible in the ultra-low-cost, ultra-low-power display industry at embedded world North America 2025. Ynvisible’s innovations extend beyond conventional displays. Its designs unlock new ways to visualize data, enhance user interaction, and embed intelligence into devices where traditional displays will not work.

Northern.tech, the leader in device lifecycle management (DLM), will attend embedded world North America 2025 as it showcases its latest innovations in its Mender for secure OTA update technology while also highlighting its expanded support for product fleets with mixed operating systems (OS), from embedded Linux to real-time operating systems (RTOS) including Zephyr.

Rohde & Schwarz is expanding its innovative MXO oscilloscope family with its new cost-effective compact four- and eight-channel MXO 3 series delivering fast and precise advanced MXO technology. The oscilloscope is said to enable engineers to see more of their device under test’s signal than any other instrument in its class.

The PC/104 Consortium has made the move to change its brand name to RMS Consortium. According to the press release, “RMS” signifies the support of Rugged, Modular, and Stackable computing solutions. The change better reflects the company’s objective of expanding its foundational technologies within defense, industrial, aerospace, transportation, and energy applications.

Upbeat Technology and SiFive, Inc. introduced the UP201/UP301 family MCU, a dual-core RISC-V microcontroller engineered for ultra-low power efficacy. The companies plan to exhibit the solutions at the upcoming RISC-V Summit in Santa Clara, California from October 22–23, 2025.

SINTRONES will be located at Booth 2029 during embedded world North America 2025. The company will exhibit its solutions designed for next-generation mobility and automation within its rugged-edge AI computer portfolio.

PQShield will be demonstrating its PQMicroLib (Booth 2078) at embedded world North America 2025. PQMicroLib-Core is a CAVP-Ready version of PQShield’s CMVP-certified PQCryptoLib-Core, designed for embedded systems running bare metal or with real-time operating systems.

Virscient will hold down Booth 2072 at this year’s embedded world North America where it will showcase its ultra-responsive Bluetooth for automotive suspension control, barrier-free Bluetooth Mesh access, and its low memory, low power wireless environmental monitoring solutions.

embedded world North America 2025 will be held during November 4-6, 2025 at the Anaheim Convention Center in Anaheim, California. There, at Booth 9054, Symage by Geisel Software will present its physics-based synthetic image datasets for training AI and computer vision models.

Visitors to embedded world North America can stop by Booth 8080 where ATTEND Technology will be demonstrating its high-speed modular board to board interconnects, FAKRA and Mini-FAKRA connectors, as well as its rugged sealed I/O connectors and cables.

ARBOR Technology introduced its rugged 23.8-inch fanless panel PC, the SP-241C-1N305, leveraging the Intel Core i3-N305 processor (8 cores, up to 3.8GHz) and is designed for industrial automation, smart manufacturing, and HMI applications. Featured are two 2.5GbE LAN ports powered by Intel I226-V controllers delivering quick and reliable network connectivity, ideal for multi-node communication and remote monitoring.

Teradyne, Inc. released its Titan HP system level test (SLT) platform developed explicitly for cloud infrastructure and artificial intelligence (AI) verticals. The solution aims to address the rising demands of modern technology as process nodes become smaller and new architectures emerge. SLT has become an integral part of the high-volume manufacturing process.

ARBOR Technology released its rugged ART10-ECA, a 10.1-inch industrial tablet PC powered by the Intel Twin Lake N150 processor and running Windows 11 IoT Enterprise 24H2 ideal for smart infrastructure and AI-integrated workflows.

MosChip Technologies announced MosChip AgenticSky, a suite of Agentic AI solutions developed to aid engineering teams with the next generation of adaptive, AI-led products across machines, devices, and edge platforms. AgenticSky is promoted as able to cut development cycles by up to 40% while embedding autonomy, adaptability, and trusted intelligence into components.