Embedded Computing Design

Review Display Systems (RDS) introduced a 21.5-inch TFT display module from Chefree Technology Corporation, the C23061500501-215H. The module boasts full HD resolution (1920 x 1080 pixels), a 16:9 wide aspect ratio, and vertical alignment (VA) mode display technology for enhanced optical performance and broad viewing angles.

The National Security Administration (NSA) announced that CDSG, provider of secure Data at Rest (DAR) storage solutions with its DIGISTOR secure storage drives, will be having its Citadel C Series Pre-Boot Authentication (PBA), powered by Cigent, on the Commercial Solutions for Classified (CSfC) storage component list.

Iridium Communications Inc. introduced Project Stardust, the next generation of its direct-to-device (D2D) strategy with 3GPP 5G standards-based Narrowband-Internet of Things (NB-IoT) Non-Terrestrial Network (NB-NTN) service development. The solution gives smartphone companies, OEMs, chipmakers, mobile network operators (MNO) and related IoT developers ability to meet specific needs within the Iridium network of satellites.

Stuttgart, Germany. Vector introduced its new high availibility MICROSAR compatible ISO 26262 certified software solution. MICROSAR combined with the software upgrade proves to be reliable in autonomous driving and x-by-wire systems. For demanding autonomous driving applications, MICROSAR High Availability assures a deterministic Worst Case Execution Time (WCET).

FRAMOS introduced FSM:GO, an innovative catalogue of optical sensor modules for AI and ML applications consisting of pre-selected sensors combined with specialized lenses for an out-of-box solution. Modules are delivered with a complete set of hardware components, software, ISP tuning, and full documentation to easily integrate within platforms including NVIDIA’s Jetson and NXP i.MX8MP.

Sundance Multiprocessor Technology Ltd. released its SoM1-SoC, a Microchip PolarFire SoC FPGA powered system-on-module utilizing a 64-bit Linux-capable RISC-V processor. According to the company, the heart of SoM1-SoC is the MPFS460T-1FCVG1152E device leveraging 461K logic cells, 20 high-speed transceivers, two PCIe hard blocks, 136 MSS IOs, 180 HSIO, and 288 GPIOs.

Cincoze continues to enhance its portfolio with its P2202 and P1201 platforms ideal for mobile applications such as AGV/AMR, control cabinets, and limited space applications . Cincoze's unique one computer with two purposes function has been a standout feature leveraging CDS (Convertible Display System) technology to seamlessly transition between slim embedded computers and versatile panel PCs.

Microchip Technology launched its MCP998x family of automotive-qualified remote temperature sensors. The sensors are designed to provide 1°C accuracy over a wide operational temperature range. Within the family are five sensors equipped with shutdown temperature setpoints that are resistant to exploitation.

Dirac and BlackBerry Limited are now integrating Dirac’s Opteo and Virtuo software plug-in optimization solutions into BlackBerry's QNX Sound enabling audio engineers a platform to design next-generation of in-vehicle audio experiences for the consumer. According to Dirac, the automotive industry can utilize pre-integrated and pre-tested technologies to consolidate all audio and acoustic functions within complete automotive families.

 

The last time we spoke with Sandi Habinc, General Manager, and Jan Andersson, Director of Engineering at Frontgrade Gaisler, we were discussing the TRISAT-R CubeSat and Gaisler’s use of RISC-V’s open standard instruction set architecture within its space deployment.

Espoo, Finland. Qt Group is now integrating its graphics platform into Infineon’s graphics-enabled TRAVEO T2G Cluster microcontrollers for high framerate and full HD quality. “With their efficient design and development workflow, not to mention over 30 years’ production history across verticals, Qt’s technology has delivered us the tools to develop and deploy UI applications more seamlessly than ever," says Ralf Ködel, Vice President Microcontrollers at Infineon Technologies AG.  

Tel Aviv, Israel. Deci is teaming up with Qualcomm Technologies, Inc. to pioneer Generative Artificial Intelligence (AI) models designed for the Qualcomm Cloud AI 100. The companies hope to make AI available for numerous AI-powered applications and democratize AI technology for all. Deci and Qualcomm Technologies will introduce two models, the DeciCoder-6B and DeciDiffusion 2.0, developed on Deci’s Neural Architecture Search Technology, AutoNAC.

Sunnyvale, California and Pittsburgh, Pennsylvania. Synopsys has announced it will obtain Ansys and combine its semiconductor electronic design automation (EDA) with Ansys' broad simulation and analysis portfolio. "The megatrends of AI, silicon proliferation and software-defined systems are requiring more compute performance and efficiency in the face of growing, systemic complexity. Bringing together Synopsys' industry-leading EDA solutions with Ansys' world-class simulation and analysis capabilities will enable us to deliver a holistic, powerful and seamlessly integrated silicon to systems approach to innovation to help maximize the capabilities of technology R&D teams across a broad range of industries," said Sassine Ghazi, President and CEO of Synopsys.

PEAK-System has introduced a sensor with CAN FD connection. The PCAN-GPS FD I/O module was developed to detect position, orientation, and acceleration. The solution is capable of connecting via a CAN connection that supports both CAN FD standard and classic CAN.
 

While exhibiting at CES 2024 NXP Semiconductors highlighted its SAF86x radar SoC (System-on-Chip), a solution to easily combine radar transceivers, multi-core radar processor, and a MACsec hardware engine connected by Automotive Ethernet for software-defined radar. Low-level sensor data is transmitted up to 1 Gbit/s. According to NXP, the SoC gives car manufacturers the ability to optimize next-generation ADAS partitioning for software-defined vehicles, while providing for a smooth transition to new architectures and features utilizing Over-the-Air (OTA) updates.

Vecow Co., Ltd disclosed its edge ready GPU-accelerated server-grade platform featuring a 16-core Intel Xeon D-2876NT processor, 8 DDR4 UDIMM/RDIMM 2933 MHz, and up to 512GB. Intel’s QuickAssist Technology facilitates optimization with high-speed interfaces such as PCIe 4.0, SATA 3.0, USB 3.0, and 10GigE LAN. The ICS-1000 is ideal for edge AI applications such as autonomous driving, robotic control, public security, medical imaging, and private 5G networks.

Las Vegas, Nevada. While exhibiting at CES 2024, MicroEJ will reveal the MICROEJ VEE (Virtual Execution Environment) based VEE Wear operating system (OS) for wearables. Located in booth #52739 in the Venetian Expo, MicroEJ will demonstrate the OS’s ability to run cost and power efficient microcontrollers and microprocessors. “Based on tiny software containers, the essence of VEE Wear is to create an ultra-low footprint operating system that reshapes the way wearable products are developed,” said Dr. Fred Rivard, CEO, MicroEJ.

Las Vegas, Nevada. “We envision the industrial metaverse as a virtual world that is nearly indistinguishable from reality, enabling people — along with AI — to collaborate in real time to address real-world challenges,” stated Siemens CEO Roland Busch.

Itasca, Illinois. During CES 2024, Knowles will showcase its audio and voice technologies while located in the Venetian Resort Toscana at Suite #3805. Demonstrations will include True Wireless Stereo (TWS), hearing health, automotive, wearables, and its balanced armature (BA) drivers that are currently integrated within products such as Edifier NeoBuds Pro 2, Razer’s Moray in-ear monitor (IEM), and the JLab Epic Lab Edition earbuds.

Las Vegas, Nevada / Reutlingen, Germany. Bosch will unveil its new BHI380 Smart Connected Sensors platform at CES 2024 where it will be demonstrating at booth #17207. The solution enhances motion tracking applications with hardware, software, and ready-to-use wearable reference designs. Available is up to eight Bluetooth connected sensor nodes for movement assessments in rehab, sports/fitness, and gaming.