Embedded Computing Design

Latent AI and Wind River, an Aptiv company, will partner to offer artificial intelligence competences to real-time edge platforms driving mission-critical infrastructure including secure and certifiable workflows from model training to deployment across various markets. The partnership combines Wind River’s VxWorks, Wind River Linux, and eLxr Pro, with Latent AI Efficient Inference Platform (LEIP).

Malvern, Pennsylvania. Vishay Intertechnology, Inc. announced a new family of Class 1 radial-leaded high voltage single-layer ceramic disc capacitors providing a low dissipation factor (DF) and DC bias for industrial and medical markets.

 

Leankon announced its monopole antenna, the LK1810601, a flexible printed circuit (FPC) antenna designed for space constrained components measuring just 15.0 mm x 6.0 mm x 0.1 mm. It utilizes a coupling feed technology to support tri-band WiFi operation across 2.4-2.5 GHz, 5.15-5.85 GHz, and 5.925-7.125 GHz. Leankon's coupling feed technology enhances electromagnetic coupling, guaranteeing high performance and low loss.

Cupertino, California. Efinix has doubled its Titanium family of FPGAs built on TSMC’s 16/12nm process accelerating data analysis and enabling real-time decision for AI applications. The expansion offers high-speed transceiver speeds up to 25.8 Gbps, 64-bit RISC-V processor SoCs, and improved MIPI speeds.

Scintil Photonics published the close of a $58 million (€50M) Series B funding round directed by Yotta Capital Partners and NGP Capital, with involvement from NVIDIA. Added is new participation from BNP Paribas Développement, along with current stakeholders including Supernova Invest, Bpifrance Digital Venture, Innovacom, Bosch Ventures, and Applied Ventures ITIC Innovation Fund (AVITIC).

IMAGO Technologies released its compact, fanless Vision Box AGE-X6, modular, expandable industrial PCs powered by the latest 14th-generation Intel Core embedded processors. The platform allows flexible connections of external GPUs, high-speed storage, or high-performance cameras utilizing four USB4 interfaces with up to 40 Gbit/s per channel. Users can now easily scale computing power without changing the base system, cabling, or existing certifications.

 

Taipei, Taiwan. IBASE Technology Inc. presents the MPT-7100R railway computer system engineered for the rigorous demands of modern rail transportation. Powered by the 13th Gen Intel Core U‑series processor running up to 3.0 GHz, the MPT-7100R delivers enhanced multi-threaded performance. It is certified EN50155 (2021) and EN45545-2, confirming railway-grade reliability, operational safety, and fire protection in mission-critical applications.

Atlanta, Georgia. embedded world North America (ewNA) is returning for its second year, this time in Anaheim, California at the Anaheim Convention Center from November 4–6, 2025. ewNA is building on its successful debut and will again serve as the preeminent meeting place for the embedded technology community in North America.

Smart Sensor Devices introduced BleuIO, a Renesas SOC based Bluetooth low energy USB dongle used to develop new BLE applications. Customers can utilize the AT Commands offered on the device or use the Python/Javascript libraries for rapid design. It permits field or boot upgrades while applications are stored on FLASH memory as well as custom settings or OTP.

Akasa introduced a range of industrial closed-loop and open-loop liquid coolers, designed for AI, servers, data centers, and other high-performance computing (HPC) applications allowing customization for precise design necessities, with various radiator profiles, cold plate options, and socket configurations offered. The liquid coolers support Intel Xeon and AMD EPYC processors up to 750W TDP.

aicas released its new EdgeSuite, a modular, edge-to-cloud infrastructure developed to combine software, data, and AI model management. When utilizing EdgeSuite, engineers can scale AI solutions from testing to production while continuously advancing system performance through maintaining complete control of edge processes.

Taipei, Taiwan. APLEX Technology Inc. introduced its fanless Intel Core Ultra 5/7 processor powered AiTRON-9E series, an ultra-slim HMI solution combining a rugged design with an edge-to-edge front bezel for AI-driven intelligence. The integrated Intel Arc GPU features the new Xe-core as well as an NPU for AI-accelerated computing allowing high-performance graphics, intelligent analytics, and real-time AI applications. DDR5-5600MHz SO-DIMM memory is supported up to 32GB with M.2 2280 storage.

Woodcliff Lake, New Jersey. CAST recently announced that its TSN Switch IP core is now integrated by RANiX Inc.’s new automotive Integrated Micro Flat Antenna System (IMFAS) system on chip (SoC). The IMFAS SoC operates a multi-element antenna array through synchronizing the wireless signals required for smart vehicles, including the 5G, WiFi, GNSS/GPS, BLE, and UWB protocols by securely and proficiently routing them to a central processing unit through the in-vehicle Ethernet network.

Akasa announced that its Turing RC Pro, Maxwell RC Pro, Pascal RC, Newton RC, and Plato RC cases now support ASUS NUC 15 Pro motherboards with its Thermal Design Point (TDP). The ASUS NUC 15 Pro is an AI-enabled mini-PC powered by Intel Core Ultra processors (Series 2) and when combined with an Akasa fanless cases, is ideal for AI development, edge computing, digital content creation, and enterprise applications.

Linz, Austria. Candera has announced that its HMI design software, Candera CGI Studio, now supports the new AM62P automotive-grade SoC from Texas Instruments (TI). OEMs and Tier-1 suppliers can design and validate enhanced graphical user interfaces for applications including digital clusters and infotainment systems. The Arm-based TI AM62P delivers a 3D GPU, 4K video codec, and real-time capable MCU cores.

CameMake has announced that its camera-module families are now available from DigiKey and TOP-electronics. CameMake’s Raspberry Pi 5 and NVIDIA Jetson Orin modules integrate voltage level shifters and a matched crystal directly on the FPC connecting to native 22-pin and 0.5-mm CSI-2 headers.

Antenova Ltd. released its surface mounted Opaca (SR4L104) cellular antenna, operating in band 71 (617 – 698 MHz) utilized by T-Mobile in the United States. It measures 38 x 10 x 3.3 mm and needs 657 sq mm clearance. Depending on band, the Opaca maintains high performance across a range of 37.1 percent to 77.8 percent.

The partnership between u-blox and Nordian has grown to now include PointPerfect Flex (PPP-RTK) centimeter-level correction services across Argentina and Paraguay, expanding on its current coverage in Brazil.

 

Sunnyvale, California. Synopsys introduced the expansion of its Synopsys.ai Copilot generative AI (GenAI) abilities utilized in semiconductor design solutions supporting complex designs with an acceleration to production. As mentioned in the press release, the expanded Synopsys.ai Copilot assistive and creative capabilities are already in use by early access customers and demonstrate sufficient design quality and engineer productivity gains.

WEROCK Technologies released the Rocktab U212 Pro, an 11.6" HD display handheld leveraging a 13th generation Intel Core i5 processor Intel UHD Graphics,16 GB of RAM, and up to 2 TB of internal storage designed for technical field service, construction planning, or industrial maintenance applications.