Embedded Computing Design

During embedded world North America, AAEON will exhibit its portfolio of pioneering AI solutions designed to bring embedded AI projects to realization. The main highlight of the booth will be a demonstration combining AAEON’s EPIC-RPS9 and MXM-ACMA. Visitors will witness the utilization of the 13th Generation Intel Core processing power of the EPIC-RPS9 with the MXM-ACMA’s Intel Arc GPU.

F S Elektronik Systeme has released its compact (35 x 40 mm) PicoCore MX93 leveraging the NXP i.MX 93 ARM CPU compatible with the PicoCore series such as the i.MX 8M Mini, i.MX 8M Nano, and i.MX 8M Plus CPUs. Featured is a scalable core complex with up to two ARM Cortex-A55 operating at up to 1.7 GHz, alongside an ARM Cortex-M33 core for real-time processing at 250 MHz. For high-temperature environments, the CPU functions up to 125°C.

Molex introduced its VaporConnect Optical Feedthrough Modules for two-phase immersion cooling delivering continuous increases in data center speed and capacity. The modules leverage a cassette-based design that simply bolts on immersion tanks and facilitates optical transceivers and network cabling infrastructure to be switched without modifying mechanical interfaces or impacting immersion tank architecture for generative AI and machine learning workflows.

Samtec experts will be attending embedded world North America 2024 in Austin October 8-10, 2024, showcasing its solutions for a new era in connectivity. Stop by Samtec’s booth (#2632) to connect with professionals who are driving standards development and advancing cutting-edge solutions for superior signal and power integrity implementation. According to Samtec, it offers the industry’s largest selection of board-to-board connectors such as high-speed mezzanine, ultra micro, edge card, backplane systems, and high-density array systems.

Qoitech introduced a new API for its Otii Product Suite, altering the way designers work with battery emulation. The API automates battery emulation, making it faster, easier, and more efficient to optimize battery life for IoT devices.

 

During embedded world North America, visit Booth 2517, where Connect Tech, an NVIDIA Elite Partner, will be exhibiting its innovative solutions for intelligent video analytics utilizing NVIDIA Metropolis running on its field-deployable Anvil Embedded System, leveraging the NVIDIA Jetson AGX Orin system-on-module (SOM) as well as many other edge AI solutions.

RuggON, an Ubiqconn company specializing in rugged mobile solutions, is participating in MINExpo 2024 from September 24th to 26th in Las Vegas, Nevada. RuggON’s innovative rugged tablets and mobile computing solutions will be exhibited at booth 3043.

Quebec City, Canada. Dimonoff has announced the expansion of its new IoT division, Amotus. It delivers a complete range of engineering services, such as electronic design, software development, and Platform as a Service (PaaS) solutions. Dimonoff acquired Amotus in 2018 unified both entities in 2021 to combine the brand image and standardize its service offering under the Dimonoff brand.

Quebec City, Canada. LeddarTech is pleased to join Ficosa at Autosens Europe in Barcelona from October 8-10, 2024. LeddarTech and Ficosa initially began a planned collaboration to design an innovative Intelligent Parking Assistance system in 2022. The result, in 2023, was the integration of LeddarTech’s LeddarVision software with Ficosa’s surround-view camera system and sensors such as radars, IMUs, and GPS.

Taipei, Taiwan. ASRock Industrial released its IMB-X1900 motherboard leveraging Intel Xeon W-3500/3400 and W-2500/2400 series processors combining progressive innovation with boosted processing power and AI acceleration.

Sophia Antipolis. France. Insight SiP introduced its ISP2454-MX module in an 8 x 8 x 1mm form factor and an operating temperature up to 105°C enabling it to support next generation Bluetooth based solutions such as Angle of Arrival and the new Bluetooth Channel Sounding technology. Centered around the Nordic nRF54L15, it delivers enhanced functioning across the board and is based on a 4th generation radio and a double speed microprocessor.

Kirkland, Washington. Alliance Memory increased its offerings of high-speed CMOS mobile low-power SDRAMs with a new single-channel 16Gb LPDDR4X device that enables low power ratings with improved clock speeds and data rates in the 200-ball FBGA package. Even with a low-voltage operation of 0.6V, the AS4C1G16MD4V-046BIN delivers boosted efficiency for extended battery life in portable electronics.

AAEON announced its collaboration with The Embedded Kit to offer a complete solution for the challenges facing industrial companies such as integration, maintenance, and cybersecurity. The partnership will provide a seamless and efficient design process by simplifying the complexities of software and hardware integration.  

Exascend will be located at Booth 1935 during this year’s embedded world North America highlighting its comprehensive storage solutions designed to withstand the rigors of the road, space, and industrial. From SSD modules to memory cards, these solutions ensure durability and reliability in challenging environments.

Stockholm, Sweden. Cppcheck Solutions announced that its Cppcheck Premium has earned TÜV SÜD certification complying with EN 50128, EN 50657, EN 50716, IEC 61508, and ISO 26262. It is deployed globally and utilized by millions for ease-of-use and powerful checkers with a combination of a strong focus on undefined behavior and zero false-positives.

Silicon Valley, California and Utrecht, The Netherlands. Silicon Catalyst revealed that TD Shepherd is now a new member of its In-Kind Partner ecosystem aiming to boost the support available to semiconductor startups to aid in innovation and growth.

Cincoze’s DIAMOND and GOLD product lines fully meet the extreme performance, reliability, and environmental adaptability requirements of edge AI applications in manufacturing and energy.

TQ Group will be demonstrating its solutions that support developers with their AI projects during embedded world North America (Booth 2029). Its modules are built on Intel, NXP, and Texas Instruments processors. The versatility of the product range covers various form factors and standards, enabling customers to find the most suitable approach with minimal restrictions on projects. TQ will highlight the TQMxCU1-HPCM, TQMa95xxSA/LA , and TQMa67xx.   

Enclustra is partnering with SGET to showcase the coin-sized Titan Pluto XZU20 at the SGET booth during this year’s inaugural embedded world North America. Gaël Paul, Vice President of Innovation at Enclustra commented, “The Pluto system-on-module series makes it easier than ever for device makers to leverage the benefits of FPGAs in compact, portable solutions, enabling limitless possibilities in remote monitoring, sensing, and industrial control applications.”

Syslogic is preparing to release its fanless railway computer, RML-R10, leveraging the 13th generation Intel Core i7 (Raptor Lake) processor highlighted with a hybrid architecture that combines performance and efficiency cores. The efficiency cores help reduce energy consumption by using minimal power when handling basic tasks. Additional features include PCIe 5.0, improved graphics performance, and hardware-level security features.