Embedded Computing Design

Wincomm released its WMP-19S/22S/24S portfolio of EN 60601-1 & 60601-1-2 compliant medical devices specifically for AI assisted diagnosis and hospital management. Graphics are provided by Nvidia’s MXM A4500/A2000/A1000 while the solution also delivers optional UPS battery, one PCIex4 expansion slot, video in (RGB color adjustment), and a GPI integrated capture card allowing quick image creation and beamforming.

PLS Development Tools will be attending embedded world 2024 where they will be located in Hall 4, Booth4-310. Its exhibitions will include platforms for simple and efficient debugging and run-time analysis of embedded software. A main focus at the booth will be discussions based around the safety and security in the automotive and industrial markets.

Conclusive Engineering released the RCHD-PF Orchid, its latest system on module (SoM) integrating a Microchip PolarFire SoC FPGA with a 667 MHz 5-core RISC-V processor ranging from 23K to 254K logic elements. The solution is ideal for computationally intense applications. Operating temperature is between -40 °C to 85 °C powered by a single 3.3V 12A in a 65x45 mm package.

A decade later, NEXCOM returns to the Embedded World 2024, stationed at Hall 5, Stand 5-253! As a distinguished global leader in edge computing and industrial IoT solutions, NEXCOM is set to showcase its cutting-edge software-defined embedded computing solutions through six vertical market pavilions: 5G Edge, Manufacturing X, Transportation AI, Smart Edge · Smart City, Software-Defined Edge Computing, and OT Cybersecurity.

Los Angeles, California. Premio Inc introduced its newest x86 single board computer powered by the 12th Generation of Intel’s Alder Lake-N processors. Utilizing the same Gracemont CPU architecture present in the Efficiency cores of 12th/13th Generation Intel Core CPUs, the Alder Lake-N platform exhibits improved performance over earlier Intel processors, achieving an increase of up to 28% and a 42% with the Core i3 N-Series processor.

Deggendorf, Germany. congatec is including the firmware integrated Hypervisor in all new x86 COMs aimed at streamlining real-time virtualization for system consolidation. The solution makes it easier to save money and reduce individual systems while also reducing size, weight, and power (SWaP).

SYSGO's RTOS PikeOS and hypervisor reached the highest-level of space safety standard ECSS-E-ST-40C (Category A) for the first time. PikeOS' hypervisor functionality combines heterogenous systems allowing for the design of mixed-critical platforms saving costs, space, energy, and weight. According to the company, flight control, gateway, and monitoring can safely and securely run simultaneously in time and space.

Hod Hasharon, Israel. Valens Semiconductor launched the VA700R Series delivering 4Gbps of bandwidth and link distances up to 40 meters/130 feet ideal for longer vehicles. "Valens Semiconductor's connectivity solutions are high-performance – and that doesn't just mean the highest bandwidth or the lower error rate – it also means the longest link distance," said Gideon Kedem, SVP and Head of Automotive Business at Valens Semiconductor.

Munich, Germany. TASKING released version v7.0r1 of the VX-Toolset for Arm architecture. Included is an Eclipse-based C/C++ compiler, assembler, and linker while also delivering integrated libraries for fast code integration. Safety is certified ISO 26262 up to ASIL D and supports ISO/IEC 9899:2018 (C17) standard.

SiLC Technologies, Inc. released the Eyeonic Vision System Mini (Eyeonic Mini), a new vision for LiDAR technology. The platform integrates a complete multi-channel FMCW LiDAR on a single silicon photonics chip and an integrated FMCW LiDAR System-on-Chip (SoC).

Review Display Systems (RDS) introduced a 21.5-inch TFT display module from Chefree Technology Corporation, the C23061500501-215H. The module boasts full HD resolution (1920 x 1080 pixels), a 16:9 wide aspect ratio, and vertical alignment (VA) mode display technology for enhanced optical performance and broad viewing angles.

The National Security Administration (NSA) announced that CDSG, provider of secure Data at Rest (DAR) storage solutions with its DIGISTOR secure storage drives, will be having its Citadel C Series Pre-Boot Authentication (PBA), powered by Cigent, on the Commercial Solutions for Classified (CSfC) storage component list.

Iridium Communications Inc. introduced Project Stardust, the next generation of its direct-to-device (D2D) strategy with 3GPP 5G standards-based Narrowband-Internet of Things (NB-IoT) Non-Terrestrial Network (NB-NTN) service development. The solution gives smartphone companies, OEMs, chipmakers, mobile network operators (MNO) and related IoT developers ability to meet specific needs within the Iridium network of satellites.

Stuttgart, Germany. Vector introduced its new high availibility MICROSAR compatible ISO 26262 certified software solution. MICROSAR combined with the software upgrade proves to be reliable in autonomous driving and x-by-wire systems. For demanding autonomous driving applications, MICROSAR High Availability assures a deterministic Worst Case Execution Time (WCET).

FRAMOS introduced FSM:GO, an innovative catalogue of optical sensor modules for AI and ML applications consisting of pre-selected sensors combined with specialized lenses for an out-of-box solution. Modules are delivered with a complete set of hardware components, software, ISP tuning, and full documentation to easily integrate within platforms including NVIDIA’s Jetson and NXP i.MX8MP.

Sundance Multiprocessor Technology Ltd. released its SoM1-SoC, a Microchip PolarFire SoC FPGA powered system-on-module utilizing a 64-bit Linux-capable RISC-V processor. According to the company, the heart of SoM1-SoC is the MPFS460T-1FCVG1152E device leveraging 461K logic cells, 20 high-speed transceivers, two PCIe hard blocks, 136 MSS IOs, 180 HSIO, and 288 GPIOs.

Cincoze continues to enhance its portfolio with its P2202 and P1201 platforms ideal for mobile applications such as AGV/AMR, control cabinets, and limited space applications . Cincoze's unique one computer with two purposes function has been a standout feature leveraging CDS (Convertible Display System) technology to seamlessly transition between slim embedded computers and versatile panel PCs.

Microchip Technology launched its MCP998x family of automotive-qualified remote temperature sensors. The sensors are designed to provide 1°C accuracy over a wide operational temperature range. Within the family are five sensors equipped with shutdown temperature setpoints that are resistant to exploitation.

Dirac and BlackBerry Limited are now integrating Dirac’s Opteo and Virtuo software plug-in optimization solutions into BlackBerry's QNX Sound enabling audio engineers a platform to design next-generation of in-vehicle audio experiences for the consumer. According to Dirac, the automotive industry can utilize pre-integrated and pre-tested technologies to consolidate all audio and acoustic functions within complete automotive families.

 

The last time we spoke with Sandi Habinc, General Manager, and Jan Andersson, Director of Engineering at Frontgrade Gaisler, we were discussing the TRISAT-R CubeSat and Gaisler’s use of RISC-V’s open standard instruction set architecture within its space deployment.