Embedded Computing Design

MosChip Technologies showcased its MosChip DigitalSky, a comprehensive suite of digital solutions innovating global enterprises into connected and intelligent entities, at embedded world North America. The suite offers IoT, Cloud, AI and GenAI, Application and Data Modernization, Security, Automation, and UX & Mobility support.

Wirepas mesh technology is designed for smart industry, smart city, and smart retail applications where communication challenges consists of noisy harsh environments. It overcomes the difficulties with a robust and self-healing mesh network. Stop by booth #1953 at embedded world North America if interested in industrial IoT, city planning, fire escape lighting, industrial sensors, or commercial building management technology.

Premio is attending embedded world North America and its experts will discuss what they have identified as critical challenges organizations encounter when deploying AI at the edge, and how its solutions meet those challenges. Highlights of Premio’s Booth #2133 will include the following trends: User Edge for Real-Time AI Inferencing, Localized AI for AGVs, AMRs, and Smart Manufacturing, AI-Driven Predictive Maintenance for Industrial Systems, Enhanced AI Capabilities through TPU Integration, and OT to IT Convergence for Industry 4.0 Computing.

ByteSnap Design announced a collaboration with Particle to innovate the development of efficient and scalable integrated IoT solutions utilizing ByteSnap Design’s proficiency in embedded systems development and Particle’s IoT infrastructure to provide optimized connectivity for automotive, healthcare, and smart cities.

NextComputing released its Nexus “Fly-Away Kit” that delivers multiple Ampere Altra servers for a total of 512 cores and a petabyte of storage. The kit has multiple system designs as well as a rolling operational hard case. Its multiple 2U or 1U systems (nodes) are fit into a 22" x 14" x 9" IATA and TSA approved rolling carry-on that suits overhead bins. Users receive Cloud Native, multi-node, and high bandwidth for robust edge AI and computing applications.

Secure-IC will be showcasing its innovative embedded cybersecurity solutions for applications such as IoT, Automotive, Factory Automation, or Server and Cloud at the inaugural embedded world North America 2024. Visit booth #1338 to view demonstrations how Secure-IC’s solutions can protect your devices and networks against vulnerabilities.

Taipei, Taiwan. Ubiqconn and its subsidiary, RuggON Technology Inc., will exhibit at embedded world North America 2024 (Booth #1733). Demonstrations will involve innovations in public safety, transportation, agriculture, mining, and industrial automation. Ubiqconn experts will discuss flexible embedded systems and SATCOM technologies.

Chatsworth, California and London, United Kingdom. Kigen and Monogoto launched the iSIM Evaluation Kit to test the efficiency of utilizing emerging iSIM technology in connected devices. iSIMs (integrated SIM) are integrated directly into modems eliminating friction caused by physical SIM cards. iSIMs eliminate the need for a physical SIM, simplifying the supply chain.

Austin, Texas. Mouser Electronics, Inc., is attending Embedded World North America 2024 where at Booth #2215, technical experts will hold lectures , panels, and opportunities for all to join in relevant discussions while demonstrating Mouser’s latest products, online tools, and technical information needed to accelerate your designs.

NEXCOM is attending embedded world North America where its booth (2505) will host the theme of "Unleashing the Ingenuity of Software-Defined Edge Computing" Demonstrations will include experts showing how developers can utilize software technologies of Edge AI IPCs and adapt hardware interfaces into software components. Experience the EdgeGPT SaaS in the academic and manufacturing use cases.

electronica will be held in Munich, Germany from November 12^th -15^th with 3,000 plus exhibitors from around the globe exhibiting the latest products and solutions. The show includes practice-oriented forums, conferences, and various special events. electronica will establish a universal platform for discourse innovating an “All Electric Society”, in which complete energy demand is covered by CO²-neutral electricity.

Visitors to embedded world North America should make at stop at American Portwell’s booth (1940) for a live exhibition of the WEBS-45J1 system running the Network Optix intelligent video management solution. The demonstration highlights the system’s abilities to manage complex video analytics and operational tasks for various surveillance and security scenarios.

Minneapolis, Minnesota. Digi International launched its future-proof Digi 360, a new subscription-based solution delivering ease-of-use, deployment visibility, and enhanced ROI for Digi cellular routers. Digi 360 includes flexible devices, software, and services enhanced to streamline development of IoT projects.

congatec will exhibit its extensive range of Computer-on-Modules (CoMs) at embedded world North America (Booth 2223) with innovations that include congatec’s novel aReady. strategy, new Intel Core Ultra processor-based modules with integrated AI, and further premieres based on new low-power high-performing x86 processor technology.

While visiting embedded world North America, make sure to stop by Star Lab's booth (1732) where it will discuss how simple it is to create a secure-by-default Yocto-based system with Star Lab's Kevlar Embedded Security. The Kevlar Embedded Security is a layered Linux security platform that helps deter IP theft and attain cyber resiliency for commercial embedded systems. 

Atsugi, Japan and Cambridge, United Kingdom. Sony Semiconductor Solutions Corporation (SSS) and Raspberry Pi Ltd revealed a collaboration developing the Raspberry Pi AI Camera leveraging SSS’s approx. 12.3 effective megapixel IMX500 intelligent vision sensor capable of on-chip AI image processing.

Taipei, Taiwan. Darveen Co., Ltd. revealed its 20 mm (0.79") thick RTC-I116 rugged tablet leveraging a 12th gen Intel Core i7/i5 processor and Intel Iris Xe graphics for high-performance processing of large amounts of data, images, and videos displaying on an 11.6-inch FHD (1920 x 1080) multi-touch screen with a brightness of up to 1,000 nits.

Join Edge Impulse at Embedded World North America to witness how it is transforming edge AI projects by empowering developers and ML engineers to build datasets (including with synthetic data), train models, and optimize libraries to run directly on device, from the smallest microcontrollers to gateways, with the latest neural accelerators (and everything in between).

During embedded world North America, AAEON will exhibit its portfolio of pioneering AI solutions designed to bring embedded AI projects to realization. The main highlight of the booth will be a demonstration combining AAEON’s EPIC-RPS9 and MXM-ACMA. Visitors will witness the utilization of the 13th Generation Intel Core processing power of the EPIC-RPS9 with the MXM-ACMA’s Intel Arc GPU.

F S Elektronik Systeme has released its compact (35 x 40 mm) PicoCore MX93 leveraging the NXP i.MX 93 ARM CPU compatible with the PicoCore series such as the i.MX 8M Mini, i.MX 8M Nano, and i.MX 8M Plus CPUs. Featured is a scalable core complex with up to two ARM Cortex-A55 operating at up to 1.7 GHz, alongside an ARM Cortex-M33 core for real-time processing at 250 MHz. For high-temperature environments, the CPU functions up to 125°C.