Embedded Computing Design

AAEON introduced the fanless embedded AI system, its BOXER-8651AI-PLUS leveraging either an 8GB or 16GB NVIDIA Jetson Orin NX module with Super Mode. The platform manages up to 157 TOPS of AI performance alongside NVIDIA Jetpack 6.2 support.

Axiomtek introduced its mBOX603 powered by 13th/12th Generation Intel Core processors (i3 to i9) including integrated high-speed DDR5 memory with ECC support. It is a medical edge platform engineered to accelerate AI-assisted diagnostics, imaging workflows, and real-time clinical operations while delivering the performance and stability required for CT/MRI reconstruction, EMR processing, and intelligent nursing applications.

albatron.ai launched its first embedded AI computing system, the TALO-25000, powered by the NVIDIA Jetson AGX Orin and engineered to deliver enhanced AI performance for mission-critical industrial applications. The system supports up to 275 TOPS AI performance utilizing Arm Cortex-A78AE CPU and Ampere GPU ideal for industrial automation and robotic intelligence.

Navitas Semiconductor and Cyient Semiconductors are collaborating to expand the proclivity of GaN technology in India and establish a complete end-to-end GaN ecosystem. Navitas Semiconductor and Cyient Semiconductors goal is to design GaN products, digital and mixed signal ICs, as wells as GaN based system modules. The target markets are India’s AI data centers, electric mobility, performance computing, energy grid infrastructure, and industrial electrification.

Toradex introduced two new Computer on Module (CoM) families, OSM and Lino. The additions extend Toradex’s portfolio with modules leveraging NXP i.MX 93 and i.MX 91 processors including models OSM iMX93, OSM iMX91, Lino iMX93, and Lino iMX91.

MosChip Technologies is now supporting EMASS’s RISC-V based ECS-DoT Edge AI System-on-Chip (SoC). It integrates dual neural accelerators and 4MB of on-chip memory. The SoC facilitates real-time, milliwatt-class inference for vision, audio, and sensor workloads without dependance on the cloud. The ultra-low-power chip provides always-on AI capabilities for drones, wearables, healthcare trackers, and industrial monitoring systems.

XELA Robotics announced it has integrated its uSkin sensors into a Tesollo DG-5F five-fingered human sized robotic hand with independent joint control. Due to the integration of XELA Robotics’ tactile sensors, the hand acquired a human-like sense of touch without changing its original size.

IBASE Technology Inc. introduced its MAF801 Edge AI platform powered by 14th/13th/12th Gen Intel Core processors offering dedicated GPU expansion slots to meet the computational demands of AI applications including industrial automation, machine vision, intelligent robotics, and high-density AIoT.

Solid Sands B.V. recently announced that it is acquiring Plum Hall technology and test suites. According to the company, the acquirement will allow Solid Sands the ability to extend its market value and open new corridors for growth while delivering innovative solutions.

AAEON introduced its COM-ARHC6, a COM Express Type 6 Compact Size module (95mm x 95mm) leveraging the Intel Core Ultra Processors (Series 2) platform (formerly Arrow Lake) including the Intel Core Ultra 9 Processor 285H, Intel Core Ultra 7 Processor 255H, and Intel Core Ultra 5 Processor 225H offering up to 99 TOPs of AI performance.

NEXCOM International and Stereolabs publicized a new partnership aiming to deliver cutting-edge AI vision solutions for B2B organizations across mobility, robotics, and industrial automation sectors. The collaboration will see the integration of Stereolabs’ ZED X series cameras with NEXCOM’s ATC series Edge AI computers.

Hilscher announced its latest embedded module, the comX 90, designed for next-generation communication interfaces utilized in industrial devices. Within a compact form factor, the module combines multiprotocol communication, integrated security functions, and IIoT capability.

iDEAL Semiconductor introduced its SuperQ MOSFET technology, a solution built to answer the challenge of critical safety and efficiency trade-off in high-voltage (72V and higher) battery management systems (BMS). According to the press release, the company promotes this new platform as having set a new industry benchmark for short-circuit withstand capability (SCWC), a fundamental safety metric for the BMS discharge switch.

Darveen expanded its DPC-9000 Series with the addition of its IP65-rated Intel Alder Lake-N N97 platform. The DPC-9000 Series delivers enhanced computing power, faster multitasking, and higher power efficiency ideal for real-time data acquisition, responsive touch interaction, and graphical interfaces.

SINTRONES Technology announced the renewal of its IRIS ISO 22163 (International Railway Industry Standard) certification and as a Taiwan Excellence Award 2026 winner for its edge AI rugged computer, the IBOX-650P-IP66.

During January 6–9, 2026 in Las Vegas, Nevada at CES, EMASS will exhibit its ECS-DoT system-on-chip (SoC). The SoC is considered a milliwatt-class, on-device AI platform designed to deliver always-on intelligence with ultra-low latency and reduced power consumption.

Wincomm will be present in Düsseldorf, Germany at MEDICA 2025 (Hall 12, Booth B25) showcasing its WMP-22U and WMP-24U mobile medical panel PCs. According to the company, the PCs promote its INNOVALUE campaign - Innovation with Value, redefining mobility, intelligence, and hygiene in modern healthcare environments. Both leverage the latest Intel Core Ultra 225U/255U processors with integrated CPU/NPU/GPU architecture.

CES 2026 will welcome Dr. Lisa Su, Chair and CEO of AMD, as a keynote speaker. Taking place Monday, January 5^th at 6:30p.m., Dr. Su’s address will focus on AMD’s vision for delivering future AI solutions from cloud to enterprise, edge and devices.

CES 2026 welcomes Joe Creed, Caterpillar CEO, as a keynote speaker offering insights on how Caterpillar has stayed relevant for 100 years, and how he envisions the next 100. “CES is where innovators show up and bold ideas come to life,” said Gary Shapiro, CEO and Vice Chair, CTA. “I’m thrilled to welcome CEO Joe Creed and Caterpillar to the CES keynote stage to show how technology is transforming the way we build.”

Through three days (November 4-6), the Anaheim Convention Center hosted embedded world North America bringing together design engineers, developers, and technology leaders to share and showcase insights and innovations that are moving the embedded industry toward new horizons.