Embedded Computing Design

Munich, Germany. Infineon Technologies AG introduced its ModusToolbox Power Suite, a complete software platform for digital power conversion designs based on PSOC Control C3 microcontrollers (MCUs). Included are easy-to-use power conversion libraries, graphical user interfaces (GUIs), visualization tools, and application examples.

At embedded world Germany, Ellisys and Metirionic will collaborate to demonstrate tools and innovations giving designers the ability to evaluate Bluetooth Channel Sounding features and functionalities. Debutting will be an exhibit that combines Metirionic Advanced Ranging Stack (MARS) with the Ellisys Bluetooth Vanguard Advanced Bluetooth Analysis System.

NEXCOM will introduce its tough multi-purpose APPC C21-01 series fanless panel PCs built to meet the growing demands of AI-enabled edge computing and smart factory environments at embedded world Germany. NEXCOM’s booth (Hall 3, Booth 3-341) will display live demos of products focusing on the motto “Unleashing the Ingenuity of Software-Defined Edge Computing”, to emphasize the transformative potential of SD Edge Computing across AIoT and AI applications. The APPC C21-01 series acts as a high-performance bridge between industrial automation and intelligent data processing.

As part of Automate 2026, being held between June 22-25 at McCormick Place, Chicago, will be the third annual Humanoid Robot Forum. Automate also will introduce a dedicated Humanoid Robot Pavilion on the show floor, sponsored by NVIDIA.

ADLINK Technology Inc. will exhibit its edge AI portfolio at embedded world Germany (Hall 3, Booth 3-147) under the theme “Leading Edge AI Computing.” ADLINK’s highlights will include a unified edge AI architecture in a range of form factors such as COM modules and industrial motherboards to embedded systems, workstation-class GPU servers, and modular MXM and PEG GPU acceleration.

During embedded world Germany, congatec will exhibit its latest innovations in application-ready platforms while located at Hall 3, Booth 241. congatec is "going bigger" following an investment in JUMPtec (the former module business of Kontron AG) that expands its portfolio to even more modules, application examples, and services.

embedded world Germany will have SAPPHIRE Technology (Booth 324) showcasing its portfolio of embedded and commercial computing platforms powered by AMD Embedded+ architecture. Available demonstrations will showcase how its heterogeneous computing is reshaping modern edge system designs.

Wincomm released the WMP-22T-PIS-L and WMP-24T-PIS-L, a 21.5” and 23.8” medical All-in-One PC designed for operating rooms (OR) and critical healthcare environments. The WMP-22T/24T-PIS-L series combines an advanced fanless design with a built-in power supply in an anti-bacteria aluminum housing weighing just 7.8 and 8.6 kg.

To demonstrate the benefits of its advanced Non-Volatile Memory (NVM) innovations, Weebit will be located at Hall 4, Booth 4-658 during embedded world Germany with live edge AI demos on silicon with its integrated ReRAM.

Visitors can find MSI IPC at Hall 3-439 at embedded world Germany during March 10 to 12, 2026. MSI IPC will showcase its Edge AI computing innovations via live demonstrations designed for real world industrial and commercial applications.

Visitors to BIWIN’s booth (#1-140) at embedded world Germany will see the ePoP5X that combines LPDDR5X DRAM and eMMC storage into a single package, all facilitated by BIWIN's innovative multi-die stacking, ultra-thin die processing, and heterogeneous multi-chip integration technologies.

During its exhibition at embedded world Germany, EMASS (Hall 4, Booth 4-483) will have application specific demonstrations with its ECS-DoT system-on-chip (SoC), a milliwatt-class, on-device AI platform designed for always-on intelligence, ultra-low latency, and reduced power consumption. Demos will highlight how ECS-DoT enables continuous sensing, inference, and decision-making directly on-device, without reliance on the cloud or regular battery replacement.

Visitors to Booth 4-462 at embedded world Germany will get to view demonstrations from Ceva showcasing its AI Fabric, a unified foundation of connectivity, sensing, and inference IP that powers intelligent, autonomous edge systems. The integrated architecture facilitates scalable, power-efficient Physical AI across consumer, industrial, automotive, and infrastructure applications.

Fürth, Germany. Solectrix will introduce its proFRAME Base Board 3.1 PXIe for the PXI Express standard at this year’s embedded world in Germany. The solution is a 3U module using the PXI Express Gen 3 x8 bus with support for streamlined integration into National Instruments’ LabVIEW platform into current systems.

According to AntennaWare, during embedded world Germany (Hall 3, Booth 3-423), the company will launch the first viable low-profile alternative to monopole antennas for Sub-GHz (868/915 MHz) applications thereby eliminating the trade-off between form factor and performance.

PQShield (Booth 4-378) will attend embedded world Germany to showcase its post-quantum cryptography for embedded hardware including its quantum-safe secure boot, side-channel protection against physical attack, and PQC-secure TLS.

During its stay at embedded world Germany 2026, BIWIN Storage Technology Co., Ltd. (BIWIN) will be in Booth 1-140 demonstrating its BIWIN TAU208 UFS 3.1 automotive-grade storage designed for performance and reliability in harsh environments.

Munich, Germany. TASKING acquired LDRA last year, and on its first anniversary of the procurement, has announced its TASKING toolchain. By effectively integrating LDRA and TASKING competences, the toolchain delivers complete end-to-end compile, debug, and test capabilities.  With the help of AI, the solution fast-tracks the development of real-time embedded systems with built-in safety and security in automotive, aerospace and defense, industrial, and robotics.

Circuit Mind published independent, data-supported research revealing AI-powered automation is driving measurable gains in electronics design workflows. Contained within is a peer-reviewed assessment by Los Alamos National Laboratory, as well as commercial engineering teams utilizing AI to speed up circuit architecture innovation, schematic generation, and initial verification.

Vecow will attend embedded world Germany and invites visitors to Hall 3, Stand 3-259 to see its Edge AI demonstrations under the theme "Powering the Future of Intelligence". On display will be high-performing AI engines driven by the latest Intel, NVIDIA, and Qualcomm technology.