Embedded Computing Design

Ynvisible plans to demonstrate how it is redefining what’s possible in the ultra-low-cost, ultra-low-power display industry at embedded world North America 2025. Ynvisible’s innovations extend beyond conventional displays. Its designs unlock new ways to visualize data, enhance user interaction, and embed intelligence into devices where traditional displays will not work.

Northern.tech, the leader in device lifecycle management (DLM), will attend embedded world North America 2025 as it showcases its latest innovations in its Mender for secure OTA update technology while also highlighting its expanded support for product fleets with mixed operating systems (OS), from embedded Linux to real-time operating systems (RTOS) including Zephyr.

Rohde & Schwarz is expanding its innovative MXO oscilloscope family with its new cost-effective compact four- and eight-channel MXO 3 series delivering fast and precise advanced MXO technology. The oscilloscope is said to enable engineers to see more of their device under test’s signal than any other instrument in its class.

The PC/104 Consortium has made the move to change its brand name to RMS Consortium. According to the press release, “RMS” signifies the support of Rugged, Modular, and Stackable computing solutions. The change better reflects the company’s objective of expanding its foundational technologies within defense, industrial, aerospace, transportation, and energy applications.

Upbeat Technology and SiFive, Inc. introduced the UP201/UP301 family MCU, a dual-core RISC-V microcontroller engineered for ultra-low power efficacy. The companies plan to exhibit the solutions at the upcoming RISC-V Summit in Santa Clara, California from October 22–23, 2025.

SINTRONES will be located at Booth 2029 during embedded world North America 2025. The company will exhibit its solutions designed for next-generation mobility and automation within its rugged-edge AI computer portfolio.

PQShield will be demonstrating its PQMicroLib (Booth 2078) at embedded world North America 2025. PQMicroLib-Core is a CAVP-Ready version of PQShield’s CMVP-certified PQCryptoLib-Core, designed for embedded systems running bare metal or with real-time operating systems.

Virscient will hold down Booth 2072 at this year’s embedded world North America where it will showcase its ultra-responsive Bluetooth for automotive suspension control, barrier-free Bluetooth Mesh access, and its low memory, low power wireless environmental monitoring solutions.

embedded world North America 2025 will be held during November 4-6, 2025 at the Anaheim Convention Center in Anaheim, California. There, at Booth 9054, Symage by Geisel Software will present its physics-based synthetic image datasets for training AI and computer vision models.

Visitors to embedded world North America can stop by Booth 8080 where ATTEND Technology will be demonstrating its high-speed modular board to board interconnects, FAKRA and Mini-FAKRA connectors, as well as its rugged sealed I/O connectors and cables.

ARBOR Technology introduced its rugged 23.8-inch fanless panel PC, the SP-241C-1N305, leveraging the Intel Core i3-N305 processor (8 cores, up to 3.8GHz) and is designed for industrial automation, smart manufacturing, and HMI applications. Featured are two 2.5GbE LAN ports powered by Intel I226-V controllers delivering quick and reliable network connectivity, ideal for multi-node communication and remote monitoring.

Teradyne, Inc. released its Titan HP system level test (SLT) platform developed explicitly for cloud infrastructure and artificial intelligence (AI) verticals. The solution aims to address the rising demands of modern technology as process nodes become smaller and new architectures emerge. SLT has become an integral part of the high-volume manufacturing process.

ARBOR Technology released its rugged ART10-ECA, a 10.1-inch industrial tablet PC powered by the Intel Twin Lake N150 processor and running Windows 11 IoT Enterprise 24H2 ideal for smart infrastructure and AI-integrated workflows.

MosChip Technologies announced MosChip AgenticSky, a suite of Agentic AI solutions developed to aid engineering teams with the next generation of adaptive, AI-led products across machines, devices, and edge platforms. AgenticSky is promoted as able to cut development cycles by up to 40% while embedding autonomy, adaptability, and trusted intelligence into components.

embedded world North America will host the professionals in debugging, tracing, and testing at the PLS Development Tools Booth (number 2043) where it will be highlighting its UDE Universal Debug Engine. The UDE is an easy-to-use tool for software debugging, tracing, and testing for multicore microcontrollers and embedded processors from Infineon, NXP, STMicroelectronics, Renesas, Texas Instruments, Synopsys, and more.

Taipei, Taiwan. APLEX Technology Inc. released its AVS-553 edge AI platform leveraging 13th/14th Gen. Intel Core i processors with expandable GPU and I/O including eight USB 3.2 Gen2 Type-A, six COM (including 2 optional), four 2.5G LAN for internet connectivity, eight GPIO, one DP, and one HDMI output supporting up to 8K resolution. Expansion options include Wi-Fi via one Mini PCIe and 4G/5G connectivity via one M.2 B-Key.

Aetina released its Nvidia Jetson Thor plug-and-play preview kit featuring NVIDIA Jetson T5000, a thermal chassis base, intuitive I/O access to accelerate setup, development, and POC validation, in one solution. The kit is ideal for AI development from humanoids to intelligent edge devices. It is powered by up to 2,070 FP4 TFLOPS with 128GB LPDDR5X.

Nuremberg, Germany. Radiflow introduced the Radiflow360, an AI-boosted OT cybersecurity platform. It streamlines compliance, accelerates incident response, and easily co-exists with other Radiflow and third-party tools, delivering a scalable, unified approach to OT cybersecurity.

Qualcomm Technologies, Inc. released information that it is in an agreement to acquire Arduino, an open-source hardware and software company extending  Qualcomm Technologies’ strategy of enabling designers with access to its extensive portfolio of edge technologies and products. The acquisition follows Qualcomm’s latest integrations of both Edge Impulse and Foundries.io, allowing the availability of a full-stack edge platform that spans hardware, software, and cloud services. As with any acquisition, the closing is subject to regulatory approval and conditions.

Munich, Germany. Infineon Technologies AG released its AIROC CYW5591x Connected Microcontroller (MCU) product family integrating long-range Wi-Fi 6/6E and Bluetooth Low Energy 5.4 along with a secured adaptable MCU enabling designers innovating smart home, industrial, wearables, and other IoT applications.