Embedded Computing Design

Bicker Elektronik GmbH released its DC300WS, a contact-cooled 300W DC/DC converter with up to 98 percent competence supporting a variety of inputs from 6 to 36VDC. It is ideal for mobile applications with 12- or 24-volt vehicle systems, as well as for industrial applications hindered by instabilities in DC supply voltage. Output includes choices between DC voltages of 12V, 19V, or 24V.

Syslogic introduced its rugged IP67 and IP69 rated RPC RSL 83 powered by a quad-core Intel Atom x7433RE processor (Amston Lake). Thanks to the addition of “Turbo Boost”, the RPC RSL 83 attains enhanced clock speeds juxtaposed to the RSL 82, despite a lower base frequency. When combined with Syslogic’s smart passive cooling design, the platform is ideal for continuous operation in a variety of temperature ranges.

 

During October 22–23, 2025, RISC-V International will host the RISC-V Summit North America 2025 at the Santa Clara Convention Center where industry leaders, researchers, and designers will come together to advance the open standard ISA.  

QA Systems released Cantata 25.07, the newest version of its unit and integration testing tool for C/C++ delivering extended platform support, efficiency features, and certification for the EN 50716:2023 railway software standard.

Bangalore, India. Ambient Scientific released its GPX10 Pro system-on-chip (SoC) utilizing advanced AI-native silicon technology to empower enhanced AI inference on battery-powered edge devices. Its AI engine allows various neural networking model types, including CNNs, RNNs, LSTMs and GRUs, locally at the edge. The GPX10 Pro is built on Ambient Scientific’s proprietary DigAn silicon architecture offering up to 100x improvements in power, performance and area compared to conventional 32-bit microcontrollers.

Taipei, Taiwan. IBASE Technology Inc. launched its IBR500, a RISC-based 3.5″ single board computer (SBC) leveraging the MediaTek Genio 700 (MT8390) or Genio 510 (MT8370) processors, with speeds of up to 2.2 GHz. Integrated is 4GB or 8GB LPDDR4 memory and 64GB or 128GB eMMC storage in a compact 3.5″ form factor.

AAEON's UP brand is collaborating with Axelera AI to introduce the compatibility between Axelera’s Metis M.2 AI Inference Acceleration Card and AAEON’s new UP Squared Pro TWL and UP Xtreme ARL, powered by the Intel Core Processor N-series (formerly Twin Lake) and Intel Core Ultra (formerly Arrow Lake) platforms.

Wrocław, Poland. Grinn has announced a partnership with MediaTek extending the employment of AI and IoT technologies based on its off-the-shelf embedded computing platforms. The collaboration will see the creation of a series of systems-on-module (SOMs) created on the MediaTek Genio 700 and Genio 510 application processors.

EMASS, a Nanoveu subsidiary, revealed the ECS-DoT, its edge AI system-on-chip (SoC) enabling always-on, milliWatt-scale intelligence with no need for cloud-based processing thereby reducing latency and power consumption. The ECS-DoT offers four megabytes of on-board SRAM, allowing efficient AI computations on edge and IoT devices.

During embedded world North America, Emproof (Booth 7076) will highlight how embedded developers and manufacturers can protect their binaries from would be attackers without the need for redesigns, source code access, or hardware changes.

Latent AI and Wind River, an Aptiv company, will partner to offer artificial intelligence competences to real-time edge platforms driving mission-critical infrastructure including secure and certifiable workflows from model training to deployment across various markets. The partnership combines Wind River’s VxWorks, Wind River Linux, and eLxr Pro, with Latent AI Efficient Inference Platform (LEIP).

Malvern, Pennsylvania. Vishay Intertechnology, Inc. announced a new family of Class 1 radial-leaded high voltage single-layer ceramic disc capacitors providing a low dissipation factor (DF) and DC bias for industrial and medical markets.

 

Leankon announced its monopole antenna, the LK1810601, a flexible printed circuit (FPC) antenna designed for space constrained components measuring just 15.0 mm x 6.0 mm x 0.1 mm. It utilizes a coupling feed technology to support tri-band WiFi operation across 2.4-2.5 GHz, 5.15-5.85 GHz, and 5.925-7.125 GHz. Leankon's coupling feed technology enhances electromagnetic coupling, guaranteeing high performance and low loss.

Cupertino, California. Efinix has doubled its Titanium family of FPGAs built on TSMC’s 16/12nm process accelerating data analysis and enabling real-time decision for AI applications. The expansion offers high-speed transceiver speeds up to 25.8 Gbps, 64-bit RISC-V processor SoCs, and improved MIPI speeds.

Scintil Photonics published the close of a $58 million (€50M) Series B funding round directed by Yotta Capital Partners and NGP Capital, with involvement from NVIDIA. Added is new participation from BNP Paribas Développement, along with current stakeholders including Supernova Invest, Bpifrance Digital Venture, Innovacom, Bosch Ventures, and Applied Ventures ITIC Innovation Fund (AVITIC).

IMAGO Technologies released its compact, fanless Vision Box AGE-X6, modular, expandable industrial PCs powered by the latest 14th-generation Intel Core embedded processors. The platform allows flexible connections of external GPUs, high-speed storage, or high-performance cameras utilizing four USB4 interfaces with up to 40 Gbit/s per channel. Users can now easily scale computing power without changing the base system, cabling, or existing certifications.

 

Taipei, Taiwan. IBASE Technology Inc. presents the MPT-7100R railway computer system engineered for the rigorous demands of modern rail transportation. Powered by the 13th Gen Intel Core U‑series processor running up to 3.0 GHz, the MPT-7100R delivers enhanced multi-threaded performance. It is certified EN50155 (2021) and EN45545-2, confirming railway-grade reliability, operational safety, and fire protection in mission-critical applications.

Atlanta, Georgia. embedded world North America (ewNA) is returning for its second year, this time in Anaheim, California at the Anaheim Convention Center from November 4–6, 2025. ewNA is building on its successful debut and will again serve as the preeminent meeting place for the embedded technology community in North America.

Smart Sensor Devices introduced BleuIO, a Renesas SOC based Bluetooth low energy USB dongle used to develop new BLE applications. Customers can utilize the AT Commands offered on the device or use the Python/Javascript libraries for rapid design. It permits field or boot upgrades while applications are stored on FLASH memory as well as custom settings or OTP.

Akasa introduced a range of industrial closed-loop and open-loop liquid coolers, designed for AI, servers, data centers, and other high-performance computing (HPC) applications allowing customization for precise design necessities, with various radiator profiles, cold plate options, and socket configurations offered. The liquid coolers support Intel Xeon and AMD EPYC processors up to 750W TDP.