Embedded Computing Design

Out of Europe comes news that two leaders in the manufacturing of FPGA modules and suppliers of development and design services, Trenz Electronic GmbH (Trenz) and Knowledge Resources GmbH (KR), have agreed to a technological partnership to enhance the European FPGA SoM ecosystem.

AAEON and Qualcomm Technologies, Inc. are collaborating to speed up the implementation of innovative embedded IoT solutions enhancing medical, industrial automation, and transportation applications. The partnership utilizes AAEON's expertise in manufacturing and its early access capabilities to deliver customized market-ready solutions leveraging Qualcomm’s Dragonwing processors.

Guangzhou, China. Robustel introduced its EG5120 Industrial IoT Edge Gateway designed for real-time data processing, analytics, and control at the edge. It offers a secure and highly flexible platform for cutting-edge IoT applications in smart manufacturing, energy, and smart building markets.

Wirral, United Kingdom. LDRA publicized it joined both the Renesas Ready Partner Network and the R-Car Consortium. The relationship extends LDRA's support to seamlessly incorporate system development tools utilizing Renesas R-Car system on a chip (SoCs), microprocessors (MPUs), and microcontrollers (MCUs) that are required to be in full compliance with industry-wide functional safety and cybersecurity standards.

Greg Semeraro, an embedded and real-time system professional, released Embedded Real-Time Operating System Design, a complete examination of the theory, analysis, performance, portability, and implementation of RTOS.X. Four diverse hardware platforms are included providing various architectures to evaluate.

Lanner Electronics released the ECA-5555, an innovative compact edge server leveraging the Intel Xeon 6 SoC, previously codenamed Granite Rapids-D. The platform is designed for high performing, scalable AI-accelerated virtualized RAN and edge compute applications. It is ideal for both a Distributed Unit (DU) or Centralized Unit (CU) server for 5G RAN intelligence.

OnLogic launched its scalable Helix 520 Series designed for the next generation of edge computing. The series leverages the latest Intel Core Ultra processors with integrated edge AI capabilities, and industrial-grade reliability ideal for automation, machine learning, edge AI, computer vision, robotics, and autonomous systems.

Wavelynx Technologies collaborated with McObject in order to introduce eXtremeDB’s interoperable embedded database into Wavelynx’s innovative building access control reader. The partnership allows real-time data management for secure and scalable access control in commercial applications.

AdaCore introduced the Ada and SPARK programming languages into the automotive industry. While partnering with NVIDIA, and employing NVIDIA’s Drive OS, AdaCore will publish an off-the-shelf reference process enabling the utilization for designers thinking of next-generation automotive applications

Lauterbach released information that its TRACE32 development tools now collaborate with the PX5 RTOS. Support includes access to the PX5 RTOS internal structures and data allowing a better definition of chip resources for seamless design management.

PEAK-System Technik introduced its PCAN-GPS Pro FD, a flexible sensor designed to identify the position, orientation, and acceleration of matters. The solution is housed in an aluminum shell for deployments in harsh environments.

In a company press release, Innatera announced its Pulsar neuromorphic microcontroller earned Best-in-Show in the Microcontrollers, Microprocessors & IP category at COMPUTEX 2025 by Embedded Computing Design. The honor identifies Pulsar’s innovative utilization of Spiking Neural Networks (SNNs) to enable real-time, ultra-efficient edge AI.

New Taipei City, Taiwan. NEXCOM introduced its compact and fanless VTC 7280-xC5, expanding its series of in-vehicle AI-assisted telematics computers. The solutions are built around the Intel Core Ultra Meteor Lake H series, Intel’s first AI-oriented CPU with built-in NPU and GPU cores.

San Diego, California. Taoglas released its Thunder Series, an enhanced outdoor antenna housing developed for seamless integration and installation of current leading industrial routers in antenna applications. The series is designed for general routers from Digi, Ericsson, and Semtech and combines Taoglas’ wideband antenna expertise with a sturdy enclosure enabling the installation of a router directly inside the solution.

aicas introduced Edge Data Gateway (EDG), a unified platform developed to streamline data management at the edge, giving industries the ability to organize what data is gathered and how and when it is communicated. The scalable solution connects and controls various devices across complete ecosystems.

AAEON released the EPIC-RPS7, a four-inch industrial single-board computer with support for 12th, 13th, and 14th Generation Intel Core Processors (up to 65W) and up to 64GB of DDR5 (4800/5200) using two SODIMM slots. The board was developed as an entry-level cost option for space constrained applications in smart manufacturing including industrial control, PLC automation, and remote monitoring.

AAEON's UP brand released two new developer boards based on the new Intel Core 3 processor platform (formerly Twin Lake). The UP Squared TWL and UP Squared Pro TW offers a choice of the Intel Core 3 Processor N355, Intel Processor N250, or Intel Processor N150 CPU.

According to 7STARLAKE, it has introduced the world’s first and only all-in-one, self-contained 3U VPX Liquid-Cooled ATR system, the 7SL-3500. The solution is designed to meet critical functionalities in defense and aerospace applications.

Santa Clara, California. xMEMS Labs recently introduced Sycamore-W, the newest solution to the Sycamore near-field MEMS speaker family, developed for smart watches, fitness bands, and other wrist-worn wearables. Sycamore-W promotes xMEMS’ obligation to µFidelity audio in mobile applications.

Taipei, Taiwan. At COMPUTEX 2025, DFI and DEEPX highlighted the newest innovations that came to fruition from its edge AI partnership. The showcase featured embedded platforms leveraging DEEPX AI chips ideal for applications in smart cities and smart manufacturing. The main highlight was the integration of the DEEPX M.2 AI chip into DFI's enhanced AI solutions based on the EC700 and EC600 series platforms. The EC600 series supports an optional GPU for higher computing requirements.