Embedded Computing Design

Santa Clara, California. xMEMS Labs recently introduced Sycamore-W, the newest solution to the Sycamore near-field MEMS speaker family, developed for smart watches, fitness bands, and other wrist-worn wearables. Sycamore-W promotes xMEMS’ obligation to µFidelity audio in mobile applications.

Taipei, Taiwan. At COMPUTEX 2025, DFI and DEEPX highlighted the newest innovations that came to fruition from its edge AI partnership. The showcase featured embedded platforms leveraging DEEPX AI chips ideal for applications in smart cities and smart manufacturing. The main highlight was the integration of the DEEPX M.2 AI chip into DFI's enhanced AI solutions based on the EC700 and EC600 series platforms. The EC600 series supports an optional GPU for higher computing requirements.

Aetina, Qualcomm Technologies, Inc., and Data Systems Co., Ltd. introduced the "Enterprise AI Assistant" at COMPUTEX 2025. The "Enterprise AI Assistant", designed by Data Systems, is built on Aetina MegaEdge AIP-FR68 AI inference platform utilizing the Qualcomm AI On-Prem Appliance, a combination of Qualcomm Cloud AI 100 Ultra accelerator cards and the Qualcomm AI Inference Suite. It delivers up to 870 TOPS of AI performance for generative AI workloads in air-gapped environments.

Espoo, Finland. Recently at Qt World Summit 2025, Qt Group introduced plans for substantial expansion of the Qt platform and ecosystem. Due to its current tools and support for cross-platform GUI development, Qt is set to develop into a complete technology-agnostic environment.

Taipei, Taiwan. ASUS IoT is exhibiting at Computex 2025 where it introduced its RUC-1000-series rugged-rack edge AI computers, ideal for industrial AI applications. Included is the RUC-1000G and RUC-1000D both leveraging the latest Intel Core Ultra 200S series processors and dual DDR5 6400 MHz SO-DIMM slots supporting up to 64GB of memory.

During COMPUTEX 2025, Innodisk had live demonstrations spotlighting its optimized AI systems, such as the APEX series, and computing solutions leveraging NVIDIA, Intel, and Qualcomm Technologies solutions integrated with its embedded solutions, such as camera modules, AI memory modules, flash storage, and peripherals.

MediaTek Inc. and ASIX Electronics Corp. cooperated for a solution that incorporates ASIX AX88179B USB 3.2 Gen1 Gigabit Ethernet Controller and driver into the Genio 510 platform development kit supporting multiple Ethernet ports.

London, United Kingdom. PQShield, launched an updated product suite with the introduction of PQPlatform-TrustSys, a new quantum-safe Root of Trust solution enabling ASIC and FPGA hardware compliance with new PQC standards.

Elitegroup Computer Systems (ECS) will unveil its comprehensive portfolio of cutting-edge AI- powered solutions at COMPUTEX 2025. Visitors to Hall 1, Booth I0118 will see demonstrations including the Ultra-Portable Series, Commercial Notebooks, Chromebooks, Commercial Motherboards, the complete LIVA Mini PC lineup, Server solutions, and the EliteSpace OBC.

Taipei, Taiwan. DFI will introduce several products including embedded motherboards, systems, and edge servers during COMPUTEX 2025. DFI will focus its exhibition on smart parking and UAV applications to demonstrate the benefits of edge AI in real-world use cases. DFI will join BenQ Qisda Group’s COMPUTEX AI WOW booth from May 20 to 23 in the Taipei Nangang Exhibition Center Hall 1, 4F, booth number M0120.

BIOSTAR will attend this year’s COMPUTEX where at its booth, P0808, it will promote its message of “Unlock the Future of Edge AI”. Booth highlights will include a variety of technology such as industrial-grade edge AI platforms, EdgeComp embedded IPC systems, and the latest consumer PC motherboards, graphics cards, SSDs, and DDR memory.

AAEON has earned a Golden Award for its BOXER-8645AI at the COMPUTEX Best Choice Award. As an advanced AI platform, the BOXER-8645AI is a fanless solution leveraging the NVIDIA Jetson AGX Orin and supports eight GMSL2 interfaces with a rugged design suited for in-vehicle deployments.

Taipei, Taiwan. At COMPUTEX 2025, ASRock Industrial (Booth L0818) will be highlighting its latest innovations in Edge AI Server, Robust Edge AIoT Platform, Embedded Computer System, and Industrial motherboards. A must see will be the live demonstrations of ASRock’s InduAgent AI-driven Industrial Agent, AI Pack Station, AI Robotic Orchestration, and SPE Control, the first x86 platform with single-pair Ethernet, demonstrating the effect AI will have in redefining smart factory automation and real-time industrial operations.

Madrid, Spain. KD announced a collaboration with German- based ZF Group aimed to integrate the KD7251 transceiver into ZF’s ProAI ECU. The partnership will support ZF’s ProAI high-performance computer with optical multigigabit communication abilities. According to KD, the KD7251 offers the first optical transceiver to facilitate the transmission of data via automotive-grade optical fibers in compliance with the IEEE 802.3cz standard.

AEWIN Technologies will highlight its latest innovations during Computex 2025. Its demonstrations will include high-availability storage servers, edge computing platforms, general-purpose servers, and network appliances ideal for AI-powered cybersecurity, Edge AI, and intelligent storage. AEWIN Technologies will join the BenQ Group COMPUTEX AI WOW exhibition at Booth M0120.

Neumonda Technology introduced its latest DRAM test board, Octopus. Neumonda’s Octopus tester leverages the Intel Raptor Lake CPU and was developed to screen DRAM components for memory modules. It can test in various temperatures with varying speeds in which DRAM modules will be operating.

Synaptics will exhibit its S3930 series, a high-performing touch control, at Booth# I1311 (Hall1, 1F) during this year’s COMPUTEX. Synaptics contends the series is the first IC developed from a next-generation touch controller architecture. It is designed specifically for foldable OLED and ultra-thin mobile displays.

During COMPUTEX 2025, at the BenQ Group COMPUTEX AI WOW booth (M0120), AEWIN Technologies will introduce its two-phase direct liquid cooling (2P DLC) solution for AI servers and its latest optimizations of its two-phase immersion cooling (2PIC) solution that enhances energy efficiency and Power Usage Effectiveness (PUE).  

Renesas Electronics Corporation and Altium recently announced the 2026 expected release of the Renesas 365, a solution streamlining electronics system design from silicon to lifecycle management. The announcement follows news of Renesas’ acquisition of Altium, showing how prominent the collaboration will be. The environment is built on the Altium 365 platform.

SEGGER and Quintauris will partner to design innovations for the open-source RISC-V ecosystem with the focus on automotive, health, IoT, and high-performance computing applications. “We are excited to collaborate with SEGGER as we work to drive the commercial adoption of RISC-V forward,” says Pedro Lopez, Managing Director and Head of Market Development, Quintauris.