Embedded Computing Design

AAEON released the NanoCOM-MTU, a COM Express Type 10 CPU Module leveraging either the Intel Core Ultra 7 Processor 155H or Intel Core Ultra 5 Processor 125H, both 28W. The NanoCOM-MTU offers up to 16 cores and 22 threads in an 84mm x 55mm form factor.

Cadence released its LPDDR6/5X memory IP system solution developed to function at 14.4Gbps, a 50 percent increase than prior LPDDR DRAM. The Cadence LPDDR6/5X memory IP system solution allows scaling of AI infrastructure to promote memory bandwidth, and volume demands of next-generation AI LLMs, agentic AI, and other process intense workloads for several verticals.

WINSYSTEMS announced two new high-performing embedded computers to its small form factor SBC lineup, the SBC-472-TS570 and SBC-477-TS570. Building upon the demonstrated dependability of the SBC-472 and SBC-477 families, the additions include a more powerful processor (Intel Xeon® W-11865MRE) for superior computing power in industrial applications.

Synopsys has released new information that it has completed its acquisition of Ansys. The original transaction was announced on January 16, 2024, and will merge two leaders in silicon design, IP, simulation, and analysis to transform AI-dependent products.

UK’s Lord Patrick Vallance, Minister of State for Science, Research and Innovation and a former Government Chief Scientific Adviser will give a keynote speech during opening day of the Microelectronics UK exhibition opening at Excel London on 24-25 September 2025. The discussion will provide expertise, connections, and information about technologies required to develop the United Kingdom’s critical industries.

Hillsboro, Oregon. Lattice Semiconductor has extended its small FPGA portfolio with new, high I/O density possibilities in the Lattice Certus-NX FPGA and Lattice MachXO5-NX FPGA devices ideal for solutions needing power efficiency, small form factor, high 3.3V I/O, and security. The solutions are ideal for AI, industrial, communications, server, and automotive use cases.

Knowles Corporation publicized that Status Audio has decided to choose its BA drivers for its new Status Pro X true wireless earbuds highlighting a triple-driver hybrid configuration with two Knowles BAs and one dynamic driver in each device.

Axiomtek released its KIWI330, an Ultra-Compact 1.6" SBC supporting NVMe and Type-C DisplayPort for edge AIoT. It leverages the Intel Atom processor N50 and includes 4GB of onboard LPDDR5 memory and a 64GB NVMe SSD.

GÖPEL electronic designed a powerful and fast configurable battery test bench that features a modular design and high flexibility for streamline testing of battery cells. It contains a central measurement technology unit with a computer and monitor, a control cabinet, and a unit with all power electronics.

BIOSTAR released its compact (182 x 150 x 48 mm), fanless EdgeComp MS-1335U leveraging Intel’s Raptor Lake SoC processors with up to 10 cores and speeds reaching 4.6 GHz. The platform supports up to 96GB of high-speed DDR5 5200 MHz memory, ultra-fast PCIe Gen4 storage, and SATAIII for flexible storage options. It is ideal for smart kiosks, interactive digital signage, self-service terminals, and municipal systems

Avalue Technology Inc. introduced its EPS-RPR fanless rugged embedded system delivering a high performing, consistent, and flexible embedded platform ideal for smart manufacturing, autonomous vehicles, and intelligent retail applications. The EPS-RPR leverages the 14th Gen Intel Core i9/i7/i5/i3 processors and supports DDR5 5600 MHz memory.

IBASE Technology Inc. released its MBB1005, an ATX motherboard designed for industrial edge computing, AI acceleration, and automation platforms. It leverages Intel Core Ultra 200S processors on the LGA1851 socket delivering enhanced performance, modular expansion, and rugged reliability.

With the power of AI, modern manufacturing is developing at a faster pace than before. Factories equipped with intelligent systems are now driving innovation by using real-time data to optimize performance and efficiency. Manufacturing is no longer just sensors and conveyer belts, it is a conglomerate of AI, automation, and the engineers and factory workers that work alongside technology.

GlobalFoundries (GF) announced it has come to an agreement to acquire MIPS, expanding GF’s portfolio of customizable IP offerings enabling it to expand its process technologies with IP and software facilities.

Premio Inc. released the LLM-1U-RPL, the first entry into its new LLM Series line of edge servers. The compact, short-depth (483 (W) x 480 (D) x 44 (H) mm) 1U edge server is engineered to deliver real-time Generative AI (GenAI) and Large Language Model (LLM) workloads straight to the on-premises data center moving away from general cloud dependence while offering reduced bandwidth strain, safeguarded data sovereignty, and support for real-time decisions in hybrid cloud systems at the edge.

VersaLogic Corp. introduced its P3 module, a dual Mini PCIe socket expansion board that delivers an efficient and dependable solution for adding expansion cards to existing embedded environments. It features two full-size Mini PCIe sockets for a wide variety of off-the-shelf expansion cards, such as Ethernet, AI/GPU, and other standard I/O functions.

 

Axiomtek released its PICO338, an innovative Pico-ITX single board computer (SBC) designed for high-performance, space-constrained (100 x 72 mm) uses such as robotics, IoT devices, edge computing, embedded control, and retail kiosks. The board supports dual 2.5GbE ports featuring the Intel Ethernet Controller I226-V.

 

Austin, Texas. Ambiq recently publicized that its Apollo510 System-on-Chip (SoC) is currently supported on the Edge Impulse development platform allowing design teams to develop and deploy efficient and scalable AI for edge devices in application areas such as speech recognition, computer vision, healthcare monitoring, and industrial automation.

Candera’s CGI Studio is now fully compatible with the latest QNX Software Development Platform (SDP) 8.0 benefiting various applications in automotive and medical markets. The compatibility ushers in new HMI development, allowing designers to create applications that meet increasing user experience and performance demands.

London, United Kingdom. Blecon, with MOKO SMART, introduced the L02S-BCN, a cutting-edge Smart Beacon co-designed by both companies to deliver innovative sensing and connectivity for industrial and commercial use cases. The L02S-BCN is built on MOKO’s trusted L02 platform and enhanced for leading-edge Bluetooth applications leveraging Nordic Semiconductor’s nRF54L system-on-chip (SoC) seamlessly integrating with the Blecon Network.