Embedded Computing Design

Embedded Computing Design’s Road to Embedded World will highlight a host of embedded suppliers who will be showcasing their latest products and technologies at Embedded World, April 9^th to 11^th in Nuremberg, Germany. Embedded World is the largest global gathering of its kind. Check back regularly to see where the Road to Embedded World takes us.

SECO will be setting up its exhibition at embedded world 2024 at booth 1-320. Visit for a deep dive into its modular offerings from high-tech edge computing platforms, edge and cloud IoT software suite, Clea, and its AI-power support system, StudioX.

Embedded Computing Design’s Road to embedded world will highlight a host of embedded suppliers that will showcase their latest products and technologies at embedded world, April 9^th to 11^th in Nuremberg, Germany. embedded world is the largest global gathering of Embedded Computing products and services. Check back regularly to see where the Road to embedded world takes us.

During April 9-11, Sealevel Systems, Inc. will have an exhibition at embedded world 2024 (Hall 3, Stand 141) with a motto “Connecting the Embedded Community” focusing on the future of hardware design, M2M communication, vision, and edge technology.

Chicago, Illinois. For Pi day, Newark is running a special 10% discount promotion on selected Raspberry Pi products. Newark is offering Raspberry Pi 4 Starter Kits to PSUs, ABS and metal cases, Camera V2, and more. The discount will end March 31.

Embedded Computing Design’s Road to Embedded World will highlight a host of embedded suppliers who will be showcasing their latest products and technologies at Embedded World, April 9^th to 11^th in Nuremberg, Germany. Embedded World is the largest global gathering of its kind. Check back regularly to see where the Road to Embedded World takes us.

The POLYRACK TECH-GROUP will be bringing its enclosure and system solutions to embedded world 2024. Located in Hall 3, booth 255 will be solutions utilizing standard plastics (e.g. PP, PMMA, ABS, PS), engineering plastics (e.g. PC, PA, POM, PBT), and high-performance plastics (e.g. PVDF, PPS, PEEK, LCP). Other booth highlights will be focusing on development-related preparation for CE and UL approval and simulation-supported component analysis via filling and warpage analysis.

ARBOR is bringing its prominent solutions to NVIDIA GTC 2024 where it will be demonstrating its innovative platforms in applications such as machine vision, edge computing, rugged AIoT, and real-time machine vision. Showcased will be ARBOR's FPC-5211-M4, FPC-9108-P6-G3, and AEC-6100. Visit Arbor at the San Jose Convention Center (Booth #1821) during NVIDIA GTC 2024.

PTC is attending embedded world 2024 where it will exhibit its proven Perc Real-Time Java and Ada solutions for applications including Aerospace and Defense, Industrial Control, IoT Edge, Telecom, Energy, and Transportation. Designers developing with Java can utilize PTC Perc to combine Java code, resources, and required files in a standalone program.

Reno, Nevada. Sundance DSP is introducing its SoM1-SOC, a commanding and adaptable System-on-Module (SoM) developed for embedded systems. The SoM1-SOC features the Microchip PolarFire SoC FPGA that blends a low-power FPGA fabric with a 64-bit Linux-capable RISC-V processor. Ideal applications include defense, communications, machine learning, and industrial automation.  

Avnet Abacus will be exhibiting at embedded world 2024 in Nuremberg, Germany, from April 9-11 with its motto, 'Making Ideas Reality'. Attendees at Hall 3A, Booth 125, will highlight a variety of solutions and demonstrations including a Live Cooking Area, Industrial Automation Area, Industrial Solution Area, and Mesh Network Area. 

Beaverton, Oregon. Z-Wave Alliance announced that it has completed the specification for Z-Wave LR (ZWLR) for the European market, and will be made available to member companies in an upcoming release. “From the moment we announced ZWLR for the North American market, the Alliance has been hard at work to make the spec available to our valued members in Europe,” said Avi Rosenthal, Chairman of the Board, Z-Wave Alliance. “With the specification complete, the Alliance will soon announce ZWLR certification program details and once released, ZWLR will be available to European Z-Wave Alliance members for product development.”    

Accuview will be exhibiting at Embedded World 2024 highlighting its newest solutions meant to meet demands of the ever evolving embedded systems industry. Visit Booth 1-402 to learn about how Accuview can help you.

Hitex is attending embedded world 2024 and will be bringing MOTEON as a co-exbitor in Hall 4, Stand 205.

Come and meet SGS cybersecurity experts, ready to address your questions regarding security testing and certification for embedded systems.

Eurocircuits will be attending embedded world 2024 from the 9th to 11th of April with its motto “Your Gateway to Excellence in Electronics Manufacturing," located in booth 3A-237.

MIPI Alliance will be attending embedded world 2024 with twelve presentations spotlighting MIPI specifications. Presentations will showcase MIPI camera and display specifications, MIPI's significance in automotive technology, and the MIPI I3C utility and control bus.

Munich, Germany. Infineon Technologies released its Solid-State Isolators (iSSI) featuring drivers leveraging coreless transformer technology for faster and more efficient switching along with circuit protection functionalities that outperform those of optical-based Solid State Relays (SSR). The iSSI enables the driving of Infineon’s OptiMOS and CoolMOS, resulting in a 70 percent reduction in power dissipation compared to general solid-state relays using SCR (silicon-controlled rectifier) and Triac switches.

Nuremberg, Germany.  Swissbit will be exhibiting its PCIe family with focus on the N5200 SSD and its leading IOPS per watt ratio at embedded world 2024 in booth 1-543. Swissbit will also reveal the new iShield Key Pro featuring USB-C compatibility, alongside CmReady-certified memory cards aimed at optimizing license protection efficiency.

SEPA Europe introduced its HZ30B, an active chip cooler featuring an innovative method utilizing an integrated MF17B05 RaAxial mini fan housed within an aluminum pinbloc heat sink rather than being conventionally surface-mounted. The overall height of the HZ30B is 8mm and delivers a thermal resistance of 4.7 K/W.

SolidRun released its new Ryzen V3000 CX7 COM Module leveraging  the 8-core/16-thread Ryzen Embedded V3C48 processor with AMD’s 6nm “Zen3” architecture. The module delivers processing power, thermal efficiency, and high-speed I/O connectivity to the COM Express Type 7 form factor.