Embedded Computing Design

ByteSnap Design, a leading UK electronics design consultancy, released its report Futureproofing Manufacturing: Tackling Obsolescence & Electronics Challenges in Industrial Manufacturing. The research was conducted between February and March 2025, and the release coincides with World IoT Day on April 9th.

TAITRA (Taiwan External Trade Development Council) released a press release noting that Jens Hinrichsen, Executive Vice President and General Manager, Analog and Automotive Embedded Systems at NXP Semiconductors, will be a keynote speaker at COMPUTEX 2025. The keynote will take place on May 20 at 3:00 PM (UTC+8) at Taipei Nangang Exhibition Center (Hall 2, 7F).

Neubiberg, Germany. While still subject to regulatory approvals, Infineon Technologies AG has acquired Marvell Technology’s Brightlane Automotive Ethernet portfolio of PHY transceivers, switches, and bridges for US$2.5 billion in cash. The portfolio includes solutions that deliver network data rates ranging from 100 Mbps (megabits per second) up to 10 Gbps (gigabits per second).

Middletown, Pennsylvania. Phoenix Contact released its Monitoring Case System (MCS), a flexible housing family developed for sensor, IoT, and IIoT applications. The enclosures are mountable to wall, pole, and DIN rail allowing seamless PCB installation, mounting, and maintenance.

Taipei, Taiwan. DFI launched new Edge AI systems including the EC600 series with AI module expansion, the compact and fanless EC700 series, and the MPC350-RPS medical Edge AI server, designed for medical AI computing and processing. The solutions are developed to guarantee real-time computing, stable deployment, and enhanced data security.

Cincoze released a 15.6-inch FHD display option for rugged HMI applications to its CRYSTAL product line including rugged industrial panel PCs (CV-W115FH/P) and monitors (CV-W115FH/M) as well as sunlight readable panel PCs (CS-W115FH/P) and monitors (CS-W115FH/M). The series employs Cincoze's exclusive Convertible Display System (CDS) technology for flexible configuration with computer modules (P2000/P1000 series) or monitor modules (M1000 series).

Axiomtek announced its flexible Intel Atom x7211E or Intel Core i3-N305 powered eBOX100A, a compact fanless embedded system ideal for factory automation, industrial IoT, edge computing, and more. The solution features a 2.5" SATA HDD/SSD drive and one M.2 Key E 2230 for a wireless module, providing high-speed wireless communication. The platform integrates a full-size PCI Express Mini Card slot supporting USB 2.0, PCIe, and SIM signals, along with an internal SIM slot to expand connectivity further.

Neumonda and Ferroelectric Memory (FMC) are partnering to design, test, and market FMC’s nonvolatile DRAM+ bringing semiconductor DRAM memory design and manufacturing back to Germany. FMC combines non-volatile properties of ferroelectric hafnium oxide (HfO2) with RAM to create a non-volatile DRAM memory for AI, medical, industrial, automotive, and consumer applications.

Alliance Memory released the AS7CW2M16-10BIN, a new 32Mb device in the 6 mm by 8 mm 48-ball FBGA package configured as 2M x 16 supporting power supply ranges from 1.65V to 3.6V. It is designed for consumer TVs, digital cameras, industrial robotics, networking routers, medical equipment, and high-speed automotive systems. Delivering rapid 10 ns access times, supporting data retention at 1.5V, and consuming minimal power (43mA in operation and 10mA in standby), the solution is both fast and efficient.

AAEON's UP brand introduced its smallest Intel Processor N-powered Mini PC with Wi-Fi support, the UP 710S Edge, measuring 92mm x 77mm x 38mm. The UP 710S Edge is designed as an industrial automation upgrade platform available in models with the full Intel Processor N series family (formerly Alder Lake-N) and introducing an 8-bit GPIO with optional SPI, I2C, and PWM.

Axiomtek released the GOT515-RPL-WCD (15.6") and GOT521-RPL-WCD (21.5") fanless panel PCs with full IP66 and IP69K-rated SUS304 stainless steel enclosures well suited for industries such as heavy machinery, food processing, chemical manufacturing, and agricultural automation.

onsemi recently introduced its Hyperlux ID family, a real-time indirect time-of-flight (iToF) sensor offering high precision long distance measurements and 3D imaging of fast-moving objects. By integrating onsemi’s proprietary global shutter pixel architecture and onboard storage, the Hyperlux ID family delivers real-time scene capture and depth processing.

Darveen introduced its RTC-I116 to aid in the monitoring of inventory and assisting maintenance teams in predicting equipment issues for complete up-time ability. It meets IP66 and MIL-STD-810H standards for drop, shock, and water resistance. Operating temperatures range from -20°C to 60°C. Viewing is abetted with a 11.6-inch FHD (1920 × 1080) widescreen display ensuring visual display of critical data with precision and efficiency.

Syslogic added four SPE (Single Pair Ethernet) interfaces to its RML A4AGX AI-enabled rugged computer utilizing the NVIDIA Jetson AGX Orin 64GB SoM (System on Module). The RML A4AGX SPE supports four single-pair Ethernet interfaces. Each SPE interface offers its own network interface controller (NIC) and enables real-time communication with cameras and other sensors.Each of the four SPE interfaces in the rugged computer has its own NIC, ensuring seamless real-time data exchange with cameras and sensors.

As edge computing continues to transform with AI in the forefront, having a powerful and energy-efficient module is essential for next-generation applications. Tria's MSC SM2S-QCS6490 SMARC 2.1.1 and MSC SM2S-QCS5430 SMARC 2.1.1 modules are built with Qualcomm technology, delivering high-performance processing, AI acceleration, and extensive connectivity options. Whether for IoT, AI-driven automation, or real-time data processing, these modules are designed to handle the most demanding workloads efficiently.

Taoglas is promoting its TFM series of multi-band GNSS front-end modules that provide flexible options for engineers designing high-accuracy GNSS projects. TFM modules integrate a two-stage cascaded filter with a low noise amplifier (LNA), all within a shielded, compact (15 mm x 15 mm x 2.7 mm), and low-profile surface mount package for enhanced performance.

Lantronix Inc. is now integrating its Open-Q System-on-Module (SoM) solutions, including hardware and software, with Teledyne FLIR’s thermal infrared (IR) camera modules and Prism embedded software. It is ideal for AI-enabled camera applications in autonomous navigation, drones, surveillance, and robotics.

 

Melbourne, Australia and Sophia Antipolis, France. Clarinox and Insight SIP announced a partnership expanding both companies' ecosystems combining Clarinox’s robust wireless software solutions and Insight SIP’s advanced hardware.

STMicroelectronics announced new STM32U3 microcontrollers (MCUs) with power-saving innovations that aids in the management of smart connected technology in remote locations. The new STM32U3 series delivers enhanced power-saving chip design with AI-enhanced tools, and the latest Arm Cortex-M33 core running up to 96MHz. These MCUs are designed for IoT devices operating for extended periods without maintenance and with constrained energy from a coin cell, ambient solar, or thermoelectric source.

TAITRA (Taiwan External Trade Development Council) publicized that Cristiano Amon, Qualcomm Incorporated President and CEO, will speak at COMPUTEX 2025 as a notable Keynote speaker, discussing his view of the transformative influence of AI on device experiences and ecosystems. The discourse is scheduled for 14:00, May 19, (UTC+8), at Taipei Nangang Exhibition Center Hall 2, 7F.