Embedded Computing Design

San Jose, California. MIPS will highlights its embedded and edge AI innovations at COMPUTEX 2024. MIPS’ architecture enables a tailored solution with integration of the CPU to the overall System-on-Chip (SoC) architecture, handling data movement and memory to predict and unravel bottlenecks caused by the demands in AI. In meeting room #2549, at the Grand Hyatt Taipei, MIPS is showcasing two demos, supplying information of its real-time system deployments, and its multi-threading and RISC-V capabilities.

Vecow Co., Ltd. introduced its TGS-1000 Series, a stackable AI PC leveraging a CPU, GPU, and NPU within a single processor. The series supports edge AI applications including AI-accelerated processing, AI-assisted video conferencing, AI-ready immersive gameplay, and 4K streaming. Powered by Intel Core Ultra 7 165H/Ultra 5 135H processor and equipped with robust NPUs (neural processing units), the TGS-1000 Series is ideal for inferencing tasks required by AI.

PX5 announced that PX5 FILE now supports the industry-standard FAT (File Allocation Table) file system format, sharing application data between other platforms from embedded devices to desktop computers. Designers have the capability to leverage PX5 FILE for real-time storage across RAM, FLASH, SD cards, etc.

Our Road to COMPUTEX takes us to MACTRON GROUP, where at booth P0407a, it will unveil the forefront of innovative technology with its advanced Touch Embedded Systems and AI-driven solutions for applications in AI healthcare and AI automation. The booth will highlight MACTRON GROUP’s Touch Panel PCs that enhance efficiency and performance in every environment, from surgery rooms to construction sites. These solutions are engineered to meet the highest standards of durability, functionality, and medical-grade requirements, ensuring optimal performance even in the harshest conditions.

Taipei, Taiwan. ASRock Industrial will attend COMPUTEX 2024 from June 4th to June 7th at the Nangang Exhibition Center, Booth L0818. On display will be a thorough selection of next-generation solutions for edge AIoT computing including edge AIoT platforms, industrial IoT controllers, mini PCs, and motherboards.

Portland, Oregon. SensiML Corporation (subsidiary of QuickLogic) declared it is first to deliver a complete open-source AutoML solution for designing edge AI/ML applications with its invented Analytics Studio delivering enhanced creativity, innovation, and AI code transparency. According to SensiML, its Analytics Studio provides IoT Edge AI software tools such as platform agnostic model generation, time-series sensor inputs, rapid innovation, flexibility, and extensibility.

COSEL Co, Ltd launched its HFA3500TF, a low-profile 3-phase, 3-wire 3500W AC/DC enclosed power supply enhanced for industrial equipment such as semiconductor manufacturing, laser processing machines, and robotics. Input voltage operates at 180VAC to 528VAC and utilizes a digitally controlled switching topology and Wide Band Gap (WBG) semiconductors carrying efficiency ratings up to 94% at 400VAC input and 65VDC output.

Transcend Information Inc. will be displaying its latest innovations at COMPUTEX TAIPEI 2024 from June 4 to June 7 at Nangang Exhibition Center at Booth I0617a (1st floor of Hall 1). Transcend will be demonstrating its latest PCIe Gen 5 SSDs, CFexpress memory cards, portable SSDs, body cameras, and dashcams solutions ideal for applications such as AI vision system, 5G networking, traffic management, smart medicine, security surveillance, edge computing, EV charger, and casino gaming,

Taipei. Taiwan. TAITRA (Taiwan External Trade Development Council) invited Dr. Tzi-cker Chiueh, General Director of Delta Research Center, to provide a keynote speech at COMPUTEX 2024. The premise of the talk is "How AI Revolutionizes Automation Applications". It will be held at the Taipei Nangang Exhibition Center, Hall 2, 7th Floor (11 a.m. on June 6^th). 

Taipei, Taiwan. Exascend introduced its soldered DRAM-less AS500 series NVMe Ball Grid Array solid state drive (BGA SSD) designed to meet demanding data storage needs of next generation connected autonomous vehicles in rugged environments. The solution supports an operating temperature of -40°C to +105°C with shock and vibration control utilizing Exascend's proprietary Adaptive Thermal Control algorithm.

Munich, Germany. Infineon Technologies AG introduced its new PSOC Edge MCU family consisting of the E81, E83, and E84 heightened for machine learning (ML) applications and delivering a scalable range of performance, features, and memory possibilities. The three MCUs support a variety of peripheral sets, on chip memory, hardware security features, and a variety of connectivity options including USB HS/FS with PHY CAN, Ethernet, WiFi 6, BTBLE, and Matter.

Gothenburg, Sweden. Frontgrade Gaisler, under contract with the European Space Agency (ESA), is developing an innovative RISC-V processor designed to adhere to the strict requirements of microcontrollers for the space industry. As an open instruction set architecture (ISA), RISC-V’s intrinsic configurability and efficacy delivers the ideal base to move forward within critical sectors of space computing environments.

Our Road to COMPUTEX sees our first visit with Wincomm where it will be in booth PO504. During the exhibition, Wincomm will introduce the cutting edge of medical AI panel PC series, featuring advanced power management, high computing power, up to Intel 13th /14th generation (Code name: Raptor Lake) core processor, and support for MXM graphic cards.

Taipei, Taiwan. Neousys Technology released its Nuvo-9531-FT series, a rugged compact fanless computer with a flattop heatsink and powered by Intel 12th /13th-Gen Core i processors up to 24 cores, 32 threads, and delivers up to 2x the performance compared to previous Intel 10th or 11th Gen platforms. The Nuvo-9531-FT delivers a heat dissipation design tactically conducting heat to the surface of the cabinet.

Brainerd, Minnesota. MaxBotix introduced its MaxBotix Ultrasonic Tank Sensor and RangeTrack application aimed at transforming liquid level monitoring and sensor integration processes.

Seattle, Washington. McObject introduced the ratified eXtremeDB 8.4 delivering an abundance of enhancements to performance, security, and developer productivity. eXtremeDB 8.4 now carries SSL encryption and driver authentication capabilities in its ODBC driver ensuring secure connection between applications and database. To broaden possibilities in scalable environments, designers are able to leverage the new GO language API to seamlessly integrate eXtremeDB into their GO-based applications.

San Jose, California. Tessolve and Renesas collaborated to develop Tessolve’s SMARC SOM compatible with SMARC standard 2.1 and based on the RZ/V2H MPU leveraging four Arm Cortex-A55 CPU cores alongside two Cortex-R8 cores, one Cortex-M33, and an AI Accelerator (DRP-AI3) capable of eight TOPS/dense and 80 TOPS/sparse.

OmniOn Power extended its CLP-series of fanless open-frame power supplies with its CLP0312FP, a compact solution delivering up to 300 watts (W) of power in a two-inch by four-inch form.

Klika Tech announced a collaboration with Seeed Studio to reform the IoT sector by delivering advanced integrated solutions revolutionizing user experiences and technological development across various use cases. The combination of Klika Tech’s proficiency in cloud integration and IoT solution development with Seeed Studio’s advanced hardware, vows to open innovations that address key challenges in smart cities, healthcare, industrial automation, and environmental monitoring, and more.

Goodram Industrial launched its M1000 gen. 2 SSD designed for the industrial sector. The solution delivers reliability with high performance across a variety of applications. A SATA III interface and BiCS5 3D TLC NAND memory supports low power consumption, fast data transfer, and able to reach read and write speeds of 550 MB/s and 510 MB/s respectively.