Embedded Computing Design

Savoir-faire Linux released its open-source cybersecurity solution, the VulnScout.io, developed to aid in tracking, managing, and remediating product vulnerabilities more efficiently. It is committed to open-source and is active with both the Linux Foundation and the Yocto Project.

Intel, wolfSSL, Curtiss-Wright, and SYSGO are collaborating to develop next-generation COTS solutions that prioritize safety, security, and innovation in aerospace and industrial industries. By utilizing each company’s strengths, the partnership delivers high performance ruggedized environments that ensure compliance with safety and security standards for mission-critical applications, without requiring specific software, therefore reducing time to market.

Antenova introduced its Inpai, an SMD cellular antenna developed for NB-IoT and CATM on 4G/LTE networks in a compact 35mm x 8mm x 3.3mm and a clearance of 35mm x 13mm. For optimization the antenna is required to be positioned along the short end of a 105mm x 40mm size PCB. It works on all cellular networks and qualifies for AT&T’s standardized Small Form Factor (<107mm) requirements for certification in North America.

Western Digital unveiled a number of for higher capacity storage solutions designed for today’s data-driven difficulties. The solutions feature enterprise-class Ultrastar 7200 RPM HDDs for high performance, dependability and fast read/write speeds.  

TAITRA (Taiwan External Trade Development Council) has confirmed that NVIDIA’s Jensen Huang will be the first keynote speaker at COMPUTEX 2025, discussing the latest trends in AI and accelerated computing.

Perforce Software recently released the 2025 State of Automotive Software Development Report*. The statistics showed there is more utilization of AI within environments, as well as the continuous challenges of code complexity, and the importance of safety and security. According to 49% of those surveyed, safety was the top concern in AI vehicle development.

At embedded world 2025, Ignion introduced its Oxion 2.0, its AI-driven RF and antenna design tool placing importance of antennas first while supporting seamless integration and removing general barriers. It processes and analyzes in-depth PCB Gerber files and quickly reports back on integration readiness and optimization opportunities.

Panasonic Connect North America introduced the NPM-GW Modular Placement Machine before IPC APEX Expo 2025, March 18-20, 2025, designed to accelerate production lines with enhanced precision, efficiency, and automation. The solution is a mixture of innovation with design intelligence to set new industry standards for autonomous factory operations.

Klein-Winternheim, Germany. SYSGO announced its support of Intel’s 13th Gen Intel Core processor family (formerly named Raptor Lake) functional safety-capable SoCs (System on a Chip) with its PikeOS RTOS and Hypervisor. SYSGO’s PikeOS is recognized for its security certifications promoted within various industries.

At embedded world 2025, Flex Power Modules presented its latest power modules developed to enhance AI-driven workloads while increasing power density in small form factors enhancing energy efficiency and space optimization. Flex Power Modules showcased its BMR352 and BMR316 solutions, both compatible with the Flex Power Designer software, supporting real-time configuration, simulation, and performance monitoring.

Taipei, Taiwan. APLEX Technology Inc recently showcased its latest innovations in smart manufacturing, AI solutions, and certified industrial applications during embedded world 2025. The booth focused on APLEX’s extended lineup of industrial automation environments from factory automation HMI to application-oriented panel PC.

Recently Arm introduced its Armv9 edge AI platform featuring the new Arm Cortex-A320 CPU and the Arm Ethos-U85 NPU, a leading AI accelerator delivering efficient and secured intelligence at the edge. The solution provides an 8x improvement in machine learning (ML) performance compared to the Cortex-M85-based platform launched last year.

Connect Tech, an NVIDIA Elite Partner, will attend NVIDIA GTC, where at Booth 245, its experts will be available to showcase demonstrations that highlight Gen AI at the Edge. Demos will include the integration of generative AI models and RAG techniques on Anvil for NVIDIA Jetson AGX Orin, demonstrating how Agentic AI applications can help solve real-world smart city problems, and another that highlights the ROS2 and NVIDIA Isaac ROS optimization services for high-performance robotics development.

QNX will be stationed in Hall 4, Booth 544 during embedded world where it will welcome attendees to learn more about its new solutions for mission-critical embedded applications. Highlights will include General Embedded Development Platform (GEDP), QNX Everywhere, QNX OS 8.0 in the Cloud, as well as a robotic arm demonstration.

At embedded world 2025, Ceva (Hall 4, Booth 462) will highlight its leading-edge wireless communications and Edge AI IP innovating smart edge devices for the future. Enabling seamless edge intelligence, Ceva’s solutions allow billions of devices to connect, sense, and analyze data efficiently. Ceva will demonstrate how AI-driven connectivity is a growing importance with advancements in Bluetooth technology and fresh use cases for edge NPUs in embedded ML applications.

Edge Impulse (Hall 4, Booth 505) will highlight collaborations with leading silicon partners, including STMicroelectronics, at embedded world 2025 with its in-booth demonstrations such as the STM32N6, ST’s new flagship microcontroller, which delivers a 600x performance gain over current high-end STM32 microcontrollers thanks to the integration of the Neural-ART Accelerator, an advanced NPU from STMicroelectronics.

NEXCOM, an Intel Titanium partner, will exhibit its innovative products and solutions that leverage Intel CPUs during embedded world in Hall 5, Booth 235. Amongst the highlights will be the Neu-X304 edge computer system powered by 12/13th Gen Intel Core Processor and the VTC 6232-C4SIP fanless 4-CH PoE in-vehicle computer with Intel Atom x7433RE.

Visitors to Hall 3, Booth 257 at embedded world will witness the ASUS IoT RUC-1000G, an innovative edge AI computing platform designed for seamless AI deployment, system integration, and high-performance GPU utilization. The solution is powered by Intel’s Core Ultra S-series processors with W880 chipset, PCIe 5.0 support, and a modular half-rack design for scalable AI applications.

SAPPHIRE Technology is introducing the SAPPHIRE EDGE+ VPR-5050 Series and products from its EDGE AI SERIES during embedded world. Hall 5, Booth 322 will demonstrate the EDGE + MB series featuring the EDGE+ VPR-5050-MB and EDGE+ VPR-5050A-MB Mini-ITX motherboards, ideal for AI acceleration, industrial automation, and edge computing. The solutions leverage AMD Embedded+ architecture with integrated AMD Ryzen Embedded V2748 processors with AMD Versal AI Edge adaptive SoCs.

congatec, an Intel Titanium partner, will be exhibiting its new Computer-on-Modules at embedded world (Hall 3, Booth 241) leveraging the latest Intel technologies from the credit card sized conga-SA8 SMARC module built with low-power Intel Core 3 technology to the high-performing conga-HPC/cBLS COM-HPC Client module utilizing intel Core S processor technology.