Embedded Computing Design

Shenzhen, China. MYIR released its MYC-YT113i CPU Module with an integrated Allwinner’s T113-i dual-core ARM Cortex-A7 processor utilizing 128MB on-chip DDR3 memory and external DDR3 memory options of 512MB/1GB. The solution fits snuggly in a miniscule 39mm by 37mm design carrying IO signals through 140-pin stamp-hole interface and 50-pin LGA pads.

Baden-Dättwil, Switzerland. Syslogic announced the RML A4NX, an NVIDIA Jetson Orin NX powered rugged computer with eight GMSL interfaces and up to 100 TOPS of AI performance utilizing 16GB of RAM. The solution is available in GMSL and PoE models including the ability to connect to eight high-resolution GMLS2 cameras (power over coax or ethernet) or up to four GMSL2 stereo cameras. PoE interfaces add the capability to integrate lidar or radar sensors into the environment.

Phison Electronics is extending its series of PCIe 5.0 and CXL 2.0 compatible redriver and retimer data signal conditioning ICs. The solutions have the capability to integrate in both Intel- and AMD-based platforms for applications such as artificial intelligence and machine learning (AI+ML), edge computing, high-performance computing, and many data-intensive needs. “Phison has focused industry-leading R&D efforts on developing in-house, chip-to-chip communication technologies since the introduction of the PCIe 3.0 protocol, with PCIe 4.0 and PCIe 5.0 solutions now in mass production, and PCIe 6.0 solutions now in the design phase,” said Michael Wu, President & General Manager, Phison US.

San Jose, California. AVerMedia released its fanless AI Box PC D315AOP powered by the NVIDIA Jetson AGX Orin. The box PC is ideal for real-time video feeds for autonomous mobile robots (AMRs), smart security, and intelligent inspection. It is delivered with a 120-pin high-speed connector for MIPI SerDes cameras and a 10GigE Vision camera connector.

Qualcomm Technologies, Inc. will be bringing a RISC-V based wearable platform to Wear OS by Google. The framework is expected to expand the products compatible within the environment. The platform will leverage low-power high-performance custom computers.  

St. Julians, Malta. SmartCow released its self-contained rugged edge AI camera, Sphinx, with Gigabit Ethernet 5G connectivity and NVIDIA Jetson Orin NX and Xavier NX system-on-modules. The Sphinx comes with dual image sensors with built-in IR illumination and low-light performance. Modular connectivity enables the easy integration of peripheral sensors such as air-quality sensors, LiDAR, and radar.

IC Nexus introduced its NSD3310WX-HL-KK3, a 10-inch TFT LCD display that sets new standards in ruggedness, affordability, and performance. The display leverages a 64-bit Cortex-A35 CPU and connects via Dual 10/100M/Gb Ethernet (LAN2 optional). It consists of a projected capacitive (PCap) touchscreen display at 1280 x 800 pixels and brightness standard of 1000cd/m². The display is protected by high impact resistance cover glass that meets IK08 standard.

San Jose. California. Cadence Design Systems introduced its innovative AI IP and software tools for on-device and edge AI processing. The scalable Cadence Neo Neural Processing Units (NPUs) support AI performance utilizing low energy while delivering up to 80 TOPS in a singular core. The NPUs offer both classic and new generative AI models for offloading AI/ML performance from any host processor (application processors, general-purpose microcontrollers, and DSPs) leveraging AMBA AXI interconnect.

Westford, Massachusetts. Swissbit is now delivering a new family of SATA SSDs. Its X-73, X-75, and X-78 are run by an industrial 112-layer 3D NAND technology. The SSDs range from 40 GB up to 1.92 TB and include M.2 2242, M.2 2280, Slim SATA MO-297, and 2.5” form factors. The X-75 (2.5”) and X-75m2 2280  arrive with Swissbit’s powersafe PLP securing operations while avoiding drive corruption and loss of critical data.

Montreal, Canada. Orthogone Technologies introduced its latest high-velocity interconnect, the Ultra-Low Latency (ULL) PCIe DMA Controller. The solution boasts a bidirectional data exchange of 640ns round trip. Features include an extensive software development kit, effortless integration with FPGA logic, and multiple customizable build time parameters

Ismaning, Germany. Kontron introduced its K9051-C741 ATX server class motherboard developed to support Intel 4th/5th generation Xeon scalable processors. Power and efficiency come from the Intel C741 chipset and Intel LGA4677 socket processors carrying a TDP of 350W and 768GB memory. Memory intense applications are carried out by up to 64 cores and eight independent memory channels.

Leuven, Belgium. Septentrio in collaboration with SparkFun Electronics sees the mosaic-X5 GPS/GNSS module receiver being integrated in a new evaluation kit from SparkFun, creating a consistent centimeter-level RTK positioning. The breakout board supports high-accuracy tri-band positioning aiding in signal interference such as jamming and spoofing. Data is accumulated and allows for the user to operate and monitor the receiver utilizing the web interface with no further code needed.

Santa Clara, California. Achronix Semiconductor Corporation collaborated with Myrtle.ai for an accelerated automatic speech recognition (ASR) platform designed around the Speedster7t FPGA. Spoken language is transformed into text in over 1,000 concurrent real-time streams and a 20x performance boost over other qualifying products.

Acrosser has a complete line of COM Express embedded computing solutions that consists of the ACM-XE21B6, ACM-ICLDE7, ACM-TGLUE0, ACM-EL6KA. The new devices are powered by Intel and come with a host of options and benefits for creating new and efficient designs for COM Express environments.

Actility has acquired Acklio to reinforce it as a leader in end-to-end IoT solutions. The acquisition, and SCHC technology that came with it, allows Actility to deliver a variety of IP-based IoT applications over LPWAN networks. With SCHC technology, the IP header is compacted to decrease the data volume needing to be shared over networks.

Seoul, South Korea. Magnachip Semiconductor Corporation released two new 150V *MXT MV Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs). Leveraging its 8th generation trench MOSFET technology, the 150V MXT MV MOSFETs (MDES15N056PTRH, MDU150N113PTVRH) were designed to utilize its trench MOSFET technology.   

Chandler, Arizona. Microchip released a new family, its PIC32CZ CA 32-bit microcontrollers, leveraging a 300 MHz Arm Cortex-M7 processor including an integrated Hardware Security Module (HSM). The family includes Microchip’s the PIC32CZ CA90 with an HSM or the PIC32CZ CA80 without the integrated HSM, both allowing for enhanced integration of security into applications.  

Budapest, Hungary. axem solutions has introduced a new XM Community on Discord created to enable embedded Tooling and DevOps professionals worldwide. The hub will be a centralized location for members to share knowledge through discussions based on facts and experiences of other collaborators.

San Franciso, California. Sama has introduced the Sama GenAI, a solution that is currently being used to facilitate Generative AI (GenAI) and foundation models globally. The new Sama GenAI utilizes SamaIQ and its proprietary algorithms in combination with Sama engineers to deliver customers continuous insights for quick delivery of high performing models.

GIGAIPC released its ATX-Q670A Motherboard leveraging 12th generation Intel Core processors and the Q670 chipset. The ATX-Q670A includes dual 2.5 Gigabit LAN and four dual-channel DDR4 DIMM sockets supporting up to 128 GB for fast and efficient data processing. The platform is ideal for integrating cameras, lighting, and other components critical for machine vision applications.