Embedded Computing Design

During embedded world 2025, Solectrix will introduce the merging of the Solectrix Group (Solectrix GmbH and Solectrix Systems GmbH) with the ASSDEV Group (ASSDEV GmbH and AST-X GmbH). The merger is expected to utilize the manufacturing know-how of ASSDEV combined with Solectrix Systems knowledge of the fabrication and sales of complex electronic assemblies and systems.

The HydraLink is easing the transition from CAN-based networks to Automotive Ethernet by offering a USB3 Gen 1 to Automotive Ethernet interface that is thinner, cost-effective, and highly efficient. HydraLink connects directly from a PC to 100BASE-T1 and 1000BASE-T1 networks for real-time diagnostics, security testing, and protocol analysis aiding ECU development, penetration testing, and traffic interception for streamlining workflows.

Los Gatos, California. Superior Sensor Technology announced deliveries of a customized HV Series differential pressure sensor for Triatek’s EcoAir Valve. The sensor for Triatek allows the EcoAir Valve to deliver up to seven pressure ranges with precision. This enables the valve to be utilized in various applications. The sensor’s support for various pressure ranges streamlines system design and manufacturing of the EcoAir Valve. It offers safety, reliability, and energy efficiency for critical environment HVAC environments.

Parasoft received a leading position as a Leader and Fast Mover in the latest GigaOm Radar Report on API Functional Automated Testing. The recent Radar Report assessed 14 dedicated tools and platforms developed to validate API functionality, reliability, and performance.

Taipei, Taiwan. AAEON released its BOXER-8654AI-KIT, a development kit integrated with either an 8GB or 16GB NVIDIA Jetson Orin NX module. The kits’s module comes with an innovative carrier board highlighted with a full-function I/O including six USB 3.2 Gen 2 ports, an Out-of-Band (OOB) management box header, and four LAN ports with possible power boards for PoE capability.

Tualatin, Oregon. VersaLogic Corp conducted tests and determined that its Sabertooth AI bests the NVIDIA Jetson AGX Orin by bringing 25 times faster AI inferencing. Multiple performance benchmarks and testing protocols were used to assess the inferencing capabilities of the embedded AI platforms. The benchmarks simulated real-world AI workloads and evaluated how well a solution can process tasks like image recognition, object detection, and sensor data analysis.

SECO will demonstrate early samples of its Modular Vision product line at embedded world 2025 (March 11 to 13 in Nuremberg, Germany) where it will exhibit its innovative products developed to alter how industries deliver smart interactive displays within machines and appliances. These Panel PCs, known as HMI (Human-Machine Interface) assemblies, provide a complete embedded computing platform with a display, eliminating the need for OEMs to invest in extensive development.

Syslogic released a new rugged computer, its RSA4NA, based on the NVIDIA Jetson Orin Nano System-on-Modules (SoMs) unlocking innovations within generative AI models. After a software update, the platforms power consumption increases from 15 watts to 25 watts allowing the GPU to operate up to 1020 MHz and 67 TOPs.
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Tokyo, Japan. EdgeCortix Inc. released information that its SAKURA-I AI Accelerator is capable for space exploration due to its enhanced radiation resiliency. To analyze EdgeCortix’s AI accelerator’s radiation resistance, NASA Electronic Parts and Packaging Program (NEPP) performed a two-stage test, involving exposure to proton and heavy ion radiation in space-like conditions.

Lisle, Illinois. Molex has released its MMCX Power over Coax (PoC) solution delivering a patent-pending connecting technique to ensure secure and stable bonds while sustaining electrical ground stability. The solution is suited for compact needs where dependable RF connections and constant power delivery are essential including automotive liquid-crystal display (LCD) mirrors, driver monitoring systems, and industrial sensors.

Longsys introduced a 7.2mm × 7.2mm subsize eMMC, that delivers an innovative memory solution for enhancing the physical space of AI wearables. According to the press release, it is one of the smallest subsize eMMCs presently offered. 153 solder balls virtually cover the entirety of the panel.

San Jose, California. Cadence has agreed to acquire Secure-IC enabling it to enhance Cadence’s range of innovative silicon-proven IP, including interface, memory, AI/ML, and DSP solutions. Boyd Phelps, senior vice president and general manager of the Silicon Solutions Group at Cadence commented, “We continue to invest in our comprehensive IP and design services portfolio to provide more complete system solutions for our customers.”

Cincoze released a new addition to its rugged computing DIAMOND product line, the Entry Performance & Compact industrial computer DC-1300 series. It leverages an Alder Lake-N platform Intel Core i3-N305 processor, with support for essential I/O interfaces for industrial applications. The DC-1300 offers wireless transmission solutions such as Wi-Fi, 5G, GNSS, etc., in a 185 x 131 x 56.5 mm chassis.

Hod Hasharon, Israel. Weebit Nano Limited released information it has licensed its resistive random access memory (ReRAM or RRAM) technology to onsemi. Weebit Nano’s ReRAM IP will be integrated into onsemi’s Treo platform delivering embedded non-volatile memory (NVM).

Toradex is launching a new SMARC System on Module (SoM) Family beginning with the SMARC i.MX 8M Plus and SMARC iMX95 System on Module. The SMARC iMX8M Plus delivers machine learning capabilities with power efficiency ideal for companies currently utilizing the i.MX 6, 7 and 8 SMARC-based designs.

BIOSTAR introduced its MS-N97, an Intel Alder Lake-N N97 quad-core processor powered industrial computer developed for various requirements in industrial automation, edge computing, digital signage professionals, system integrators, and more. Networking is made possible utilizing dual 2.5G GbE Intel LAN adapters.

Alif Semiconductor introduced its second generation of its Ensemble family including the E4, E6, and E8 Ensemble MCUs and fusion processors leveraging the latest neural processing unit (NPU) from Arm, the Ethos -U85, and designed for enhanced generative AI workloads.

Percepio announced its Percepio Detect, a new tool redefining how embedded software developers confront testing, debugging, and observability challenges. Percepio Detect supports Observability Driven Development (ODD), enhancing DevOps for embedded systems through its seamless extension of CI/CT workflows.

Flex Power Modules enhanced its compact BMR510 2-phase integrated power stage module with improved efficiency and increases peak current from 140 A to 160 A. The solution integrates 528 µF of onboard capacitance improving transient response while reducing external component requirements and simplifying design.

WEROCK Technologies GmbH is releasing two new rugged high-performance notebooks designed for industrial use leveraging Intel Core Ultra Meteor Lake processors, Intel AI Boost, Arc Graphics, up to 16 cores, a 4.8 GHz turbo clock frequency and up to 64 GB RAM.