Embedded Computing Design

Intelligent Memory will attend electronica 2024 (Hall B4.101) where it will showcase its innovative JEDEC compliant DDR4 devices in x4, x8, and x16 DDR4 DRAM. The excitement is built around its new DDR4s that deliver 16Gb with clock speeds up to 1600MHz and data bandwidth up to 3200Mbps.

Smith will exhibit at electronica Munich 2024 from Tuesday, November 12, to Friday, November 15. It will be present in Hall B5 at Booth 331 to showcase its supply chain solutions. “Smith has been in the business of providing tailored solutions to the industry’s most complex supply chain challenges for more than 40 years,” said Mark Bollinger, Smith’s Chief Globalization Officer. “Our team of experts is excited to return to electronica Munich and share the many advancements we’ve made over the last two years with our global partners.”
 

Lanner’s new EAI-I731 is an innovative Edge AI platform designed to support low-latency AI inference in extreme industrial environments. The design leverages Intel power and meets the challenges of real-time computer vision applications, such as visual quality inspection, intelligent traffic management, and multi-stream video analytics for physical security. Operating temperatures range from -25ºC to 65ºC,
 

Axiomtek introduced its CEM710, a server-class COM Express Type 7 basic module leveraging the Intel Xeon D-1700 processor (Ice Lake D) with up to 10 cores, incorporated AI acceleration, and support for hard real-time workloads.

AAEON introduced the OMNI-ADP series, its Modular HMI Panel PCs including seven display sizes ranging from 10.4” to 21.5”. The family is powered by 12th Generation Intel Core processors. Across the series is an option of either PCAP and 5-wire resistive touchscreens, IP65 aluminum front bezel design, and both panel and VESA mounting options. Depending on the model, the OMNI-ADP PCs supports resolutions from 1024 x 768 - 1920 x 1080.

MosChip is now an AI/ML Design Partner in the Renesas RZ Partner Ecosystem, leveraging its proficiency in AI and ML to work together with Renesas and its global network of collaborators. MosChip has developed Smart Safety with PPE Kit Detection, Patient Monitoring System, ADAS Brake Alert with Distance Monitoring, and Action Recognition with Pose Estimation based on Renesas RZ/V series MPUs with DRP-AI accelerators.

IC’Alps released information that Tiempo Secure has earned Common Criteria certification from ANSSI French state agency as a significant stage of its three yearlong partnership implementing Secure Element IP together.

Sealevel Systems announced its Flexio Fanless Industrial Embedded Computers leveraging a Quad-core Intel Atom or Core processor. The computers were developed to deliver power, connectivity, and performance that make them an ideal controller for automation, point-of-sale, test and measurement, medical, and security applications.

GÖPEL electronics’ SYSTEM CASCON software platform featuring Test Coverage Analyzer (TCA) has been an effective tool delivering comprehensive data regarding test coverage and potential test gaps including information on which nets and pins have been tested adequately and which have not. During electronica 2024, GÖPEL electronic will introduce an innovative development with smartTCA. According to the company, it is the world's first artificial intelligence (AI) supported test coverage analysis tool for use with embedded instruments.
 

Taipei, Taiwan. Advantech introduced the IPC-610-P, a 4U rackmount chassis that delivers 850W and 1200W ATX 3.1 power supplies, making it well-suited for the NVIDIA RTX 6000 Ada Generation GPUs. It was engineered to accelerate the implementation of smart AI IoT technology. Optimized for machine vision and automated optical inspection (AOI), the IPC-610-P is ideal for the semiconductor industry for its high-efficiency computing and enhanced performance and stability.

TDK Corporation will showcase its solution portfolio at electronica 2024 in Munich, Germany from November 12 to 15, 2024. Visitors to Booth B5.179 will experience the recently determined long-term vision “TDK Transformation. Accelerating transformation for a sustainable future”.

Kirkland Washington. Alliance Memory announced the expansion of its high-speed CMOS mobile low-power SDRAMs with a new single-channel 16Gb LPDDR4X device. It merges higher power efficiency with enhanced clock speeds and data rates in a 200-ball FBGA form factor.

Austin, Texas. Silicon Labs delivered the opening keynote for the inaugural embedded world North America. CEO Matt Johnson and CTO Daniel Cooley discussed how AI is innovating IoT, while also highlighting the company's upcoming Series 3 platform.

Santa Clara, California. RISC-V International revealed the ratification of the RVA23 Profile. RVA Profiles allow implementations of RISC-V 64-bit application processors that run OS stacks from standard binary OS distributions.

Munich, Germany. Codasip generously donated its newly developed Software Development Kit (SDK) for CHERI to the communal CHERI Alliance, and makes the SDK freely available for download on GitHub. CHERI (Capability Hardware Enhanced RISC Instructions) is an innovative security technology established by the University of Cambridge in collaboration with SRI International.

GÖPEL electronic announced its Multi Line product family, an innovative platform of inspection systems that supports the manufacturing process. The crux of the solution is a modular base system with a robust software interface to enable the reduction of training constraints, tedious employee scheduling, and the optimization of discourse between production staff.

During this year’s RISC-V Summit, CAST will be in booth S13 demonstrating its processors offered in ASICs or FPGAs for embedded systems, Internet of Things edge devices, industrial control systems, automotive, and aerospace applications. CAST’s RISC-V IP core line features processors focused on competitive 32-bit solutions in Functional Safety and Ultra-Low Power.

Rugged Science released its Nomad Series 3U 19" Rugged Rack Mount Server, designed for harsh atmospheres with flexibility for specific use cases. The Nomad 3U is ideal in mission-critical environments being built inside a 3U form factor and delivering next-generation processing power, extensive storage capacity, and advanced connectivity options.
 

Monrovia, California. Parasoft released news it has earned TÜV SÜD certification for the development of its C/C++test CT (continuous testing) product. Its C/C++test CT enables test automation following safety standards including ISO 26262 for automotive, DO-178B/C for aerospace, IEC 62304 for medical devices, EN 50128 for rail systems, and IEC 61508 for industrial automation and manufacturing applications.
 

Silicon Labs attended the inaugural embedded world North America exhibition and delivered an opening keynote from CEO Matt Johnson and CTO Daniel Cooley conferring how AI is driving innovation in IoT, while noting the expertise of the company's growing Series 2 platform and upcoming Series 3 platform.