Embedded Computing Design

CEA-Leti released it has achieved a milestone by integrating a scalable hafnia-zirconia ferroelectric capacitor platform into the back-end-of-line (BEOL) of the 22nm FD-SOI technology node making ferroelectric RAM (FeRAM) a formidable memory solution for cutting-edge nodes. Ferroelectricity in HfO2-based thin films are CMOS compatible and scalable while opening innovation for embedded FeRAM.

Taipei, Taiwan. IBASE Technology Inc. announced the IB996 Full-Size CPU Card leveraging the 14th, 13th, and 12th Gen Intel Core i9/i7/i5/i3 desktop processors. It follows the PICMG 1.3 standard and includes the Intel Q670E chipset for enhanced performance and flexibility. The IB996 supports up to 64GB of DDR5 memory with dual DIMM slots and enhanced networking ability with two Intel 2.5G LAN ports.

Active Silicon introduced its rugged Oncilla family of industrial machine vision computers powered by the Intel Alder Lake processor and includes16GB DDR5 SDRAM memory, multiple expansion options, and extensive I/O. The first models are the CoaXPress, Camera Link, and the palm-sized Oncilla Mini.

DFI launched the RAP310, a high-performance microATX industrial motherboard developed for everyday industrial computing, AI applications, and medical image systems. 

Virtium has acquired Embedded Artists, headquartered in Sweden, to enhance Virtium’s offerings within edge computing, artificial intelligence, and high-performance industrial computing markets.

Taipei, Taiwan. APLEX Technology Inc., enjoying its 20th anniversary, announced its ARCHMI-S series of fanless industrial HMI products. Included is the Intel Celeron J6412 powered ARCHMI-S-8B that integrates the benefits of both the ARCHMI and AUHMI series. The HMI is available with multiple screen sizes ranging from 7” TFT-LCD to 21.5” TFT-LCD. Included is two USB 3.2 Type A, two USB 2.0 Type A, two COM, one DP port, and two GbE LAN. DDR4 3200MHz SO-DIMM memory up to 32GB, one Mini-PCIe expansion slot and one M.2 E-Key for Wi-Fi/ Bluetooth module are supported.

Apertis 2024 is now available. Apertis is an OS platform for the x86-64, arm64, and arm32 architectures based on Debian and includes an operating system, tools, and cloud services to enhance development consistency. The collaborative platform is ideal for industrial embedded devices and is utilized in both the Atari VCS game console and the Bosch D-Tect 200 wall scanner. Apertis targets industrial embedded devices with new features including support for Podman, ONNX Runtime, OP-TEE, and more.

Flex Power Modules introduced the BMR352, a non-isolated fully regulated DC/DC converter delivering high power in a quarter-brick form factor. Also announced was the compact BMR316, a non-isolated, unregulated DC/DC intermediate bus converter (IBC) developed for AI and ML data center applications.

AAEON released the MXM-ACMA-PUC leveraging a range of 13th Generation Intel Core CPUs up to 35W, with the default processor being the 16 core, 24 thread Intel Core i7-13700TE. It includes an integrated MXM-ACMA module, offering either an embedded Intel Arc A370E or Intel Arc A350E GPU. The MXM-ACMA-PUC supports four LAN ports, (three running at 2.5GbE, and one at 1GbE), two USB 3.2 Gen 2, and two COM ports with RS-232/422/485 functionality.

ADATA announced it is partnering with Advantech to innovate AI and high-performance computing (HPC) with a new series of servers consisting of the SKY-721E3, SKY-821E3, SKY-622G4 MGX, and SKY-722V4. All are integrated with ADATA’s industrial-grade memory.  

Fremont, California. Delta announced Delta Intelligent Building Technologies (DIBT) and labels it as a one-stop shop for smart and sustainable building solutions for North American clients. On December 1, 2024, subsidiaries Amerlux LLC and Delta Controls, Inc. integrated with DIBT, with their company names changing to Delta Intelligent Building Technologies (USA), LLC and Delta Intelligent Building Technologies (Canada), Inc.

To accelerate consumer AI vision, AMobile has employed MediaTek's IoT development platform leveraging the Genio 510 chipset delivering next-generation edge AI processing such as DLA (Deep Learning Accelerator) and VPU (Vision Processing Unit). Ideal applications include AI image analysis systems and intelligent security.

GÖPEL electronic's announced its newest integration of embedded JTAG solutions for the SPEA 3030 DualCore in-circuit tester (ICT) specifically designed for high-volume manufacturing enabling concurrent processing of multiple UUTs with two ICT core executing test sequences simultaneously. Each core has integrated SCANFLEX II BLADE 8 RMx1-A/B/C with inputs including JTAG, SWD, SBW, BDM, and PIC.

Avalue Technology Inc. introduced its AIB-NINX-S, AIB-NINX-SC, AIB-NIAO-S supporting integrated AI SDK, HW, and I/O leveraging the NVIDIA Jetson family. The devices were developed for applications such as AI edge computing, AGV/AMR, defect inspection, traffic monitoring, and medical imaging where object or face detection is needed.

Lanner introduced its ECA-6051, a 2U short-depth edge AI server leveraging NVIDIA MGX reference architecture and NVIDIA’s GH200 Grace Hopper Superchip for 5G edge AI inference. It was developed to enable efficient data transmission with real-time analysis utilizing high bandwidth 5G connectivity.

Ezurio released its certified rugged industrial IoT module, the Sona TI351 Wi-Fi 6 + Bluetooth v5.4 built on the Texas Instruments CC3351 chipset. It supports SDIO and UART interfaces, industrial operating temp range, Wi-Fi and BT LE, utilizing SMT M.2 packaging.

Austin, Texas. VORAGO Technologies and Collabora announced they are partnering to advance the use of open source to realize flexibility for mission critical applications outside of earth’s orbit.

Taipei, Taiwan. VIA Technologies introduced its new fanless NVIDIA Jetson-powered platforms, the VIA AMOS-9100 for Autonomous Mobile Robots (AMRs) and Automated Guided Vehicles (AGVs), and the VIA AMOS-9000 for factory safety and automation, both ideal for innovative AI performance, robust connectivity, and durability.

Sheffield, United Kingdom. sureCore is now licensing its CryoMem suite of Memory IP developed for utilization in very low temperatures necessary for Quantum Computing (QC) applications. This came about at an *Innovate UK-funded consortium to develop cryo-tolerant semiconductor IP. The goal of the project was to design and prove a range of foundation IP that can be licensed to engineers enabling the creation of specific custom Cryo-CMOS SoC solutions. According to the press release, this will help accelerate QC scaling by allowing the migration of the control electronics into the cryostat to be close to the qubits.

Torrance, California. Navitas Semiconductor introduced what it has billed as the world’s first 8.5 kW power supply unit (PSU) powered by GaN and SiC technologies to achieve 98% efficiency, for next-generation AI and hyperscale data centers. The 54V output PSU, optimized for AI applications, complies with Open Compute Project (OCP) and Open Rack v3 (ORv3) specifications while leveraging GaNSafe and Gen-3 Fast SiC MOSFETs arranged in 3-phase interleaved PFC and LLC topologies.