Embedded Computing Design

Tualatin, Oregon. VersaLogic Corp conducted tests and determined that its Sabertooth AI bests the NVIDIA Jetson AGX Orin by bringing 25 times faster AI inferencing. Multiple performance benchmarks and testing protocols were used to assess the inferencing capabilities of the embedded AI platforms. The benchmarks simulated real-world AI workloads and evaluated how well a solution can process tasks like image recognition, object detection, and sensor data analysis.

SECO will demonstrate early samples of its Modular Vision product line at embedded world 2025 (March 11 to 13 in Nuremberg, Germany) where it will exhibit its innovative products developed to alter how industries deliver smart interactive displays within machines and appliances. These Panel PCs, known as HMI (Human-Machine Interface) assemblies, provide a complete embedded computing platform with a display, eliminating the need for OEMs to invest in extensive development.

Syslogic released a new rugged computer, its RSA4NA, based on the NVIDIA Jetson Orin Nano System-on-Modules (SoMs) unlocking innovations within generative AI models. After a software update, the platforms power consumption increases from 15 watts to 25 watts allowing the GPU to operate up to 1020 MHz and 67 TOPs.
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Tokyo, Japan. EdgeCortix Inc. released information that its SAKURA-I AI Accelerator is capable for space exploration due to its enhanced radiation resiliency. To analyze EdgeCortix’s AI accelerator’s radiation resistance, NASA Electronic Parts and Packaging Program (NEPP) performed a two-stage test, involving exposure to proton and heavy ion radiation in space-like conditions.

Lisle, Illinois. Molex has released its MMCX Power over Coax (PoC) solution delivering a patent-pending connecting technique to ensure secure and stable bonds while sustaining electrical ground stability. The solution is suited for compact needs where dependable RF connections and constant power delivery are essential including automotive liquid-crystal display (LCD) mirrors, driver monitoring systems, and industrial sensors.

Longsys introduced a 7.2mm × 7.2mm subsize eMMC, that delivers an innovative memory solution for enhancing the physical space of AI wearables. According to the press release, it is one of the smallest subsize eMMCs presently offered. 153 solder balls virtually cover the entirety of the panel.

San Jose, California. Cadence has agreed to acquire Secure-IC enabling it to enhance Cadence’s range of innovative silicon-proven IP, including interface, memory, AI/ML, and DSP solutions. Boyd Phelps, senior vice president and general manager of the Silicon Solutions Group at Cadence commented, “We continue to invest in our comprehensive IP and design services portfolio to provide more complete system solutions for our customers.”

Cincoze released a new addition to its rugged computing DIAMOND product line, the Entry Performance & Compact industrial computer DC-1300 series. It leverages an Alder Lake-N platform Intel Core i3-N305 processor, with support for essential I/O interfaces for industrial applications. The DC-1300 offers wireless transmission solutions such as Wi-Fi, 5G, GNSS, etc., in a 185 x 131 x 56.5 mm chassis.

Hod Hasharon, Israel. Weebit Nano Limited released information it has licensed its resistive random access memory (ReRAM or RRAM) technology to onsemi. Weebit Nano’s ReRAM IP will be integrated into onsemi’s Treo platform delivering embedded non-volatile memory (NVM).

Toradex is launching a new SMARC System on Module (SoM) Family beginning with the SMARC i.MX 8M Plus and SMARC iMX95 System on Module. The SMARC iMX8M Plus delivers machine learning capabilities with power efficiency ideal for companies currently utilizing the i.MX 6, 7 and 8 SMARC-based designs.

BIOSTAR introduced its MS-N97, an Intel Alder Lake-N N97 quad-core processor powered industrial computer developed for various requirements in industrial automation, edge computing, digital signage professionals, system integrators, and more. Networking is made possible utilizing dual 2.5G GbE Intel LAN adapters.

Alif Semiconductor introduced its second generation of its Ensemble family including the E4, E6, and E8 Ensemble MCUs and fusion processors leveraging the latest neural processing unit (NPU) from Arm, the Ethos -U85, and designed for enhanced generative AI workloads.

Percepio announced its Percepio Detect, a new tool redefining how embedded software developers confront testing, debugging, and observability challenges. Percepio Detect supports Observability Driven Development (ODD), enhancing DevOps for embedded systems through its seamless extension of CI/CT workflows.

Flex Power Modules enhanced its compact BMR510 2-phase integrated power stage module with improved efficiency and increases peak current from 140 A to 160 A. The solution integrates 528 µF of onboard capacitance improving transient response while reducing external component requirements and simplifying design.

WEROCK Technologies GmbH is releasing two new rugged high-performance notebooks designed for industrial use leveraging Intel Core Ultra Meteor Lake processors, Intel AI Boost, Arc Graphics, up to 16 cores, a 4.8 GHz turbo clock frequency and up to 64 GB RAM.

Woodcliff Lake, New Jersey. CAST announces its upcoming KiviPQC-KEM IP core and seeks the involvement of early adopters for product evaluations. Integrating the Module-Lattice Key Encapsulation Mechanism (ML-KEM) specified in the NIST FIPS 203 standard, this marks CAST's first step in applying post-quantum cryptography (PQC) algorithms to secure SoC designs.

Greenliant has been awarded a multi-year, multi-million-dollar program for its robust SATA NANDrive EX Series BGA SSDs, featuring EnduroSLC Technology. The GLS85LS SSDs will provide solid-state storage in rugged computers used in critical applications.

RuggON Corporation introduced the VIKING II, a fleet management solution leveraging the Qualcomm Snapdragon 6490 Octa-Core Processor and utilizes Android 14 and Google Mobile Services (GMS).

GÖPEL electronic designed an innovative EMC chamber solution for automotive test applications. The EMC housing delivers the ability to push shielded measurements and tests when assessing a single control unit enabling extended data rates of the signals, and the supply lines, to the control unit keeping it as short as feasible. The enclosure’s absorber material is tailored to diminish constructive and destructive electromagnetic interference. Other shielding measures include galvanic isolation from the mains, mains filters, earthing options and shielded cables.

Developed on the Intel Arc A750E GPU architecture, AAEON's GAR-A750E delivers 28 Xe-Cores and supports various advanced AI development frameworks built in a 236mm x 109mm x 42mm form factor. The GAR-A750E features extensive raw computing power, with a graphics turbo frequency of 2400MHz combined with the AI task acceleration capabilities of the 448 Intel XMX Engines.