Embedded Computing Design

SecurityHQ is partnering with Pylones Hellas to deliver Managed Detection and Response (MDR), Security Operation Center as a Service (SOCaaS), Vulnerability Management as a Service (VMaaS), and Penetration Testing (PT) to Pylones Hellas’s clients.

Eschbach, Germany. Cooling down is a hot topic right now, and SEPA Europe decided to do something about it, at least for cooler chips. SEPA’s HXB100 chip cooler allows for chip cooling on multiple components with one fan, saving the cost and maintenance of having to add more. With mobile devices in mind, SEPA developed the HXB100 in a 100 g, 100 x 75 x 13 mm design.

The Altia DeepScreen-generated graphics code is now compatible with Infineon’s XMC7200 32-bit microcontroller (MCU) running two 350-MHz Arm Cortex-M7 and one 100-MHz Arm Cortex-M0+. To trim design graphics for memory efficacy, Altia’s MCU is delivered with the Altia Binary Asset Manager. Behind the optimization of text shaping and the spacing between letters and characters is a runtime font engine.  

Ottawa, Ontario. Crypto4A Technologies Inc. (Crypto4A) released its QxHSM, a fully featured network-attached Hardware Security Module (HSM) in a blade form factor delivering quantum-safe cryptographic agility, mobility, and scalability.

Oslo, Norway. Recently, unidentified attackers exploited a vulnerability in an ICT platform utilized by the offices of the Ministry of Defense, the Ministry of Justice, and Emergency Preparedness and the Ministry of Foreign Affairs. The exploitation has since been remedied.

Hsinchu, Taiwan. ASIX Electronics Corporation and Avalue Technology Incorporation combined knowledge for the AXM57104 TSN IPC development platform. The solution is designed utilizing ASIX’s AXM57104 TSN Gigabit Ethernet PCIe NIC and Avalue's SLP-WHG fanless industrial computer (IPC) and leverages an 8th generation Intel Core i7 processor with integrated RT-Linux real-time OS. 

"I was addicted to hacking, more for the intellectual challenge, the curiosity, the seduction of adventure; not for stealing, or causing damage, or writing computer viruses."

-Kevin Mitnick

Semtech Corporation and UnaBiz are teaming up to support Sigfox 0G technology on Semtech’s LoRa Edge and future LoRa Connect systems. Users will have assistance in designing products that merge LoRaWAN and Sigfox 0G technologies leading to an increase in the global coverage of IoT applications utilizing LoRa Cloud geolocation on the Sigfox 0G platform.

BCM is set to reveal its low power 3.5" SBC, the ECM-RPLP, powered by Intel ‘s 13th generation Core mobile processors for low cost performance in the size of your palm. Ideal uses include Edge and AI applications utilizing hardware accelerated AI , that leverages Intel’s Deep Learning Boost (Intel DL Boot).The Raptor Lake U-series delivers a fanless operation with 15W processing capabilities with up to 64GB of DDR5 4800MHz memory.

Vecow released its VCM-1000 Series compact embedded computing system leveraging 13th Gen Intel Core i9/i7/i5/i3 processor with Intel H610E PCH. The systems arrive with 64GB of dual DDR5 operating at 4800MHz in a 2U half-rack size design with various I/Os. The VCM-1000 platforms are ideal for fiscally responsible vision control in digital factory, mobile robotics, public security, and other various AIoT/Industry 4.0 applications.

Akron, Ohio. Laird Connectivity is setting to release the Tungsten700 SMARC System-On-Module (SoM) operating with a MediaTek Genio 700 processor and Laird Connectivity's imminent Sona MT320 Wi-Fi 6/Bluetooth 5.3 module that was designed after the MediaTek Filogic 320 Wi-Fi/Bluetooth combo radio. The combination forms a complete compute and connectivity solution.

Sophia Antipolis. Since the inception of ETSI’s Industry Specification Group on Reconfigurable Intelligent Surfaces group (ISG RIS) in 2021, it has promoted innovations including the discovery and narrative of real-life RIS-related environments. Recently, the group released the report, ETSI GR RIS-003, in which readers can learn differing communication models consisting of electromagnetic accuracy, path-loss and multipath propagation effects, and the effect of interference.

Hillsboro, Oregon. Lattice Semiconductor is continuing to grow its application-specific software solution stack family with the unveiling of its Lattice Drive solution stack for automotive applications. The software has been designed to aid in the development of in-vehicle infotainment display connectivity and data processing assets, including advanced multi-display connectivity and data processing.

Arm has been a supporter of Collabora’s open-source Mali GPU driver since 2020 and has now released information on expanding its partnership with Collabora by supporting innovative designs leveraging Collabora’s Panfrost GPU driver. The integrated upstream Linux Kernal driver is utilized along with Mesa user-space driver to excel development of post-modern GPUs.

The latest version of Universal Debug Engine (UDE) 2023 from Programmierbare Logik & Systeme (PLS) offers debugging and testing of designs developed for Infineon's TRAVEO CYT4DN MCU to aid in innovating dash instruments as wells as more effective head-up displays in vehicles. Included are two Arm Cortex M7 cores reaching 320 MHz with designated subsystems for graphics and sound. The singular chip supports 6 Mbytes Flash, 640 Kbytes SRAM, and 4 Mbytes embedded video RAM (VRAM).

Norwood, Massachusetts. United Electronic Industries (UEI) updated its cybersecurity solutions for utilization in its platforms to meet the demanding criteria of aerospace and defense systems. The innovations address secure boot, secure key generation, FIPS 140.2 encryption, and Trusted Platform Module (TPM) integration for aid with NIST 800-213* compliance.

New Taipei City, Taiwan. A new embedded box PC from Aetina leverages NVIDIA for an edge AI platform utilizing the Jetson AGX Orin, Orin NX, and Orin Nano system-on-modules (SoMs). A designed heat sink provides maximum cooling in the fanless compact enclosure as it also reduces maintenance once deployed. The solutions operate within a temperature of -25°C to +55°C delivery AI performance across many verticals.

Taipei, Taiwan. ASUS IoT, released its NVIDIA Jetson Orin series powered ultra-compact PE1100N AI inferencing platform. An Arm processer is integrated with the NVIDIA GPU providing flexibility at the edge in applications such as smart city, transportation, traffic analysis, people-tracking, counting, and surveillance. The PE1100N leverages up to 100-trillion operations per second (TOPS) running on low-power (10-25 W) while supporting deep learning and computer-vision.

Vancouver, Washington. DIGISTOR is treading closer to having its Citadel C Series SSDs meeting the requirements for CC certification and CSfC listing. Recently, its Pre-Boot Authentication (PBA) has been listed on the National Information Assurance Partnership (NIAP) Common Criteria Products in Evaluation List.

Seoul, South Korea. Samsung is preparing to release its modern automotive Universal Flash Storage (UFS) 3.1 memory solution developed to enhance in-vehicle infotainment (IVI) systems. The UFS series will arrive in a choice of 128, 256, and 512-gigabyte (GB) models allowing car makers to deliver the best customer experience while including a battery life management that extends the device efficacy in electric or autonomous vehicles.