Embedded Computing Design

If you are searching and needing AIoT hardware service solutions, make sure to visit hall 3 booth 530 at embedded world 2023, where Seeed will be highlighting its edge computing systems. Seeed provides open technology and agile manufacturing services, with the mission to make hardware more accessible and lower the threshold for hardware innovation.

The need for storage is only going to grow with data and more data being used for the consumer, corporate, and industrial segments. BIWIN Storage Technology CO., Ltd. will be highlighting its reliable flash storage at embedded worl 2023.  BIWIN is known for its independent development capabilities in hardware, software, firmware and storage algorithms.

Hsinchu, Taiwan and Uppsala, Sweden. Andes Technology and IAR collaborated on  ILITEK’s Touch and Display Driver Integration (TDDI) SoC, ILI6600A. The SOC integrates the Andes N25F-SE ISO 26262 certified V5 RISC-V CPU core, and the IAR certified Embedded Workbench toolchain for RISC-V.

CONTACT Software is working on innovating Asset Administration Shell (AAS) as a new member of IDTA - International Digital Twin Association. The open-source project has a goal to standardize AAS in industry solutions. The shell builds the architecture for end-to-end data cycles between companies, plants, and IT platforms. The AAS connects and defines a device twin to enable a better collaboration amongst manufacturers, suppliers, and customers.

New York. Claroty’s Team82 released findings that showed a 14% decline of cyber-physical system vulnerabilities disclosed in 2H of 2021 to 2H 2022, in its State of XIoT Security Report: 2H 2022. However, the research team did find an increase of 80% more vulnerabilities found by product security teams over the same time. Claroty describes their disclosure having an optimistic effect on the security of the Extended Internet of Things (XIoT) in environments across a vast array of industry applications such as, industrial, healthcare, and commercial.

Sydney. CAP-XX launched its 750mF DMV750 ultra-thin 2.2mm prismatic 3V supercapacitor delivery efficient storage and distribution of energy to power optimized protocols in space-constrained and mission-critical electronic devices. With support for the general 3V coin cell battery, the supercap will get to a greater maturity, substitute 3V cylindrical supercaps, or remove the need for batteries. Micro-energy harvesting, if enough extraction of solar, vibration, RF, or other environmental energy, will sustain a non-battery environment.

Barcelona. The European Union has funded the  SAFEXPLAIN (Safe and Explainable Critical Embedded Systems based on AI) project that began October 2022. The initiative lays the groundwork for Critical Autonomous AI-based Systems (CAIS) as an important aspect of functional safety requirements. CAIS  need real-time responses for safer edge applications. The project is currently scheduled for three years and brings together a consortium of six partners from academia and industry.

Our industry is in a constant flux of firsts and lasts. What will be the last it standing? According to Darwin, “It is not the strongest of the species that survives, not the most intelligent that survives. It is the one that is the most adaptable to change.” And on his five year Voyage of the Beagle, Darwin made time to stop in Australia where he saw a great variety of animals including some mesmerizing snakes.

Embedded world 2023 will include Greenliant amongst its registered vendors. It will be located at hall 4A booth 606 highlighting its wide range of industrial solid state storage products, including EnduroSLC SSDs that showcase superior data retention, advanced hardware ECC capabilities, and NAND flash management algorithms at a ultra-high endurance of 300K P/E cycles. Greenliant's high-capacity industrial SSDs are designed to surpass current requirements for aerospace, defense, communication, security, and transportation markets for safety-critical deployments.

Geneva, Switzerland. “Today we are unveiling the world’s first MCU AI Developer Cloud, which works hand-in-glove with our STM32Cube.AI ecosystem. This new tool brings the possibility to remotely benchmark models on STM32 hardware through the cloud to save on workload and cost,” said Ricardo De Sa Earp, Executive Vice President General-Purpose Microcontroller Sub-Group, STMicroelectronics, about the release of its STM32Cube.AI desktop front-end.

TDK Corporation introduced its 10BASE-T1S (3.2 x 2.5 x 2.5 ㎜ (L x W x H)) common mode filter for automotive Ethernet capable of high S-parameters (Scattering parameters) and a maximum line-to-line capacity of 10 pF. Integrated in the design are laser welded connections to terminals for thermal shock endurance and efficiency with operating temperature range from -40 to +125 ℃.   

Munich, Germany. Infineon Technologies has designed its PDM (pulse density modulation) MEMS microphone solutions to deliver the essential building blocks of MEMS and ASIC technologies. Adding to its previous MEMS technology, Infineon released its ultra-low power digital microphone, the IM69D12, to its XENSIV MEMS microphone series.

I have mentioned it before on our Road to embedded world, I love staying close to home. On a short trip, we visit Everspin Technologies where we are treated to view its EM064LX, a high performing persistent memory capable of reading 400 Megabytes per second connected to eXpanded SPI interface, and byte level addressability The EM064LX has over 4X the capacity of earlier serial non-volatile memories, and is a long-term solution with the user not having to worry about wear. It will retain its data for >100 years at 70 degrees Celsius. Everspin will be presenting the future of unified memory at embedded world 2023.

Calabasas, California. Spirent Communications plc  made available its compact M1 Appliance for assessing Ethernet and Automotive Ethernet in future solutions. The customizable Spirent M1 Appliance  is an ideal instrument lasting to complete maturity serving as an efficient benchmark testing of network designs, specifically architecture, with continuous validity of SDN and NFV innovations. The solution delivers a high of eight network interface card (NIC) openings. “Spirent is committed to supporting the evolving testing needs of the IP networking and automotive sectors,” said Aniket Khosla, Spirent’s VP of Cloud and IP Product Management.

Flex Power Modules released its PKB5213D eighth brick DC-DC including a wide 18-60 V input range to include 24 V and 48 V nominal inputs, and a fully regulated 12 V output rated at 20 A/240 W. The modules are certified to IEC/EN/UL 62368-1 with an isolation of 2250 VDC input to output.

A great resource for industry, GitHub will be at embedded world 2023 in Hall 4 booth 4-501a showcasing how it empowers developers across any industry to do the best work of their lives.

San Diego, CA. congatec will be highlighting its comprehensive COM-HPC ecosystem in hall 3 booth 241 during embedded world 2023. On display will be the COM-HPC Server-on-Modules and ultra-compact COM-HPC Client-on-Modules that around the size of a credit card. The series can easily migrate to the new PICMG standard devoid of significant modification of the internal system and housing.

Top Display Optoelectronics Co., Ltd (TDO) will be positioned in booth 1-158b during embedded world 2023. TDO’s booth will highlight its innovative solutions consisting of 0.2 inch-15 inch small and medium size TFT-LCD modules and total display solutions.

Stadtroda, Germany. February 9, 2023 – Allied Vision ratified its Software Development Kit Vimba X delivering GenICam compliant and current standards revisions. The Vimba X is collaborates with the Alvium camera series with full Alvium feature set support.

 

Nuremberg, Germany. Logic Fruit Technologies will be demonstrating its innovative solutions for industrial embedded environments at embedded world 2023. Visit Logic Fruit Technologies in Hall 2, booth 2-655.