Embedded Computing Design

From October 8 – 10, embedded world North America will hold its premiere in Austin, Texas. Experts int the embedded systems industry will meet at the Austin Convention Center in the “Silicon Hills” of Texas, USA. embedded world North American is organized by subsidiary NürnbergMesse North America Inc.

Rome, Italy. Exein raised €15 million, led by 33N, an expert investor in cybersecurity and infrastructure software, and Partech joining in. Existing backers United Ventures, eCAPITAL, and Future Industry Ventures (a Redstone/SBI fund) also participated. The funding will support Exein’s growth across Europe, the US, and Asia. 

AAEON released its 70mm x 70mm Qseven form factor AQ7-ADN CPU module leveraging Intel’s innovative processors from the 6W Intel Processor N200 and N50 to the 15W Intel Core i3-N305. For processing speed, the AQ7-ADN offers up to 8GB of high-bandwidth soldered LPDDR5x system memory with up to 64GB of eMMC for storage and SATA support delivering four PCIe slots.

ATTEND launched its 2-in-1 stacked card connector designed to redefine space efficiency and functionality in electronic components. Supporting Micro SD, Nano-SIM, and Micro SIM cards, it enables competent data transfer while optimizing PCB space usage.

blukii unveiled an innovative Bluetooth beacon incorporating the ATM33 system-on-chip (SoC) from Atmosic Technologies. Utilizing Atmosic’s ultra-low power technology, the beacon features the longest battery life in its class.

Santa Clara, California. FMS: the Future of Memory and Storage announced its pre-conference Professional Development Series (PDS) on Monday, August 5^th. The talks will feature four educational seminar tracts giving visitors the chance to earn FMS Professional Development certificates. The seminar presenters are well-respected technologists from Elephance Memory, Meta, Microsoft, OCP, Quantum Technology, Seagate, and Wolley.

During October 8 - 10, 2024 in Austin, Texas, embedded world North America will host leading experts, key players and industry associations in the embedded community. embedded world North America offers an incomparable insight into the world of embedded systems including components and modules to operating systems, hardware and software design, M2M communication to services, and the numerous issues of a complex system design.

Taipei, Taiwan. Neousys has added the waterproof and dustproof NRU-230V-AWP and NRU-240S-AWP series to its Jetson family. The solutions leverage NVIDIA’s Jetson AGX Orin system-on-module with eight GMSL2 ports (NRU-230V-AWP only), four PoE+ GbE, and one 10GbE.

Kirkland, Washington. Alliance Memory announced the release of its 5GB ASFC5G31P3-51BIN and 10GB ASFC10G31P3-51BIN industrial-grade 3D pSLC embedded multi-media card (eMMC) integrating reliable 3D pSLC NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a 11.5 mm by 13 mm by 1 mm 153-ball FBGA form.

MSI has announced its innovative industrial lite box product, the MS-C918, designed to meet the various needs of modern industry with a focus on cost-effectiveness, ease of use, and portability. The palm-sized platform leverages Intel’s Alder Lake-N N100 Processor.

Taipei, Taiwan. BIOSTAR released its BIAST-PAT industrial motherboard designed to meet the various requirements of System Integration (SI) businesses. The platform is ideal for applications in AIoT machines, automation systems, edge computing devices, HMI machines, and digital signage. It has integrated M.2 Key-M, Key-B, and Mini-PCIe slots for connectivity.

Wincomm released its enhanced WTC-9H0 Waterproof BOX PC leveraging the Intel Core i5-1245UE processor and delivering a performance boost of up to 4.4 GHz. It is designed to meet the conditions of clean rooms, food processing, pharmaceutical, and chemical manufacturing environments. The WTC-9H0 fanless embedded BOX PC is held in a 304 stainless steel enclosure providing IP69K-rated protection against water and dust.

Lanner Electronics Inc announced its EAI-I730 modular high-performance Edge AI platform delivering high performing processing capabilities for real-time AI inference at the industrial edge. The EAI-I730 leverages the 12th Gen Intel Core i9/i7 processor (Alder Lake-S) and supports up to 128GB DDR4 RAM. Included I/O options are 2x 2.5G RJ45, 2x RJ45 for Console and LOM, 8x USB 3.2, 2x COM, 4x DIO, audio ports, and video outputs (DP/HDMI), making it suitable for compute-intensive industrial AI applications.

Taipei, Taiwan. Unitech is offering its RT112 rugged tablet aimed to improve efficiency across industry. It is built within a slim and portable form factor and delivers Wi-Fi 6E and 5G technology and support for ARCore. The 8x8 stream sounding capability enhances signal clarity and range, allowing multiple devices to operate concurrently without experiencing network obstruction.

ATTEND launched the 123A Series M.2 NGFF (Next Generation Form Factor) Connectors delivering high-speed data transmission proficiencies and compatibility with PCI Express 3.0, SATA 3.0, and USB 3.0, while being compliant with PCI-SIG PCIe M.2 specifications.

Vecow and Kudan revealed a the release of Vecow’s Turnkey SLAM Kit (VTK SLAM Kit). Integrating Vecow’s ultra-compact fanless system with added sensors and IMUs, along with Kudan’s SLAM technologies, this collaboration aims to cater to the rising demand for navigation and mapping solutions in unknown environments.

Innominds has announced a strategic partnership with Minerva CQ to provide the industry with a one stop AI solution (strategy, technology, and services) designed to deliver modernization to ISVs, OEMs, and enterprises serving software and hi-tech, life sciences, construction, automotive, logistics, and transportation.

Autotalks and Rolling Wireless published news of a collaboration directed to accelerate the deployment of next-generation V2X solutions. To fulfill the increasing demand for 5G-V2X solutions from vehicle, e-bike, and road infrastructure equipment manufacturers, Rolling Wireless found its partner in Autotalks’ SECTON3 and TEKTON3 chipsets.

Aliso Viejo, California. indie Semiconductor, Inc. publicized the addition of a technologically advanced iND880xx product line to its vision processor portfolio.

Henderson, Nevada. Velasea has announced its strategic partnership with Cincoze, where Velasea will start developing Cincoze Industrial PCs for automation and computer vision applications. Leveraging Cincoze’s innovations, Velasea will design high-performing solutions to meet specialized needs in manufacturing, railway, in-vehicle, warehouse and logistics, energy, and security and surveillance.