Embedded Computing Design

I remember being in kindergarten and watching the Challenger rip apart 73 seconds after launch. There were two classes in the room that day watching the TV in shock, and me, with the wonder of what is really out there. Haruki Murakami in Kafka on the Shore sums up perfectly how I perceive space. “Beyond the edge of the world there’s a space where emptiness and substance neatly overlap, where past and future form a continuous, endless loop. And, hovering about, there are signs no one has ever read, chords no one has ever heard.”
 

Uppsala, Sweden. IAR Systems has announced that it will be leveraging the PX5 RTOS for its IAR Embedded Workbench, a full design toolchain including a IAR C/C++ Compiler and next generation debugging protocols.

AAEON has released the BOXER-8641AI driven by a 12-core ARM Cortex-A78AE v8.2 64-bit CPU including NVIDIA’s Ampere architecture supporting the NVIDIA Jetson AGX Orin 64GB module. NVIDIA technology ups the performance to 275 TOPS making it eight-times faster than current generation AI performance capabilities.

In Khaled Hosseini's book, A Thousand Splendid Suns, he writes, “Tell your secret to the wind, but don’t blame it for telling the trees.” Today, I am the wind, and you are the trees as we are off to Arezzo to visit some pals at SECO as they divulge the secrets they are taking with them to embedded world 2023. 

Västerås, Sweden, Percepio AB is supporting the release of the fifth-generation RTOS, the PX5. The PX5 RTOS operated on a native implementation of the standard POSIX pThreads API. It will embed the Percepio Tracealyzer 4.6 trace recorder with Percepio supporting the PX5 RTOS with a commercially accessible solution.

Nestled in Wichita State University’s Innovation Campus, Siemens Digital Industries Software has cut the red tape on the 3,000 SQFT eXplore Live at The Smart Factory @ Wichita. Deloitte and other partners will deliver a completely functional smart production line with exploratory labs for engineers to hone their skills. Deloitte combines an environment with industry leaders teaching innovative technologies and strategies needed for today's and tomorrow's Industry 4.0.

Tessenderlo, Belgium. Melexis announced the MLX91230 and the MLX91231 optimizing shunt or Hall type sensor technology. Both are ASIL compliant (ISO 26262 functional safety standard) and measure current, temperature, and voltage. The devices are flexible for reusability in EV power environments.

"Intelligence is the ability to adapt to change." — Stephen Hawking

“The measure of intelligence is the ability to change.” ― Albert Einstein

Santa, Clara, Calif. OMNIVISION, released its new automotive grade 1.3-megapixel (MP) OX01E20 system-on-chip (SoC) for surround view systems (SVS) and rear-view cameras (RVC). Also included is LED flicker mitigation (LFM) and 140db high dynamic range (HDR) capabilities.

Tokyo, Japan. Renesas Electronics Corporation released information on its RAJ2930004AGM, a gate driver IC developed to operate high-voltage power devices such as IGBTs (Insulated Gate Bipolar Transistors) and SiC (Silicon Carbide) MOSFETs for electric vehicle (EV) inverters.

Melborne, Australia. Clarinox Technologies is integrating ClarinoxBlue Bluetooth and ClarinoxWiFi protocol stack software into the PX5 RTOS optimizing wireless connectivity in embedded devices. Designers can utilize the software for efficient connectivity with components, sensors, and networks.

Utilizing a constellation of satellites, Orbital Sidekick (OSK) keeps an eye on gas pipeline leaks using hyperspectral imagery employing NVIDIA edge AI technology.

TDK Corporation announced the upcoming release of its new B33331I6 series. The family contains compact EPCOS motor-run capacitors certified safety class S2 and the IEC 60335-2-24 standard being brought to market in 2023. When released, TDK believes it will be the smallest compact motor-un capacitors in the industry. Diameters of “the robust aluminum cans” are 30mm or 35mm, with vertical measurements of 73mm and 103mm. The measurements include all connections for accurate designs.

Klein-Winternheim, Germany. The safety certifiable Simulink has been embedded with PikeOS, a real-time operating system and hypervisor. Simulink is a modeling software extension from Matlab ideal for designing technical-physical and financial mathematical models. The models are translated into binary by way of Matlab's Embedded Coder and executed through PikeOS.

SYDNEY. Morse Micro and Chicony Electronics have combined forces to provide Wi-Fi CERTIFIED HaLow IP cameras to industry developers. The partnership aims to boost the range and reliability of imaging equipment with next-generation innovations. By integrating Wi-Fi HaLow, the wireless camera platforms provide 10x more reach than current Wi-Fi 6 cameras operating at 2.4GHz and 5GHz.

Quectel Wireless Solutions released its advanced automotive safety integrity levels (ASIL) solution for optimal precision and reliability for deterministic in-lane positioning with level ASIL B for ADAS and AD systems. The platform leverages the Quectel’s LG69T-AB automotive module supporting Trimble software positioning engine, Trimble RTX correction service, the ST Micro ASIL-rated TeseoAPP GNSS chipset, and the Murata SCHA600 ASIL inertial measurement unit (IMU).

T2M released its certified ISO 26262 and AEC-Q100 Automotive Grade Silicon Proven IP Cores as small as 7nm for must have connectivity in automotive applications. T2M supports solutions needing CAN Bus IP Cores and LIN Bus IP Cores certified with ASIL (Automotive Safety Integrity Level) packages with all four safety levels ASIL A, B, C, and D.

Irvine, California. Telit Cinterion announced the verification of its 5G FN980 and FN990 series data cards. It features an NVIDIA Ampere architecture GPU utilizing 8-core Arm Cortex-A78AE CPUs.

Munich, Germany. Infineon made available its MOTIX 3-phase 160 V silicon-on-insulator (SOI)  gate driver, IC 6ED2742S01Q, with an embedded power management unit (PMU) in a QFN-32 pack including a thermally effective exposed power pad. It contains bootstrap diodes powering three external hi-side bootstrap capacitors by way of a trickle charge pump supporting 100% duty cycle management.

San Diego, CA. congatec released its HPC/cRLS, socketed COM-HPC Client Computer-on-Modules (CoM). It is centered on 13th Gen. Intel Core processor variants with up to 34% multi-thread and up to 4% single-thread performance. It carries an additional 25% faster image classification inference compacity when juxtaposed with the previous12th Gen Intel Core processors. Further boosts in performance include, USB3.2 Gen 2x2 bandwidth of up to 20 Gigabit per second on the Size C CoM.