Embedded Computing Design

TDK Corporation introduced the InvenSense SmartAutomotive IAM-20680HV, a high-value 6-axis Inertial measurement unit (IMU) for automotive applications involving rugged environments including those with temperatures towards +125 °C. It integrates a 3-axis gyroscope and a 3-axis accelerometer in a 3 x 3 x 0.75 mm3 (16-pin LGA) footprint.

Malmö, Sweden. Virtium Embedded Artists launched the iMX8M Mini DX-M1, a system-on-module (SOM) combining a quad-core application processor and a 25 TOPS AI hardware accelerator chip with associated memory in a compact 82mm x 50mm footprint. The solution is built around NXP’s i.MX 8M, an application processor which features four 1.6GHz/1.8GHz Arm Cortex-A53 CPU cores backed by 2GB of LPDDR4 memory, and a 400MHz Cortex-M4 controller core. The platform integrates a DEEPX DX-M1 AI neural processing unit (NPU) into the SOM.

Santa Clara, California. xMEMS Labs, Inc. is expanding its µCooling fan-on-a-chip platform into XR smart glasses, delivering a one of a kind in-frame active cooling solution for AI-powered wearables. µCooling supports localized, precision-controlled active cooling hidden within the glasses without changing the frames design.

 

Solid Sands revealed its accomplishment of attaining ISO 9001 certification thanks to real work put in by the entirety of the Solid Sands team. The achievement adheres to the company’s dedication to supporting innovative services and superior products.

Klika Tech and STMicroelectronics will co-exhibit at Sensors Converge 2025 highlighting two production-ready Solution Accelerators leveraging Amazon Sidewalk and STM32 microcontrollers. Visit booth 936 for live demonstrations focusing on how the intelligent edge solutions utilize sensors and low-energy connectivity from Amazon Sidewalk to unlock scalable real-time analysis supporting low-cost deployments for Smart City applications.

Nordic Semiconductor announced its acquisition of intellectual property and core technology assets of Neuton.AI. The procurement combines Nordic’s nRF54 Series ultra-low power wireless SoCs with Neuton.AI’s neural network framework to deliver scalable, high-performance AI for ML at the edge.

MEMPHIS Electronic announced it has extended its portfolio by adding XSemitron Technology, a manufacturer of highly efficient NAND flash and NOR flash memory components. The new partnership will reinforce MEMPHIS Electronic extensive lineup of memory innovations.

Monrovia, California. Parasoft has enhanced its static and dynamic testing solution for C and C++ software developers. The new Parasoft C/C++test 2025.1 quickens safer, secure, and high quality software while mitigating real-world failures, compliance overhead, and support costs.

AdaCore and CodeSecure have agreed on a merger arrangement. It will develop an incorporated company dedicated to enhancing software safety, security, and consistency across various markets. AdaCore will share its knowledge in efficient software development for defense, aerospace, rail, and automotive applications. CodeSecure is to include its application security testing, such as advanced static analysis abilities that identify and mitigate vulnerabilities in embedded systems.

Xylon is celebrating its 30th anniversary this year. For over three decades it has driven innovation in embedded systems and developed solutions for automotive, defense, industrial automation, and medical. At the start, Xylon focused on FPGA-based graphics processors, now the company’s evolution has led it to be a reliable provider of scalable, high-performing solutions.

 

Avalue Technology Inc. introduced its leading-edge COM-HPC module, ESM-HRPL, along with the highly efficient carrier board EEV-HC10, delivering reliability and modular scalability to AI inference, smart healthcare, industrial automation, and intelligent energy systems applications.

Compex recently released its Just Wi-Fi⁷ Wi-Fi module developed for speed, simplicity and scalability. Unlike general Wi-Fi module design, the Wi-Fi⁷ connects via Ethernet protocols (10Gbps) as the host uses the module as an Ethernet port. Wi-Fi decisions like Multi-Link Operation (MLO), etc. are managed inside the module.

Out of Europe comes news that two leaders in the manufacturing of FPGA modules and suppliers of development and design services, Trenz Electronic GmbH (Trenz) and Knowledge Resources GmbH (KR), have agreed to a technological partnership to enhance the European FPGA SoM ecosystem.

AAEON and Qualcomm Technologies, Inc. are collaborating to speed up the implementation of innovative embedded IoT solutions enhancing medical, industrial automation, and transportation applications. The partnership utilizes AAEON's expertise in manufacturing and its early access capabilities to deliver customized market-ready solutions leveraging Qualcomm’s Dragonwing processors.

Guangzhou, China. Robustel introduced its EG5120 Industrial IoT Edge Gateway designed for real-time data processing, analytics, and control at the edge. It offers a secure and highly flexible platform for cutting-edge IoT applications in smart manufacturing, energy, and smart building markets.

Wirral, United Kingdom. LDRA publicized it joined both the Renesas Ready Partner Network and the R-Car Consortium. The relationship extends LDRA's support to seamlessly incorporate system development tools utilizing Renesas R-Car system on a chip (SoCs), microprocessors (MPUs), and microcontrollers (MCUs) that are required to be in full compliance with industry-wide functional safety and cybersecurity standards.

Greg Semeraro, an embedded and real-time system professional, released Embedded Real-Time Operating System Design, a complete examination of the theory, analysis, performance, portability, and implementation of RTOS.X. Four diverse hardware platforms are included providing various architectures to evaluate.

Lanner Electronics released the ECA-5555, an innovative compact edge server leveraging the Intel Xeon 6 SoC, previously codenamed Granite Rapids-D. The platform is designed for high performing, scalable AI-accelerated virtualized RAN and edge compute applications. It is ideal for both a Distributed Unit (DU) or Centralized Unit (CU) server for 5G RAN intelligence.

OnLogic launched its scalable Helix 520 Series designed for the next generation of edge computing. The series leverages the latest Intel Core Ultra processors with integrated edge AI capabilities, and industrial-grade reliability ideal for automation, machine learning, edge AI, computer vision, robotics, and autonomous systems.

Wavelynx Technologies collaborated with McObject in order to introduce eXtremeDB’s interoperable embedded database into Wavelynx’s innovative building access control reader. The partnership allows real-time data management for secure and scalable access control in commercial applications.