Embedded Computing Design

The Zephyr Project announced new Silver members joining its ecosystem including Chengdu Jingrong Lianchuang Technology, Embedd, Savoir-faire Linux, SevenLab and Schneider Electric. For better collaboration across embedded applications and edge computing, BeagleBoard.org and openEuler are becoming Associate members.

Enclustra will be located at Booth 3A-331 during this year's embedded world Germany where it will highlight its next-generation FPGA and SoC innovations. The booth will host an interactive Enclustra Product Wall, highlighting the latest Andromeda RFSoC and SoC modules, including the powerful Andromeda XRU50, the newly introduced XRU30 for scalable, high-performance RF applications, and the Andromeda XVE70 based on AMD Versal SoC for advanced edge AI and signal processing.

Avalue Technology will be exhibiting during embedded world 2026 in Nuremberg, Germany, at Booth 3-465 where it will demonstrate its innovations under the motto “Empowering the Edge, Integrating the Future”. Highlighted will be the company’s Edge AI, HPC (high-performance computing), and embedded computing platforms enabling efficient, reliable, and long-term maintainable smart edge architectures.

ARBOR Technology is expected to demonstrate its innovations at embedded world Germany from March 10–12, 2026 in Nuremberg, Germany. ARBOR Technology’s Booth, No. 3-364, will be centered on the theme of “From Edge to Action.” Highlighted at the booth will be its COM-HPC modules and edge AI computing solutions ideal for data-driven actions across medicine and intelligent transportation applications. Booth demonstrations will include embedded products powered by Intel, NVIDIA, and AMD.

While at embedded world Germany, Linutronix will exhibit its first flexibly adaptable and real-time-capable Linux platform, IGLOS (Industrial Grade Linux Operating System), where security is the foundation of a TÜV SÜD–certified product aligned with IEC 62443-4-2. The platform offers a thorough security architecture with secure boot, mandatory access control, firewall, memory integrity and encryption, audit logging, and a secure OTA update mechanism.

Texas Instruments and Silicon Labs publicized that the two companies have signed a decisive arrangement in which Texas Instruments will obtain Silicon Labs for $231.00 per share in an all-cash transaction, representing a total enterprise value of approximately $7.5 billion.

TouchNetix introduced the AX24A, further expanding its aXiom portfolio. The AX24A is a touch and force sensing controller designed for industrial, automotive, and entertainment use cases supporting button features as well as force sensing behind conductive surfaces. It delivers innovative sensing abilities in an efficient 40-pin QFN package supporting flexibility and performance. Enabled is up to 22 touch/force buttons, supporting designers in creating native and touch solutions.

Variscite introduced a series of System on Modules (SoMs)/Computer on Modules (CoMs) that is compliant with the Smart Mobility Architecture (SMARC) interface standard. The initial series begins with the NXP i.MX 8M Plus processor-powered VAR-SMARC-MX8M-PLUS delivering NXP’s 1.8GHz Quad Cortex-A53 with 800MHz Cortex-M7 real-time co-processor that combines AI/ML abilities and an advanced Image Signal Processor (ISP) vision system.

The demand for always-on Edge AI workloads is not going away. With the need for continuous processing creating a constant challenge, many system designers must compromise between responsiveness, accuracy, and battery life. To solve this challenge, Innatera has developed Pulsar, a brain-inspired solution enabling pattern recognition that alters how sensor data is processed.

In Hall 1, booth 320 at embedded world Germany (March 10-12, 2026), SECO will demonstrate its fully functioning smart vending/kiosk solution based on the Clea Vend cloud telemetry platform and the KarL4 contactless payment terminal enabling edge-to-cloud connectivity for meaningful insights through ongoing analysis of transactions and usage behavior.

Vodafone IoT is partnering with Skylo Technologies, Inc. to deliver Non-Terrestrial Network (NTN) Narrowband Internet of Things (NB-IoT) satellite connectivity services to customers. The initial phase will see the companies collaborate to test the technology in hopes of offering a full commercial service soon.

IBASE Technology Inc. released the IB96W, its 3.5-inch single board computer (SBC) leveraging an onboard 13th Gen Intel Core i7-1370PRE mobile processor for space constrained embedded systems that command real-time data processing and intelligent control.

GÖPEL electronic will highlight its hardware and software systems for electrical testing and industrial applications in Hall 4, Booth 320 at this year’s embedded world Germany taking place from March 10-12, 2026.

DATA MODUL will exhibit its new compact single-board computer (SBC), the eDM-SBC-iMX95, March 10–12 at embedded world in Nuremberg, Booth 368, Hall 1. The SBC is centered around the latest NXP i.MX95 application processor series and is designed for challenging industrial environments. The eDM-SBC-iMX95 leverages a Hexa-core ARM Cortex-A55 processor with up to 16 GB LPDDR5 RAM (soldered) and up to 128 GB soldered eMMC.

ByteSnap Design launched its WirelessHART product development and certification support services offering wireless communication in process automation and control applications to industrial manufacturers facing comprehensive technical and regulatory challenges when deploying wireless devices in hazardous environments.

PX5 publicized the off-the-shelf functional safety certification of the PX5 NET embedded TCP/IP stack, and in turn, making all three PX5 core products, PX5 RTOS, PX5 FILE, and PX5 NET, now SGS-TÜV Saar certified.

Axiomtek introduced its IMB711, an ATX server-grade motherboard leveraging the Intel C741 chipset. It is powered by the LGA4677 socket for 5th/4th Gen Intel Xeon Scalable processors with up to 270W TDP. The IMB711 is designed for mission-critical applications across AI acceleration, data centers, and advanced healthcare systems.

BIOSTAR announced a new dual-track edge computing approach for its EdgeComp industrial computing portfolio focusing on the growing needs of IoT deployments and edge AI applications. It allows system designers to deploy purpose-built platforms created for specific application requirements. EdgeComp offers two specialized solution paths, the EdgeComp MU-N150 is enhanced for edge computing and IoT environments, while the EdgeComp MS-NANO is engineered to deliver intensive edge AI workloads, including AI vision and intelligent automation.

embedded world Germany 2026 will have PLS Programmierbare Logik & Systeme unveiling the UDE 2026 of the Universal Debug Engine in Hall 4, Booth 4-310. Also on exhibition will be an expanded collection of supported high-end microcontrollers and embedded processors.

Lanner Electronics launched a robotic AI platform designed for next-generation physical AI. The EAI-I351 is designed around the NVIDIA Jetson Thor system-on-module (SoM) to deliver server-class performance for autonomous mobile robots (AMRs), heavy-duty industrial vehicles, and edge-native generative AI applications.