Embedded Computing Design

CES 2026 welcomes Joe Creed, Caterpillar CEO, as a keynote speaker offering insights on how Caterpillar has stayed relevant for 100 years, and how he envisions the next 100. “CES is where innovators show up and bold ideas come to life,” said Gary Shapiro, CEO and Vice Chair, CTA. “I’m thrilled to welcome CEO Joe Creed and Caterpillar to the CES keynote stage to show how technology is transforming the way we build.”

Through three days (November 4-6), the Anaheim Convention Center hosted embedded world North America bringing together design engineers, developers, and technology leaders to share and showcase insights and innovations that are moving the embedded industry toward new horizons.

Trident IoT released its multiprotocol Software Development Kit (SDK) and ELCap command-line development tool for general purchase. It delivers multi-protocol, developer directed tools to accelerate Z-Wave, Z-Wave Long Rang and Zigbee based devices.

Wirral, United Kingdom. LDRA announced that its LDRA tool suite now supports enhanced analysis of timing coupling interference on multi-core architectures. Building on previous data coupling and control coupling tools, the new abilities present designers further insight into multi-core performance while allowing them to mitigate timing issues.

Akasa released the Kepler, a 2U rack-mountable, fanless case for Micro-ATX and Mini-ITX motherboards. It supports passive cooling for Intel Core (12th-14th Gen) and Core Ultra (15th Gen) processors up to 35W TDP utilizing Intel LGA1851 and LGA1700 sockets.

RuggON released its VULCAN 10A commercial-grade 10.4” Android vehicle mounted computer engineered for reliable consistency across challenging industrial environments. The CPU leverages the Qualcomm QCS 6490 CPU and runs Android 14 with Google Mobile Services (GMS) certification.

Kigen has announced that Evergy, one of the largest investor-owned utilities in the U.S. Midwest serving 1.7 million customers, has elected to utilize Kigen’s secure eSIM OS and GSMA SGP.32–compliant eIM solution to strengthen grid reliability and resilience.

VadaTech announced its PCI594 built on the Xilinx VU13P UltraScale+TM FPGA providing over 12,000 DSP slices, 360 Mb of UltraRAM, and 3,780K logic cells. To allow large buffer sizes stored during processing as well as for queuing the data to the host, the FPGA interfaces to the quad QSFP28 modules as well as a single DDR4 memory bank that is 64-bit wide with 16 GB total.

WINSYSTEMS announced the SBC-477 PowerTier Series, rugged single board computers designed for performance, power, and reliability in industrial applications where space is limited. The series leverages the 13th Gen Intel Core Raptor Lake hybrid CPU, an i7, i5, i3, or Intel Processor U300E.

ASUS participated in embedded world North America 2025 where it highlighted its latest portfolio of AIoT, embedded systems, and edge computing products in collaboration with Intel. The solutions are engineered to accelerate change across industries and strengthen the two companies shared dedication to influencing the future of embedded technologies.

RunSafe Security released the addition of a new license compliance feature to its RunSafe Security Platform. The feature is engineered to give embedded teams control over open-source licenses and set guidelines based on their specific risk profile. It is designed to aid companies in preventing “copyleft” licenses and securing their proprietary code if they unconsciously distribute code with licenses that are not permissive.

Ceva, Inc. released its Ceva-Waves Wi-Fi 7 1x1 client IP, enabling enhanced Wi-Fi 7 capabilities to AIoT devices and environments. Ceva-Waves Wi-Fi 1x1 7 client IP leverages IEEE 802.11be for compact, battery-powered designs such as wearables, smart home devices, and industrial applications.

The first day of embedded world North America 2025 saw the launch of Microservice Store, a secure marketplace for embedded and IoT software. According to the press release, the Microservice Store will introduce a modular, architecture-agnostic, plug-and-play software model, where designers are able to publish independent Microservices and product vendors can securely integrate them into devices in weeks, not years.

BIWIN Storage Technology Co., Ltd. will attend embedded world North America where it will exhibit its latest memory and storage innovations including solutions engineered for embedded, automotive, and industrial applications. Visitors to Booth 2010 will have a chance to see the BIWIN ePoP LPDDR4X, BIWIN LPDDR5X, BIWIN eMMC 5.1, and BIWIN Mini SSD, all designed for high efficiency and reliability.

SECO starts its road to embedded world at its global headquarters in Arezzo, Tuscany, Italy. Making its way to Anaheim by way of its US engineering and operations headquarters in Rockville, Maryland, SECO will host visitors to Booth 7011 at this years embedded world North America where it will showcase its end-to-end solutions ranging from next-generation edge computing hardware to its edge and cloud IoT software suite, Clea. SECO also has many demos showcasing its edge AI solutions.

Irvine, California. Advantech released Edge AI solutions powered by NVIDIA Jetson Thor modules delivering up to 2070 FP4 TFLOPS of AI performance. The solutions are built on a container-based architecture and feature application-specific hardware platforms pre-integrated with JetPack 7.0, remote management tools, and vertical software suites such as Robotic Suite and GenAI Studio.

NextComputing introduced its compact Nucleus 1U, a short-depth (28.25") 1U rackmount server engineered for AI inference, cloud-native applications, and edge deployments. The Nucleus 1U leverages Ampere processors providing up to 192 single-threaded cores and support for NVIDIA GPUs, and high-speed NVMe storage.

 

As a member of the A3 Association for Advancing Automation, SINTRONES is reimagining operations with real-time intelligence enhancing productivity, safety, and resilience.  SINTRONES provides reliable edge AI computing platforms accelerating industrial digitalization by integrating high-performance CPUs and GPUs supporting rugged design and advanced thermal management.

Edge Impulse, a Qualcomm Technologies company, is bringing its latest innovations in edge AI, collaborations, and interactive demos to embedded world North America 2025, Booth 5061.

Visitors to embedded world North America have a chance to stop by Booth 7076 to visit with Emproof experts (Brian Kelly, CEO, and Dr. Nils Albartus, Technical Solutions Director) and view a live Emproof Nyx demonstration focusing on ARM and RISC-V boards. The exhibit will explain how unprotected firmware can be disassembled in seconds, while Emproof-protected binaries are hardened significantly against analysis. The demo uses common attacker tools like Ghidra, for a real-world look at what works and what doesn’t.