Embedded Computing Design

As the need for faster, more efficient data processing increases, Field Programmable Gate Arrays (FPGAs) are a fundamental technology bridging the gap between traditional hardware accelerators and cutting-edge applications like Artificial Intelligence (AI). They are becoming a critical building block for innovations from edge computing to cloud infrastructure.

Axiomtek announced its P117-ADL-TRA 17” industrial touch panel PC supporting applications such as multimedia kiosks, heavy-duty industrial computing, and factory automation. The PC delivers enhanced performance and flexibility by leveraging scalable 13th/12th Gen Intel Core i7/i5/i3 or Pentium processors with the Intel H610 chipset. Consistent image display is managed by the XGA TFT LCD display with a 5-wire resistive touchscreen and 250 nits of brightness.

Wincomm shared that its WMP-27T-PIS series has earned the Taiwan Excellence Award 2025, granted by the Ministry of Economic Affairs. The award identifies products with innovative performance in research and development, design, quality, and market impact, while emphasizing the assurance it is "made in Taiwan."

Emproof and DDC-I introduced a partnership to deliver advanced security solutions for Deos-based systems outlined in the whitepaper, Advanced Embedded Security with DDC-I Deos and Emproof Nyx. The collaboration combines the capabilities of DDC-I’s Deos real-time operating system (RTOS) with Emproof’s security solution, Emproof Nyx addresses threats such as reverse engineering and exploitation attacks while supporting customized protection.

Collabora announcd a partnership with MediaTek that is empowering Collabora to establish, develop, and maintain MediaTek's IoT Edge AI Genio platforms upstream. The objective is complete support for the official Evaluation Kit (EVK) in Debian and other Linux distributions.

Samsung Semiconductor Europe is exhibiting its next-generation semiconductor technologies for artificial intelligence (AI), automotive, and more innovations at this year’s electronica under the theme, “CROSSROADS: Where the future begins,” showcasing solutions designed for HPC, server, data center, automotive, and consumer electronics. Samsung will introduce its newest developments across memory, sensor, foundry, and OLED display technologies, highlighting solutions designed to harness the full power of AI utilized for on-device applications.

Semtech Corporation is reasserting its dedication to sustainability at electronica 2024. At booth #C3.262, attendees have the chance to explore Semtech’s offerings and discover more about its sustainable development programs. "We believe that sustainable innovation is key to solving some of the world's most critical challenges," said Hong Hou, president and chief executive officer of Semtech. "Electronica is the ideal opportunity to share our sustainability vision. Technology should push boundaries and contribute positively to the world. This principle will continue to guide our strategy, product innovation, and global operations."

Woodcliff Lake, New Jersey. Recently, CAST and KiviCore announced a collaboration to deliver IP cores for post-quantum cryptographic hardware engines. With large-scale quantum computing on the horizon, the idea of post-quantum cryptography (PQC) is evolving to provide secure data solutions resistant to quantum-based cyber threats.

In order to create more innovation in wireless performance and interoperability utilizing scalable AI, Synaptics designed its Veros Seamless Intelligent Connectivity series to support systems on chips (SoCs) for Wi-Fi 6E, Bluetooth, and 802.15.4. The SYN4383 and SYN43756E SoCs target devices demanding the highest Wi-Fi throughput and range with seamless network interoperability.

At this year's electronica, Infineon is exhibiting its AI solutions designed to build, optimize and, deploy robust edge AI models using DEEPCRAFT Studio, DEEPCRAFT Ready Models, and ModusToolbox. The software solutions are ideal for MCUs like PSOC Edge and PSOC 6 to develop power-efficient intelligent devices for consumers. Join Infineon at Hall C3, Booth 502 to learn about and view demonstrations on its end-to-end edge AI platforms.

Delta is releasing its broad spectrum of energy-efficient power, thermal management, and infrastructure solutions for AI and high-performance computing (HPC) data centers. The innovative technology includes liquid cooling plate systems and the 1.5 MW Coolant Distribution Unit (CDU), cutting-edge ORV3 power shelf systems, high-performance power and cooling solutions for GPUs.

Alif Semiconductor released its DK-B1 development kit for the Balletto B1. The company is billing its wireless Balletto as the world’s first Bluetooth Low Energy (BLE) wireless microcontroller to feature hardware optimization for AI/ML workloads. Ideal applications include natural language speech recognition, AI noise cancellation, key word spotting, audio beam forming in true wireless stereo (TWS) earbuds, and sensor fusion ML models in wearable devices.

Sondrel has made its in-house IP available for licensing including a suite of IP blocks for standard SoC management that are designed to operate start-up of devices, clock and reset control, and power domain handling. The SoC Management Suite is divided into three parts, the PMU (Power Management Unit, the URG (Universal Reset Generator), and the UCG (Universal Clock Generator).

Apacer will be presenting its next-generation industrial storage solutions at electronica 2024. While visiting Hall B4, Booth 419 attendees will be invited to learn more about the PV180-μSSD delivering NAND based storage solutions combined with an ultra-fast PCIe Gen4 x4 interface in an embedded BGA form factor the size of an IC chip.

Visitors to electronica can visit Macnica ATD Europe’s booth C4-359, where Greenliant will exhibit its innovative EX Series NVMe ArmourDrive M.2 2242 / 2280 and NANDrive ball grid array (BGA) solid state drives (SSDs). They support mission critical applications where harsh environments are a factor. Operating temperatures range between -40 to +95 degrees Celsius.

AAEON Technology Inc. released the BOXER-8642AI, a fanless embedded AI computer featuring eight independent 10Gbps USB ports, leveraging a 32GB or 64GB NVIDIA Jetson AGX Orin module. It supports multiple Intel RealSense D405 3D cameras for high and wide bandwidth image processing for smart retail market applications such as AI-assisted self-checkout kiosks. Power input range is 12V to 24V with -25°C and 55°C operational temperature.

Austin, Texas. Ambiq is increasing its support for the Zephyr Project Real-Time Operating System (RTOS). The open-source Zephyr is now offered on the Apollo3 Family SoCs, Apollo4 Plus, Apollo4 Blue Plus, and the forthcoming Apollo510 MCU, for high-performing AI at the edge.

 

Milexia will attend electronica 2024 to share the fruition of several substantial acquisitions involving Whistler Technology and Cabcongroup. Booth (B2, 419) visitors will learn about the various supply chain solutions including power systems, connectivity, sensors, and sourcing services. Milexia will highlight eight distinctive technology areas to support a wide range of applications.

Munich, Germany. DigiKey will be attending electronica during November 12-15, 2024, in Munich, Germany. At its booth, #B4.578, DigiKey will showcase top designs from leading suppliers, select technical capabilities, tools, and prize give aways. “We always look forward to attending electronica and connecting with engineers, designers, students and colleagues from around the world,” said Dave Doherty, president at DigiKey.

Willich/Munich, Germany. ROHM Semiconductor Europe will be exhibiting its innovative power and analog technologies developed to increase power density, efficiency, and reliability in automotive and industrial applications. ROHM will be located at booth C3-520 under its motto "Empowering Growth, Inspiring Innovation." According to the company, it will showcase various demo application stations highlighting its semiconductor technologies and how they contribute to solving critical social and ecological challenges.