Embedded Computing Design

• InvenSense’s Product Longevity Program applies to MEMS sensors for both automotive and industrial applications
• Products in the Product Longevity Program have higher accuracy and stability, performance resiliency, and a long-term supply

Avnet and Device Authority has announced an agreement to combine technologies to better help customers worldwide manage and protect their connected device infrastructure.

Secure-IC announced the release of a cybersecurity lifecycle management platform for connected objects (Securyzr integrated Security Services Platform).

congatec released the x86 based COM-HPC Server modules by announcing availability of three new Server-on-Module families parallel to the launch of the brand-new Intel Xeon D processor family, formerly codenamed Ice Lake D.

Powered by Intel 12th-Gen Core i processor with 16-core/ 24 thread configuration, Neousys Nuvo-9000 series embedded Box PCs provides an incredible boost of performance and supports DDR5 memory standard for more memory bandwidth to handle additional workloads.

Read up to 200 Tags Per Second with the Ultra High Frequency HAT for Raspberry Pi

PICMG announced that the COM-HPC Carrier Board Design Guide is released and freely available on the PICMG website.

ModBlox7 introduces an open standard to proprietary multi-billion USD market

The MIPI Alliance announced a noteworthy update to its MIPI Camera Serial Interface 2 (MIPI CSI-2) interface to enable advanced machine-vision applications in multiple application spaces.

isMedia joins Mixel MIPI Central as Mixel's first partner integrating Mixel's MIPI IC

FlexSense advanced optical array integrates several subsystems on one SoC, shrinking solution footprint, shortening time to market, and cutting manufacturing costs.

Efinix released its 2nd generation Sapphire RISC-V core, improving upon its offering of three previous software defined, RISC-V SoCs. 

ASIX Electronics launched its AX58400 EtherCAT to IO-Link Gateway Solution. This new solution combines EtherCAT industrial Ethernet fieldbus technology and IO-Link intelligent communication technology.

With funding from the Cybersecurity and Infrastructure Security Agency (CISA), Mitre Corporation oversees the Common Vulnerability Enumeration (CVE) database of publicly-disclosed security flaws found in computer systems worldwide.

Review Display Systems Inc. announced the release of Kontron COM Express Basic Type 7 Computer-On-Module. The COMe-bEP7 features AMD EPYC Embedded 3000 SoC processors delivering a cost effective and highly scalable server-class performance in a compact form factor.
 

TDK Corporation announced it has designed a recycling system that reuses PET films used in the manufacturing process of multilayer ceramic capacitors (MLCCs).

Menlo Micro released a high-power single-pole/four-throw (SP4T) DC-to-18 GHz switch providing the industry with high performance, reliability, and integration for RF switching applications.

The STMicroelectronics STPD01 DC/DC buck converter is digitally programmable for USB Power Delivery (PD) applications up to 60W.

The Morello program, a five-year research initiative, involving a consortium led by Arm, was the result of a collaboration that aims to design a new, inherently more secure, Arm-based computing platform for the future.

BlackBerry Jarvis becomes one of the first software composition analysis tools to provide turnkey cybersecurity assurance in compliance with President Biden's Cybersecurity Executive Order.