Embedded Computing Design

In this episode of Embedded Insiders, Ken O’Neill, Space Systems Architect at AMD, joins us to explore the company’s advancements in AI for space. He delves into how AMD is enabling on-board processing for satellites and spacecraft, including the adoption of FPGAs in spaceflight applications.

But first, Embedded Computing Design's Editor-in-Chief, Ken Briodagh, shares highlights from Computex 2025, providing insights into the top technological innovations unveiled at the event, including advancements in AI and edge computing.

In this episode of Embedded Insiders, we’re joined by Principal Analyst at global technology intelligence firm ABI Research, Reece Hayden, to discuss the recent global tariffs, and the effects of this on supply chains, manufacturing costs, and expansion. 

Next, Ken sits down with Jun Kawaguchi, global marketing executive for the Secure Flash product family at Winbond, to discuss the challenges of securing today’s AI, automotive, and industrial embedded systems.

In this episode of Embedded Insiders, we’re joined by Carnegie Mellon professor and founder of Efficient Computer, Brandon Lucia. Brandon dives into his company's general-purpose processor, designed to deliver 100x more energy efficiency than any chip on the market today. He also shares insights from his academic work and the challenges impacting the next generation of engineers navigating today’s fast-evolving technological landscape.

In this episode of Embedded Insiders, Editor-in-Chief Ken Briodagh sits down with Marten Smith, Principal Segment Manager for the Medical and Health Segment at Microchip Technology. Together, they explore how Microchip supports innovation in the medical field, navigates stringent security standards, and tackles the challenges of certifying new medical devices. They also discuss how advancements in AI are paving the way for improved patient care.

In this episode of Embedded Insiders, Scott Bibaud, President and CEO of Atomera, explores the rising costs of semiconductor manufacturing and the challenges of scaling to advanced nodes like 3nm and 2nm. He breaks down the diminishing performance gains and the complexity of high-volume semiconductor architectures.

Next, Rich and Scot Morrison, Vice President of Shift Left Software Product Management at Siemens EDA, discuss the growing specialization of chip design—and why development tools must evolve to keep up.

But first, Rich and I examine Moore’s Law and whether the push for ever-smaller chips is truly the best path forward.

In this episode of Embedded Insiders, we’re joined by Jonathan Moore, Director of Advanced Systems at Exida, and John Ellis, USA President and Head of Product at Codethink. These industry leaders share their insights on the future of automotive technology, focusing on software engineering for 2025, along with key discussions on trust, safety, and evolving industry standards.

But first, Rich and Ken are back from embedded world 2025 in Nuremberg to share highlights for those who couldn’t attend. They’ll cover the annual Best-in-Show awards, hands-on workshops, and emerging technologies shaping the future. 

In this episode of Embedded Insiders, Winston Leung, Senior Product Marketing Manager at QNX, and Jay Thomas, Director of Field Development at LDRA join the podcast to discuss the fusion of robotics and automation in modern manufacturing, and how functional safety is shaping this transformative shift.

On this episode of Embedded Insiders, Ken sits down with Rozalia Beica, Field CTO at Rapidus Corporation, to explore the rise of chiplet integration, Rapidus' U.S. expansion, the transformative role of AI in semiconductors, and the growing importance of advanced packaging in the industry. Stay tuned for insights into how Rapidus is shaping the future of semiconductor technology.

In this episode of Embedded Insiders, Alex Iuorio, Avnet’s Senior Vice President of Global Supplier Development, delves into the findings of the 2025 Avnet Insights engineering survey. This year’s report focuses on Artificial Intelligence, examining what engineers expect from the market, the challenges they anticipate, and how AI is influencing product design.

In this episode of Embedded Insiders, Bruce Franklin, Senior Director of Automotive at Micron, joins us to share his 2025 predictions for the automotive industry. He dives into the role of embedded memory and storage in robotaxis, key considerations for manufacturers, and how these advancements will shape the future of self-driving cars and next-generation architectures.

In this episode of Embedded Insiders, Dunstan Power, Director of ByteSnap Design, unpacks the strategic and practical implications of Europe’s investment in the semiconductor industry. Dunstan shares his perspective on how this funding could bolster Europe’s chip manufacturing capabilities, address global supply chain challenges and foster innovation for companies like ByteSnap and its clients.

In this episode of Embedded Insiders, we dive into the challenges and solutions shaping AI and identity verification. Pavel Goldman-Kalaydin, Head of AI and Machine Learning at Sumsub shares how his team is tackling deepfake threats while addressing privacy and ethics concerns with cutting-edge, AI-driven tech.

On this episode of Embedded Insiders, Editor-in-Chief, Ken Briodagh, sits down with Patrick Soheili and Kevin Donnelly of Eliyan to highlight the company's new Chiplet Interconnect PHY at 64Gbps in 3nm Process. The multi-die interconnect evolution marches on and Eliyan is getting a lot of attention for its ability to deliver performance and bandwidth like this in either standard or advanced packaging.

On this episode of Embedded Insiders, we’re joined by David Bartlett, Head of Technology in the business unit at u-blox, to explore how low-earth orbit (LEO) satellites could elevate positioning, navigation, and timing (PNT) services. Are satellites closer to Earth the answer to providing reliable PNT in the toughest environments?

In this episode of Embedded Insiders, we're joined by Sriram Krishnan, BlackBerry's Head of Product Management, to discuss CylanceMDR, their AI-powered managed detection and response solution. We’ll explore how its XDR architecture enhances security by seamlessly integrating with existing tools, enabling more efficient threat detection and response.

In this episode of Embedded Insiders, we take a deep dive into the newly announced HBM4 Memory Controller IP from Rambus, with insights from Fellow and Distinguished Inventor Steven Woo. Rambus is leading the way with its silicon IP portfolio, and Steven shares his perspective on the latest memory industry trends, the challenges it faces, and the impact of AI on memory technologies.

On this episode of Embedded Insiders, we’re joined by Calista Redmond, CEO of RISC-V International, and Andrea Gallo, VP of Technology, as they dive into the organization’s latest technical breakthroughs, the evolving RISC-V software ecosystem, and how RISC-V is making an impact in the AI/ML sectors—and beyond.

On this episode of Embedded Insiders, Wayne Lyons, AMD’s Automotive Senior Director, provides an update on AMD’s automotive business, trends, and vision for the future. Wayne also dives into the company’s recent advancements in automotive processors like the Versal AI Edge Series, and their success with companies deploying their solution, like Subaru.

On this episode of Embedded Insiders, Jack Weast, Intel Fellow and Vice President and General Manager of Intel Automotive, breaks down the company’s recently announced OLEA U310 SoC. Built with a hybrid and heterogeneous architecture, the solution is designed to improve the overall efficiency of electric vehicles by promoting energy efficiency, and lower design and manufacturing costs.

On this episode of Embedded Insiders, we dive into the growing advancements in AI and HPC with Lou Ternullo, senior director of IP product marketing at Rambus. Lou highlights the evolving data center architectures and the increasing demands for high bandwidth, low latency, and robust performance. He also explains how Rambus is staying ahead of the curve with its recently launched PCI Express® (PCIe®) 7.0 IP portfolio.