Embedded Computing Design

Atmosic Technologies and Mouser Electronics, Inc. heralded a distribution partnership signifying Mouser’s delivery of Atmosic's portfolio of low-power energy-harvesting wireless Bluetooth system-on-chips (SoCs) and evaluation kits. Atmosic's portfolio was developed based on sustainability so engineers can create devices that can utilize one battery for the device’s maturity, while some devices operate without any batteries, due to the Atmosic's SoC’s low power consumption.

Malvern, Pennsylvania. Vishay Intertechnology, Inc. released two new fixed-gain infrared (IR) sensor modules developed for lower costs and improved stability for sensor applications in outdoor environments. The surface-mount TSSP93038DF1PZA and leaded TSSP93038SS1ZA offer typical irradiance of 1.3 mW/m² in compact Minimold packages. The modules assist with operating in direct sunlight while able to provide sensitivity for light barrier situations without unwanted pulses.

Thorigné-Fouillard, France and Amsterdam, Netherlands. Kerlink and The Things Industries are combining their carrier-grade hardware and software enabling zero-touch provisioning (ZTP) for IoT networks. The collaboration features Kerlink’s Wirnet i-Series LoRaWAN gateways and The Things Industries’ LoRaWAN Network Server, The Things Stack, into a plug-and-play package.

Taipei, Taiwan. IBASE Technology Inc. launched its EC3500 edge AI computing environment powered by NVIDIA Jetson AGX Orin 32GB / Jetson AGX Orin 64GB with an 8-core or a 12-core NVIDIA Arm Cortex A78AE v8.2 64-bit processor. The EC3500 integrates an NVIDIA Ampere GPU showcasing 1792 or 2048 cores supplemented by 56 or 64 Tensor Cores respectively.

Framingham, Massachusetts. Bluespec Inc. released its MCUX RISC-V processor designed to simplify the integration of customize protocols and add accelerators to FPGAs and ASICs. The platform is ideal for solutions that require a small processor to operate custom modules, IO devices, sensors, actuators, and accelerators.

Taipei, Taiwan. ASRock Industrial announced its compact iEP-6010E Series Industrial IoT Controller leveraging NVIDIA Jetson Orin NX/ Jetson Orin Nano system-on-module (SOM) with up to 100 SPARSE (50 DENSE) INT8 TOPS, two USB 3.2 Gen 2x1 (one with locking feature), two USB 2.0, and two Gigabit LAN in Basic SKU, or PoE SKU with up to two IEEE 802.3AF PoE for camera deployment.

Friedberg, Germany. IMAGO Technologies GmbH has begun its pre-production run of its fanless and compact edge AI system, Vision Box AI, based on the NVIDIA Jetson AGX Orin. The platform includes up to 12 ARM CPU cores with up to 64 GB RAM for general use cases that translates into efficient AI-relevant computing power of 275 TOPS (Tera Operations per Second, 8-bit integer).

DitchFlow’s new land irrigation sensor leverages Nordic’s nRF9160 SiP integrated with a 64 MHz Arm Cortex-M33 application processor into relay sensors for data via LTE-M/NB-IoT to the cloud. Users can utilize remote notifications (email / text) when irrigation water reaches a specified level. The sensor can notify up to six individuals when triggered so decisions on water changes can be decided. “We realized cellular IoT was our best solution to ensure reliable connectivity,” says Mamer. “The level of integration and low power consumption were key elements in our decision to then employ the Nordic nRF9160 SiP in our Land Irrigation Sensor,” said  Ryan Mamer, Owner, DitchFlow

London, United Kingdom. Omdia released findings the semiconductor market fell in revenue for a fifth straight quarter in the first quarter of 2023 seeing a record period of dismal performance since Omdia started its research in 2002. The revenue ($120.5B) of the first quarter of 2023 was down 9% from the 4^th quarter of 2022.

San Jose, California.  Supermicro, Inc. announced its full series of H13 AMD based-systems is now offering support for the 4th Gen AMD EPYC  processors, based on "Zen 4c" architecture, and 4th Gen AMD EPYC processors with AMD 3D V-Cache technology.

Shanghai, China. CEVA announced support for Channel Sounding to its RivieraWaves Bluetooth IP portfolio for precise secured positioning in automotive, industrial, and broader IoT. By supporting Channel Sounding CEVA has surpassed conventional Bluetooth distance and position measurement practices, explicitly received signal strength indicators (RSSI) with angle of signal arrival/departure (AoA/AoD).

San Jose, California. The Edge Impulse Studio platform now has native support for Particle's new Photon 2 board. The team-up of Edge Impulse and Particle powers edge AI with the integration of the Particle ecosystem into deployment of trained AI models to the Photon 2 board.  The collaboration is the first IoT Integration for Edge Impulse.

ABB Power Conversion extended its MPR-series rectifier family, adding two 850-watt MPR0812 power supplies. The MPR0812TEX12Z01A leverages forward air flow while the MPR0812TER12Z02A supports reverse air flow. To aid in more power, less space, the rectifiers are designed in a 1.57" high by 9" long by 2.5" wide form. The devices meet Class B radiated and conducted emissions requirements.

Pullman, Washington. Digilent commercially launched its Analog Discovery 3 (AD3), the third of Digilent’s Analog Discovery lineup of versatile on-the-go testing and measurement devices supporting USB-C. The AD3 has an amplified buffer size and expands data transmissions via waveform generator and improved reception via the mixed-signal oscilloscope. AWG phase modulation, summation, and internal loopback aid in increasing performance.

Tokyo, Japan. Renesas Electronics has standardized development of all printed-circuit board (PCB) designs on the Altium 365 cloud-based software. The platform assists in collaboration between all stakeholders providing IP security and revision control simultaneously. “Chris Allexandre, Senior Vice President, CSMO and Head of the Global Sales and Marketing Unit at Renesas said, “The ECAD tool migration is an important step in our journey, and we look forward to continuing collaboration and to strengthening our partnership with Altium.”

Irvine, California. Newracom will soon release its Wi-Fi HaLow System-on-a-Chip (SoC) , the NRC7394, the heir apparent of the first Wi-Fi HaLow SoC (NRC7292). Updated features include an embedded on-chip amplifier and an area of 6mm x 6mm.  It delivers comprehensive compatibility with IEEE 802.11ah (Wi-Fi HaLow) supporting enhanced performance and utilization of 1, 2, and 4 MHz channels within the frequency range of 750-950 MHz.

ABB Power Conversion added two low-power Barracuda-series DC/DC converters, the KBVS008 and KBVW010 modules.  They are 1/16th-brick bus converters used within distributed power architectures where they deliver higher voltage input to a lower voltage output, specifically for 5G and wireless networks. Both bus converters are applicable where power over ethernet (POE) is required.

Malvern, Pennsylvania. Delivering an impressive high current rating of up to 5A, Vishay is now incorporating four new 200 V FRED Pt ultrafast rectifiers within the DFN3820A package. The series includes the 1 A VS-1EAH02xM3, 2 A VS-2EAH02xM3, 3 A VS-3EAH02xM3, and 5 A VS-5EAH02xM3, and individually available in Vishay Automotive Grade, AEC-Q101 qualified versions.

Vecow released its EAC-6000 family of edge AI platforms powered by NVIDIA Jetson Orin NX with integrated 1024-core NVIDIA Ampere architecture GPU with 32 Tensor cores and 8-core Arm Cortex-A78AE CPU supporting up to 100 TOPS. Vecow’s news series currently includes the EAC-6000, EAC-6100, and EAC-6200 models.

Boston, Massachusetts. Digital Twin Consortium (DTC) released a supplement to its previously published whitepaper, Reality Capture: A Digital Twin Foundation. The supplement titled, Industry User Guide for Applying Reality Capture to Tenant Improvement Projects offers industry-specific guidance pertaining to the utilization of reality capture in tenant improvement projects.