Embedded Computing Design

Munich, Germany. Infineon Technologies announced the release of ModusToolbox 3.0, an updated design solution with improved multi-core project workflow support, graphical tool for board support package (BSP), and backend system enhancements and infrastructure support for ModusToolbox Packs. The ModusToolbox 3.0 is ideal for consumer IoT, industrial, smart home, and wearables.

Westford, MA. Swissbit released its iShield HSM (hardware security module), a plug-and-play metal-housed USB-A module for securely storing cryptographic keys for IoT ecosystems. It supports OpenSC open-source software stack, and PKCS#11 and PKCS#15 cryptographic standards.

MILPITAS, Calif. SEMI reported in its 200mm Fab Outlook to 2025 report that the global manufacturing of semiconductors is expected to boost 200mm fab capacity 20% from 2021 to 2025. The additional output will add 13 new 200mm lines as production reaches more than 7 million wafers per month (wpm). Plans to meet the markets growing demand has companies like ASMC, BYD Semiconductor, China Resources Microelectronics, Fuji Electronics, Infineon Technologies, Nexperia and STMicroelectronics reveal plans for new 200mm fabs.

MILPITAS, Calif. In its 300mm Fab Outlook to 2025 report, SEMI compiled data that shows an expansion of 300mm fab capacity will expand to a 10% compound average growth rate (CAGR) from 2022 to 2025, reaching 9.2 million wafers per month (wpm). “While shortages of some chips have eased and supply of others has remained tight, the semiconductor industry is laying the groundwork to meet longer-term demand for a broad range of emerging applications as it expands 300mm fab capacity,” said Ajit Manocha, SEMI President and CEO. “SEMI is currently tracking 67 new 300mm fabs or major additions of new lines expected to start construction from 2022 to 2025.”

SAN JOSE, Calif. Cadence Design Systems, Inc. released its Cadence Certus Closure Solution for the automation and acceleration of a full design closure cycle (from signoff optimization through routing, static timing analysis (STA) and extraction) overnight. Benefits of the solution include: Innovative scalable architecture, Incremental signoff, Improved engineering productivity, SmartHub interface, 3D-IC design efficiencies.

Flex Power Modules launched its non-isolated and unregulated BMR313 Intermediate Bus Converter (IBC) that provides peak power rating of 3 kW in a 23.4 x 17.8 x 7.65 mm form factor, with 908 W/cm3 power density. The BMR313 carries an input voltage range between 40-60 V, 10-15 V of output with 97.3% efficiency at 54 V input, and continuous output of 1kW. The BMR313 is designed for cold wall mounting and offers the generally used LGA footprint and pinout.

MILWAUKEE. Rockwell Automation, Inc. launches its FactoryTalk® Design Hub™ for industrial automation projects requiring modern security standards. The new design allows member access to designs on-demand from any browser with updatable and flexible software.

Thalwil, Switzerland. Move-X released its LoRa connectivity platform, Cicerone board, integrating u-blox positioning technology and u-blox cloud positioning service (CloudLocate). CloudLocate offers power saving ability at the edge when it analyzes and locates position in the cloud, not on the device, saving 10X energy over standalone GNSS.

SANTA ROSA, Calif. Keysight Technologies, Inc. used its CyPerf, to demonstrate the capacity of the F5 BIG-IP Next Edge Firewall cloud-native network function (CNF), powered by the 3rd Gen AMD EPYC processors. "We were confident that this proof-of-concept configuration would be powerful, with the automation and efficiency of running the new Edge Firewall CNF on AMD EPYC CPUs with 64 cores,” said Ryan Howard, Principal Solution Engineer, Business Development, F5.

Wilmington, Mass. Analog Devices, Inc. released the ADIN2299, a multiprotocol (PROFINET, EtherCat, EtherNet/IP, Modbus TCP) industrial ethernet switch platform for operation in a star, line, or ring topology. The 194 CSPBGA (Chip Scale Package Ball Grid Array) includes a communication controller, two port 10/100Mbps ethernet switch, memory, physical layer (PHY), protocol stacks, with the RTOS, file system, drivers, and TCP/IP.

CWD Limited developed the CWD CBTLRM02, dual combo module incorporated in ATEX certified smart ID cards, and integrated with Semtech's LoRa Connect™ platform with LoRaWAN® standard connectivity and Bluetooth® Low Energy (BLE).

ICP Germany launched, the ND118T, a small and multifunctional board in the PICO-ITX form factor for low energy consumption in industrial ecosystems.

The EAC-5000 is powered by NVIDIA’s® Jetson AGX Orin™ platform and is ideal for many solutions including: automated agricultural machinery, in-vehicle computing, robotic control, machine vision, intelligent video analytics, mobile robots, and other embedded AI applications.

SiTime provides an alternative MEMS oscillator with system-level techniques for fixing the problem of dense integration design of Dojo power module. 

The new eFuse Protection ICs Series features protection, sensing, and control features in a single chip. 

HALCON 22.11 has a planned release of Novenmber 22, 2022 with a new feature enabling bin picking of foreign objects. 

The TB67S549FTG has a wide operating range for space sensitive applications. 

The DP2000 provides higher output speed with low current measurements. 

The OTA RF charging platform allows the monetization of underused low-frequency bands with “Power as a Service” to alleviate the need for disposable batteries.

SEMI predicts 29 million wafers a month (200mm equivalent) for 2023.