Embedded Computing Design

New York. Dataminr released its Pulse for Cyber Risk powered by its AI platform. The solution grants users actionable intelligence on real-time risks and cyber-physical threats. 

Miami, Florida. "The World Economic Forum has shown that cyber terrorism and ransomware attacks have grown more than 400% in the past two years," said Tony Silva, Unified Technologies' CEO. With this in mind, Unified Technologies strived to retain its Service Organization Control (SOC) 2 Type 2 compliance as it meets or exceeds requirements set by the AICPA.

Chantilly, Virginia. OP[4] launched with its innovative security environment developed to routinely discover and repair N-Day and 0-Day vulnerabilities. Utilizing the solutions will support users in evaluating its security to be in accordance with the White House's national cybersecurity IoT labeling initiative. 

Waterloo, Ontario and San Francisco, California. ISARA, and The LightBridge Group, announced a collaboration to innovate and integrate post-quantum cryptography solutions and risk management services within federal entities. According to Atsushi Yamada, CEO of ISARA, the strategic partnership will advance PQC at the federal level.

Taipei, Taiwan. In case you missed it,  Sameer Wasson, vice president and general manager for Processors at Texas Instruments (TI), entertained the Computex 2023 attendees with his speech, "Making the Future of Embedded Possible" focusing on the next generation of trends, challenges, and solutions.

Alameda, California. Wind River released a no-fee professional-grade scanning tool to identify Common Vulnerabilities and Exposures (CVEs). The Wind River Studio Linux Security Scanning Service is designed for the distinct requirements of embedded Linux environments indicating when a fix or patch is available for a given CVE.

Tel Aviv, Israel. Radiflow has released CIARA 4.0 highlighting a leading benchmark tool delivering actionable insights for risk mitigation. CIARA 4.0 strategically uses data to non-stop observe changes in topology, scan for vulnerabilities and threats, and re-assess the risk posture of facilities and its digital assets.

Waterloo, Ontario and Herzliya, Israel. BlackBerry Limited is partnering with Upstream Security to leverage its V-XDR platform for telemetry data and edge compute resources from BlackBerry IVY® to expand vSOC (Vehicle Security Operations Centers) with lower costs and added cybersecurity.

ADLINK Technology Inc. released its new MVP Series fanless modular computers, the MVP-5200 Compact Modular Industrial Computers and MVP-6200 Expandable Modular Industrial Computers for 12/13th Gen Intel Core i9/i7/i5/i3 and Celeron processors. Up to 65W are supported by the Intel R680E chipset which can couple with GPU cards for AI inference at the edge.

Munich, Germany. TASKING released its updated version of the v7.0 of the compiler toolchain VX-Toolset for Arm and the BlueBox debug & trace with winIDEA Debugger, and support for NXP Semiconductors’ S32Z and S32E real-time processors with Arm Cortex-R52 and Cortex-M33 architectures.

Thief River Falls, Minnesota. DigiKey is descending on Sensors Converge 2023 where it will be in booth #616 from June 20-22, in Santa Clara, California. There it is showcasing its sensing and electronics offerings. Attendees can also interact with DigiKey experts as they demonstrate products and promote prize giveaways.

Barcelona, Spain. Semidynamics delivers a fully customizable Vector Unit integrated into 64-bit RISC-V cores able to run up to 2048b of computation per cycle for large data transmissions. The unit follows the RISC-V Vector Specification 1.0 and adds many features to fit user requirements.

Santa Clara, California, Shanghai, China. Greenliant will be demonstrating its SSDs and memory cards at booth A088 during embedded world China 2023. The storage solutions innovate endurance, longevity, performance, and reliability within the storage of embedded systems.

During Computex 2023, Variscite displayed a working VAR-SOM-MX91 as NXP was announcing the i.MX 91 SoC. The SoC features an Arm Cortex-A55 running at 1.4GHz, and supports 2GB LPDDR4 memory, dual Gigabit Ethernet, dual USB, dual CAN-FD, audio in/out, ADC, certified single or dual-band Wi-Fi, BT/BLE. Also included is a display output with integrated EdgeLock Secure Enclave and industrial temperature grade for embedded applications such as IoT, smart home, connected sensors, industrial controllers, and metering.

During the keynote address, "Shaping Ecosystems to Master Complexity," at Computex 2023, NXP Executive Vice President Rafael Sotomayor highlighted the innovations Qbic technology has brought to the NXP ecosystem.

Taipei, Taiwan. DFI is participating in Computex 2023. With Smart Cities being the spotlight this year, DFI and partner 5GIoTLead Technology is showcasing the 5G Smart Pole solution.

New Taipei City, Taiwan. Aetina, and parent company Innodisk, are joining forces with NVIDIA, leveraging the NVIDIA Metropolis for Factories and integrating it into Aetina's SuperEdge AI platforms. The collaboration’s goal is to deploy the solution in Innodisk’s factory to further enhance manufacturing. Aetina’s solution was developed particularly to boost production in currently utilized automated optical inspection (AOI) systems. The platform mitigates challenges when reinspecting items incorrectly identified.

Syslogic introduced its RPC RSL A4AGX, an embedded system based on the NVIDIA Jetson AGX Orin Industrial System-on-Module (SoM) during Computex. Highlights include 275 TOPS of AI and 32GB of RAM consuming only 15-75 watts of energy.

Constance, Germany. Hyperstone was recently awarded the Joint Supply Chain Accreditation Register (JOSCAR) certification recognizing its ability to meet the high standrads supplying aerospace, defense, and security markets. "We are delighted to have been awarded the JOSCAR certification," said Steffen Allert, VP Sales at Hyperstone. Parent company Hellios, examines and researches all suppliers to make sure they are reliable before they are considered for the certifying process.  

CoreTechnologie (CT) has updated its 3D printing software, 4D_Additive, by integrating the open-source 3D manufacturing format (3MF) for strengthening standards in additive manufacturing. The software acts as a link between CAD and manufacturing by supporting general 3-D printing methods. It easily shares data and models via cross platform and is ideal for both beginners and seasoned users.