Embedded Computing Design

Camarillo, California. Semtech Corporation  and Oxit are now collaborating on a solution that gives manufacturers a way to network both AWS IoT Core for Amazon Sidewalk and AWS IoT Core for LoRaWAN networks. Customers receive a singular device to network IoT cloud endpoints with AWS IoT Core for LoRaWAN networks. 90% of the U.S. population has ability for coverage on Amazon Sidewalk, a long-range and low-bandwidth community network.

Cincoze released its DIAMOND DS-1400 Series of industrial computer modules. The modules are designed for enhanced power while offering PCIe expansion. That power is derived from a 12th gen Intel Alder Lake-S processor with the Intel 7 process, delivering a max out at 16 cores (8P + 8E) with DDR5 memory up to 64GB, 4800MHz, ECC technology.

Wincomm released a new family of stainless steel touch panel PCs powered by Intel’s 12th Generation Alder Lake IP66/67/69K. Its WTP-9H66 family of touch panels arrive in various sizes including 15”, 19”, 22”, and 24”. Delivered is a default complete system rating of IP69K, second HDD for data back-up, and USB3.2 & Type C. I/O layout has both an M12 downward connector and optional cable gland SKU,

Huntsville, Alabama. Summit 7 is simplifying the method of supporting small to medium businesses that collaborate with the United States Department of Defense on the Managed CUI Enclave*,  enhancing operational efficiency and aiding in bolstering compliance for SMBs.

Malvern, Pennsylvania. Vishay Intertechnology introduced a 650 V E Series power MOSFET, the Siliconix n-channel SiHP054N65E delivering a solution to improve efficacy and power density enhancements in the two initial points of a power system architecture (power factor correction (PFC) and subsequent DC/DC converter blocks). According to Vishay, its SiHP054N65E slashes on-resistance by 48.2 % while offering a 59 % lower resistance times gate charge, a key figure of merit (FOM) for 650 V MOSFETs used in power conversion applications.

 

Shenzhen, China. MYIR released its 82mm by 45mm MYC-JD9360 CPU module built around the D9-Pro (D9360) from SemiDrive. The module comes with six Arm Cortex-A55 cores (up to 1.6GHz) and one dual-core Cortex R5 core (800MHz). The delivered integrations are 2GB LPDDR4, 16GB eMMC, 16MB QSPI Flash, 256Kbit EEPROM, Watchdog timer chip, and Isolated power supply (5V/5A).

In 2019, the United States National Counterintelligence and Security Center (NCSC) and the National Insider Threat Task Force (NITTF) named September National Insider Threat Awareness Month (NITAM). The annual event is built to educate government officials, private organizations, and the public on the critical risk insider threats pose to data streams and educate the groups on mitigation techniques.

SAPPHIRE Technology and Thinlabs collaborated on a platform that leverages 802.3bt PoE++ (Power-over-Ethernet) technology, the Thinlabs PoE NUC, delivering the connection ability of four ThinLabs HD displays powered by one Ethernet cable. The solution utilizes a SAPPHIRE designed motherboard operating with AMD Ryzen Embedded V2000 including AMD’s “Zen 2” x86 CPU and Radeon Graphics.

Solana Beach, California. Macnica is highlighting its MPA1000 module, ME10 SoC solution, and IPMX Product Development Kit with open APIs during its stay at IBC2023 being held September 15-18 in Amsterdam RAI. The product showcase will demonstrate how Macnica’s newest solutions will enhance and build upon positive engagement with SMPTE ST 2110 and IPMX integrators. Future ratifications will optimize throughput with more end point connections delivering a more seamless ST 2110 and IPMX implementation.

Campbell, California. Amulet Technologies is celebrating its 25th anniversary as a leader and inventor of industrial smart displays. Amulet was created to design front panel displays for everyday items, enriching user experience. The company is proud of how it has expanded the application use in areas such as medical instruments, gas station pumps, and HVAC controls.

Austin, Texas / Belfast, United Kingdom/ Dunleer, Ireland. Simply NUC, Inc launched its Intel 13th Gen Raptor Lake "H" series processor powered 4x4 NUC family, dubbed Onyx. The Onyx family comes with support for up to 96GB of DDR5-5200 memory and up to 16TB of storage. Within the series launch comes the NUC13OXv9 model that features the 13th Gen Intel Core i9-13900H processor with Intel vPro Technology combined in a 4”x4” form factor.

Grand Prairie, Texas. WINSYSTEMS launched its 11 Gen Intel Core i3/i5/i7 powered COMeT6-1100 COM ExpressType 6 Compact CPU module. Up to four cores are available in a low power environment where vibration and shock may be a problem. The compute module delivers up to to 32GB LPDDR4 4226 MT/s of system memory and has an integrated TPM 2.0 device that secures the module with root-of-trust authentication.

Los Angeles, California. RuggON is releasing its 10" SOL PA501 Rugged Tablet running Android 12 while being GMS certified (Google recommended standards). The tablet follows the IP65, MIL-STD-810G, and MIL-STD-461G criteria for managing electromagnetic interference points of subsystems and equipment used in military programs and applications.

Iridium Communications Inc. released its Iridium GO! exec Premium Dual Mode and LITE Antenna Kits for fixed installations. Included in the kit is a combined GNSS and Iridium antenna, Iridium certified extended antenna cables, and a variety of mounting devices for a myriad of applications.  A LITE edition delivers an Iridium omnidirectional antenna, extended cable, and a fixed rail mount.
 

Cincoze is ever expanding its designs to further innovate smart logistics utilizing its DI-1100 and DV-1000 series embedded computers in autonomous mobile robots (AMRs) and industrial sorting applications.

San Jose, California. Rambus Inc. released a new series of Security IP solutions for FPGAs delivering innovative cryptographic, side-channel, and Quantum Safe securities. The IP will protect a variety of devices from the highest performing accelerators utilized in Generative AI, all the way down to low power IoT components. Ideal applications include Data Center, AI/ML, Edge, IoT, and Defense.

DFI has been developing an expansive plan for the Southeast Asian region, centering on India, that in which has been enjoying a rising economy. The company signed a tactical collaboration with six local suppliers. The cooperation’s goals are to expand "brand awareness" and "market share" of industrial automation, networking, defense, transportation, and smart cities.

Hsinchu, Taiwan. ASIX is releasing its AX88279 USB 3.2 to 2.5G Ethernet Controller to further enhance portable, high-speed, and reliable wired network connections. Integrated is a 2.5G/1G/100M Base-T Ethernet PHY delivering network throughput up to 2.34Gbps. The USB features advanced Precision Time Protocol (PTP) for critical applications involving precise time synchronization.

RF-star is now offering its BLE CC2340 modules based on TI’s new CC2340 MCUs. The solution delivers standby current less than 710 nA, 40% lower than current devices. There is the capability to achieve upwards of 10+ years of maturity on one battery the size of a coin. RF performance and networking range is enhanced with a low output of up to +8 dBm. The BLE module will easily operate wireless applications like electronic shelf labels and tire pressure monitoring systems (TPMS).

 

Paris, France. VSORA is releasing a single-chip architecture*, Jotunn4, to optimize Generative AI integrations. Jotunn4 delivers 1.6 petaflops with an efficiency of more than 50% within a 45 x 45 mm package. The current general efficiency range is 2-4%. Included is 192 GB of on-chip memory and an overall power consumption of less than 100W.