Embedded Computing Design

RISC-V Summit, San Jose. Imperas Software Ltd., announced that Imagination Technologies will utilize the Imperas model IMG RTXM-2200, from Imagination’s RISC-V Catapult family, as a solution for software design in virtual platforms and EDA environments. The IMG RTXM-2200 is a scalable real time deterministic 32 bit embedded CPU developed for commercially available components.

 

RISC-V Summit, San Jose. Siemens Digital Industries Software announced that its security and cloud enabled Sokol Flex OS software, centered around the open-source Yocto Project industry standard, supports RISC-V embedded advancement with its customizable Linux platforms for the RISC-V architecture. “Siemens continues to show leadership within the RISC-V ecosystem with the launch of Sokol Flex OS for RISC-V,” said Krishnakumar Ramamoorthi, senior product marketing manager of Microchip Technology's FPGA business unit.

RISC-V Summit, San Jose. MIPS has designated Imperas to deliver flexible framework RISC-V processor verification tools to simplistically adapt from issue recognition and debug resolution in a testbench ecosystem consistent with the SystemVerilog EDA tools. The provided tools support the open standard RVVI (RISC-V Verification Interface) with the ability to communicate with a processor.

RISC-V Summit, San Jose. Codasip announced its SecuRISC5 for reliable custom compute that utilizes reference designs merging Codasip IP and third-party technology. The recently launched Codasip Labs¹ will recognize openings where SecuRISC5 will be attentive, a hub, and a coordinator of pan-industry collaboration.

ECD is once again back on the Road to embedded world with our blog series. We are packing up and starting at the Atlantic with ARM, headquartered in Cambridge, England, right on the River Cam. ARM will be showcasing Cloud-native application development, IoT, and Automotive use cases. Visit Stand 4 - 540 to see how ARM takes the heavy lifting out of your Industrial needs. So, grab some coffee, buckle up, and put on some tunes, this is going to be a fun ride.

CUPERTINO, Calif. Ventana Micro Systems Inc. released its standards-based data center class of RISC-V computing, the Veyron V1. The Veyron V1 is a member of Ventana’s Veyron family of high-performing RISC-V processors. According to Ventana, Founder and CEO Balaji Baktha will speak on the many features of the Veyron family during his RISC-V Summit keynote. Highlights are expected to include, an eight wide and aggressive out-of-order pipeline, 3.6GHz, 5nm process technology, 16 cores per cluster, high core count multi-cluster scalability up to 128 cores, and 48MB of shared L3 cache per cluster. 

Geneva. STMicroelectronics updated its X-CUBE-TCPP software pack with improvements to its portfolio of USB Type-C port-protection ICs and STM32 interface ICs operating from 5V/0.5A up to 48V/5A (240-Watt) within ratification 3.1. The specification provides libraries for three USB Type-C port-protection ICs in ST’s portfolio, the TCPP01-M12 for sink applications, the TCPP02-M18 for source applications, and the TCPP03-M20 for dual-role power (DRP) applications.

San Diego, CA. congatec applauds the approval of the COM Express 3.1 standard and launched 10 compliant Computer-on-Modules powered by 12th Gen Intel Core processors (formerly codenamed Alder Lake). Included in the ratification is a revised 16 Gbps COM Express connector supporting high-speed interfaces like PCIe 4.0 and USB 3.2.

Wilmington, MA & Munich, Germany. For the last-mile smart building connectivitiy, Analog Devices, Inc. announced its LTC4296-1 5-port SPoE PSE with Classification and LTC9111 SPoE PD with Polarity Correction. Both offer support for SPoE and Power over Data Line (PoDL) variants of single-pair powering. “The Intelligent Edge is one of the most exciting developments of the digital era as computing power is pushed to previously inaccessible applications and locations,” said Leo McHugh, Vice President of Industrial Automation at Analog Devices.

Munich, Germany. Infineon Technologies AG unveiled the result of its collaboration with TSMC, the Arm v8-M architecture powered SLC26P. It is a security IC with a focus on high volume payment applications built on the future-proof 28 nm technology node. Previous technologies maturity, such as 90 nm, 65 nm, and 40 nm, are a factor for necessity in next-generation security applications.

Geneva (Switzerland) and Bernin (France). “The automotive industry is facing major disruption with the advent of electric vehicles,” said Bernard Aspar, Chief Operating Officer of Soitec.  Having deciding on a path toward the inevitable, STMicroelectronics, along with Soitec, are ramping up their cooperation on Silicon Carbide (SiC) substrates by way of STMicroelectronics utilizing Soitec’s SmartSiC technology for a transition to 200mm SiC wafers. “The transition to 200mm SiC wafers will bring substantial advantages to our automotive and industrial customers as they accelerate the transition toward electrification of their systems and products. It is important in driving economies of scale as product volumes ramp,” said Marco Monti, President Automotive and Discrete Group, STMicroelectronics. 

TOKYO. “High levels of integration and the flexibility of programmability helps manufacturers reduce component counts, saving board space and power,” said Susie Inouye, Principal Analyst at Databeans.  With this in mind, Renesas Electronics Corporation released its VersaClock 7 configurable clock generators with 8-12 differing outputs, an embedded crystal oscillator, 150fs typical RMS 12k-20MHz phase jitter, 1.8V/2.5V/3.3V flexible power rails, digital holdover and hitless switching, SPI / I2C/ SMBUS interface support, PCIe Gen 1-6 support, and up to 27 customizations of external EEPROM. All of this is included in a 5 x 5mm, 6 x 6 mm QFN form factor designed for robust computing, wired infrastructure, and data centers.

The Atlas VPN team released a report that 59.58 million new Windows malware was identified in the previous three quarters of 2022. This is a 95.6% of the entire malware uncovered in that time. With 30% of the global OS market share, Windows may be the most targeted because of the abundance of use.

Munich, Germany. Infineon Technologies AG partnered with 3D Time-of-Flight (ToF) specialist pmdtechnologies to release the IRS2975C imager sensor a performance update of the IRS2875C. The IRS2975C contains a half-quarter video graphics array (HQVGA) resolution of 240 x 180 pixels with a chip size of 18 mm ² for a 1/6" image circle.

Lattice Semiconductor revealed its Lattice Avant, a new FPGA platform with 2.5X lower power, 2X faster throughput at lower power, connectivity with configurable SERDES up to 25 Gbps, PCIe Gen 4, high performance I/O including memory interface support for LPDDR4 and DDR5, software support leveraging existing Lattice software solutions, and in a 6X smaller package size.

BRUSSELS, Belgium. “The future for Europe as a region of semiconductor manufacturing excellence is brimming with possibility,” said Laith Altimime, president of SEMI Europe when responding on the progress made with the European Chips Act detailing the quick start of the “general approach,” in 2023. Member states as well as the Czech Presidency of the Council reached an agreement on Europe’s advancement in manufacturing next-generation semiconductors.

IRVINE, Calif. Menlo Micro leveraged its Ideal Switch technology and announced a micromechanical power switch able to withstand 10A in a 5mm x 5mm surface-mount form factor. The MM9200 Ideal Switch has upgraded features such as continuous current carry ((AC or DC): +/- 10A), Voltage standoff ((AC or DC): +/- 300V), switching time of 10μs to open, 10μs to close. The MM9200 Ideal Switch comes with enough endurance for 1 billion switching operations for a 1,000x better life expectancy than previous generation electromechanical relays.
 

ROHM Semiconductor and Shenzhen BASiC Semiconductor revealed a collaboration on SiC power devices targeting improved performance for economical SiC solutions for electric vehicle powertrains. Weiwei He, General Manager of Shenzhen BASiC Semiconductor Ltd., says “Amid the undergoing technological revolution of new energy vehicles, the emergence of SiC power devices stands out as the key to improving electric drive efficiency.

e-con Systems released its NeduCAM25, a complete HD (65 fps) global shutter FPD-LINK III camera module built around onsemi's AR0234 sensor to photograph rapid moving items at 120 fps with the absence of any rolling shutter artifacts. The NeduCAM25 utilizes the FPD-LINK III interface with protected coaxial cable to efficiently transmit both power and data up to 15m away with low latency.

Taipei, Taiwan. Neousys Technology released its Nuvo-2610VTC series, an in-vehicle fanless computer leveraging an Intel Elkhart Lake quad-core processor, the Nuvo-2610VTC series. Integrated in the Nuvo-2610VTC series are robust I/Os including, ifour Gigabit PoE+ ports via M12 x-coded connectors, two USB 3.1 ports with the screw-lock mechanism, isolated DIO, and 15kV ESD protected COM port.