Embedded Computing Design

To improve the customer experience, Mitsubishi Electric Automation, Inc. announced its Economy Solutions, a fast and cost-effective package of servo and motion bundles.

Historically, large companies like Microsoft, Google, and AWS have conducted independent, in-house security research on their own products and the software components within them. If vulnerabilities are found, and significant enough, this research often becomes a Coordinated Vulnerability Disclosure (CVD).

5G Networks are a need in automation, robotics, and augmented reality. 

Trameto released the TM2040 demonstration platform allowing engineers to assess how micro-energy harvesting decreases and/or eradicates battery usage in IoT devices.

A member of the FiRa Consortium, Rohde & Schwarz revealed its goal to deliver a FiRa validated ultra-wideband (UWB) PHY Conformance Test Tool (PCTT) to encourage the additional expansion of an accessible and standardized UWB ecosystem.

Rohde & Schwarz is launching a wideband solution to assist EMC engineers in meeting the growing requirement for advanced measurement speeds. The R&S ESW EMI test receiver can measure up to 970 MHz in real time with accurate measurements and range.

MITRE researchers discovered 321 vulnerabilities in 2021, the highest in over a decade. The year before, flaws jumped from 130 to 206, an increase of 58%.

29.9% of critical vulnerabilities remain unpatched.

Over 30 members in the NVIDIA Partner Network are also releasing more commercially accessible products driven by the new Jetson AGX Orin 32 GB production module.

ETSI announced the continuance of research on its Industry Specification Group Encrypted Traffic Integration (ISG ETI) to mid-2024 to explicitly target cryptographic and key management models.

As per the analysis by Market Research Future Reports, the global According to Market Research Future, the IoT cloud platform market is expected to grow its value to USD 8.67 Billion with a CAGR of 31.2% by 2023.

Semtech released its SaaS chip-to-Cloud service, LoRa Cloud Locator using Semtech's LoRa Cloud Modem & Geolocation services.

The Edge XRT v2.0 is available from IOTech. This is a significant release of its open software platform, which is intended for time-critical and embedded OT applications at the industrial IoT edge.

At embedded world 2022, Advantech unveiled the world's first COM-HPC Server-on-Module powered by AMD EPYCTM 7003 Embedded processors. The new COM-HPC Size E Server-on-Modules (200 x 160 mm) provide more than triple the number of available edge server cores compared to any other COM-HPC server module on the market [1], providing edge server engineers with a significant performance boost.

Agile Analog has made its new RC Oscillator IP available for purchase. This is the first in a new family of analog IP blocks that the company is introducing to make it easier to integrate analog circuits onto ASICs.

ROHM Semiconductor announced the RFL/RFS Series, its fourth generation 650V fast recovery diodes (FRDs) with low forward voltage (VF) and fast reverse recovery time (trr), as well as ultra-low noise characteristics. The new devices are ideal for high-power industrial and consumer equipment, such as air conditioners and EV charging stations.

Oxford Ionics and Infineon Technologies AG have announced a collaboration to develop high-performance, fully integrated quantum processing units (QPUs). Oxford Ionics' unique electronic qubit control (EQC) technology, combined with Infineon's world-leading engineering and manufacturing capabilities, as well as quantum technology expertise, will lay the groundwork for the industrial production of QPUs with hundreds of qubits within the next five years. The goal is to transition quantum computing technology from the research lab to real-world applications.

Nexperia has announced the availability of 20 V and 30 V MOSFETs in the world's smallest DFN package, the DFN0603. Nexperia already offers ESD protection devices in this package, but has now succeeded in bringing it to their MOSFET portfolio, an industry first

congatec expands its Intel Xeon D-2700 processor-based Server-on-Module portfolio with the introduction of five new modules in the COM-HPC Server Size D performance class (160x160mm).

congatec introduced seven new COM-HPC and COM Express Computer-on-Modules with less power-hungry variants of the 12th Generation Intel Core IOTG mobile processors (formerly codenamed Alder Lake).

congatec announced significant investments in functional safety at embedded world Hall 5/Booth 135.