Embedded Computing Design

Imagination Technologies' first real-time embedded RISC-V CPU, IMG RTXM-2200, is a highly scalable, feature-rich, 32-bit embedded solution with a flexible design for a wide range of high-volume devices. The IMG RTXM-2200 is a commercial core in Imagination's Catapult CPU family, which was previously announced in December 2021.

A large number of electronic systems in modern vehicles are networked with one another. Because these systems are vulnerable to cyber attacks, Fraunhofer IPMS created a CANsec IP core to improve the security of vehicle systems.

Solid Sands and SYSGO have announced new developments in their four-year collaboration.

Renesas Electronics Corporation announced the development of circuit technologies for a 22-nm embedded spin-transfer torque magnetoresistive random-access memory (STT-MRAM, hereinafter MRAM) test chip with fast read and write operations.

Avery Design Systems announced comprehensive support for the new UCIe (Universal Chiplet Interconnect Express) standard, allowing design and verification engineers to take advantage of the recently introduced standard for die-to-die interface connectivity. Avery's offering includes high-quality models and test suites for UCIe-based system pre-silicon verification.

Murata announced its NFM15HC435D0E3 capacitor has set a new performance benchmark. The product is the world's first three-terminal multi-layer ceramic capacitor (MLCC) with a capacitance of 4.3 F in a 0402-inch (1.0 0.5 mm) size.

Panaji Municipal Corporation (PWD-PHED) to feature a LoRaWAN® network for water use management

Wireless Telecom Group, Inc. announced today that its CommAgility brand has launched a new four-channel small cell platform for high-performance 5G applications such as industrial private networks, cloud applications, and video streaming.

To meet the growing demand for flexible mesh network designs, Fujitsu Components America introduced the FWM7BLZ22x series of Wirepas Mesh 2.4 GHz embedded wireless modules today.

The first AINVR solution at the edge on the market. It can process up to 8 camera streams and switch between different AI models dynamically.

A new 5x6 mm copper (Cu) clip for MOSFETs that provides an improved thermal path within the package.

The DMTH4M70SPGWQ is a 40V automotive-compliant MOSFET with a typical RDS(ON) of 0.54m at a gate drive of 10V.

TWK takes the next step in sensor technology safety by introducing the new sensor model TxSN with magnetic sensor system in the series of functionally safe sensors with the established interface standard CANopen Safety (EN 50325-5). The TRSN multiturn encoder and its smaller singleturn brother TBSN are included in this model. It will be certified to meet the SIL3 level of EN ISO 61508 and is also ASIL-D compliant according to ISO 26262.

The most recent generation of removable storage media provides a one-of-a-kind combination of flexibility, performance, and robustness.

The latest version of the 5X award-winning suite includes a full set of Machine Learning tools, new key Open-Source modules, ready-to-use applications, code samples, and allows for completely free evaluation, development, and release of products with the included commercial license.

NanoLock Security has announced the availability of their full suite of customized cybersecurity solutions for the industrial and manufacturing markets.

Agile Analog has signed its first licensee in China. “We opened our APAC regional sales and engineering office in January this year,” said Barry Paterson, Agile Analog’s CEO. “We thought that there would be a big demand for our unique analog IP solutions in the Asia-Pacific region and so we are delighted to have signed our first license for the region in just a couple of months. Key to the deal is us having local support for the customer to provide immediate answers to any engineering questions.”

The Avnu Alliance, CC-Link Partner Association, ODVA, OPC Foundation, and PROFIBUS & PROFINET International have joined forces to produce a single conformity test plan for the IEEE/IEC 60802 Time Sensitive Networking (TSN) profile for Industrial Automation.

Ampere revealed its plans to design its own processor cores last year as a means to supple a more attuned product to hyperscalers’ needs. Ampere recently stated its first in-house cloud native processor core designs will be named the AmpereOne.

SEMI and the UCLA Center for Heterogeneous Integration and Performance Scaling (UCLA CHIPS) revealed that they have won a $300,000 grant from the U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) to produce a roadmap for advancing heterogeneous integration and advanced packaging technologies in the United States.