Embedded Computing Design

TDK Corporation announced the upcoming release of its new B33331I6 series. The family contains compact EPCOS motor-run capacitors certified safety class S2 and the IEC 60335-2-24 standard being brought to market in 2023. When released, TDK believes it will be the smallest compact motor-un capacitors in the industry. Diameters of “the robust aluminum cans” are 30mm or 35mm, with vertical measurements of 73mm and 103mm. The measurements include all connections for accurate designs.

Klein-Winternheim, Germany. The safety certifiable Simulink has been embedded with PikeOS, a real-time operating system and hypervisor. Simulink is a modeling software extension from Matlab ideal for designing technical-physical and financial mathematical models. The models are translated into binary by way of Matlab's Embedded Coder and executed through PikeOS.

SYDNEY. Morse Micro and Chicony Electronics have combined forces to provide Wi-Fi CERTIFIED HaLow IP cameras to industry developers. The partnership aims to boost the range and reliability of imaging equipment with next-generation innovations. By integrating Wi-Fi HaLow, the wireless camera platforms provide 10x more reach than current Wi-Fi 6 cameras operating at 2.4GHz and 5GHz.

Quectel Wireless Solutions released its advanced automotive safety integrity levels (ASIL) solution for optimal precision and reliability for deterministic in-lane positioning with level ASIL B for ADAS and AD systems. The platform leverages the Quectel’s LG69T-AB automotive module supporting Trimble software positioning engine, Trimble RTX correction service, the ST Micro ASIL-rated TeseoAPP GNSS chipset, and the Murata SCHA600 ASIL inertial measurement unit (IMU).

T2M released its certified ISO 26262 and AEC-Q100 Automotive Grade Silicon Proven IP Cores as small as 7nm for must have connectivity in automotive applications. T2M supports solutions needing CAN Bus IP Cores and LIN Bus IP Cores certified with ASIL (Automotive Safety Integrity Level) packages with all four safety levels ASIL A, B, C, and D.

Irvine, California. Telit Cinterion announced the verification of its 5G FN980 and FN990 series data cards. It features an NVIDIA Ampere architecture GPU utilizing 8-core Arm Cortex-A78AE CPUs.

Munich, Germany. Infineon made available its MOTIX 3-phase 160 V silicon-on-insulator (SOI)  gate driver, IC 6ED2742S01Q, with an embedded power management unit (PMU) in a QFN-32 pack including a thermally effective exposed power pad. It contains bootstrap diodes powering three external hi-side bootstrap capacitors by way of a trickle charge pump supporting 100% duty cycle management.

San Diego, CA. congatec released its HPC/cRLS, socketed COM-HPC Client Computer-on-Modules (CoM). It is centered on 13th Gen. Intel Core processor variants with up to 34% multi-thread and up to 4% single-thread performance. It carries an additional 25% faster image classification inference compacity when juxtaposed with the previous12th Gen Intel Core processors. Further boosts in performance include, USB3.2 Gen 2x2 bandwidth of up to 20 Gigabit per second on the Size C CoM.

In literature when one crosses a body of water, it tends to symbolize a creation or a rebirth. Today on our Road to embedded world ’23 we are crossing a few bodies of water and making our way to the Xizhi District, New Taipei City, Taiwan. Here we are taking a tour of Aetina and learning more about its latest creations hitting the conference floor.

The automotive industry is moving from the conventional signal-based vehicle networks (CAN or LIN) to high-speed Ethernet. TTTech Auto released its Electronic Controls Design House (ECDH) to support automotive manufacturers switch to the software-defined vehicle. The ECDH delivers off-the-shelf electrical control devices and enables prototype design, industrialization, production, and logistics of flexible hardware.

Boston, MA. The Industry IoT Consortium (IIC) just published the latest edition of the Journal of Innovation (JoI) entitled, Business Outcomes of Utilizing Innovative Technologies in Industrial IoT. The journal showcases pioneering ideas, methods, components, and services developing within IIoT.  

Santa Clara, Calif. Registration for the 2023 DesignCon is now open for the Jan. 31- Feb. 2 event at the Santa Clara Convention Center.  While attending DesignCon, you will find a healthy dose of technical paper sessions, tutorials, industry panels, product demos, and 120+ exhibits, including exhibits from the host sponsor Amphenol, with Cadence, Keysight, Molex, Mouser, Samtec, TE Connectivity, and more.

Claroty’s Team82 has identified five liabilities within the GE Proficy Historian v8.0.1598.0. The vulnerabilities can be used to access the historian, remotely execute code, and crash it and other devices. Four of the vulnerabilities have a CVSS v3 score of 7.5 with one having a CVSS v3 score of 9.8. v7.0.

ARIES Embedded and Emdalo Technologies collaborated to enhance embedded modules centered on Microchip's PolarFire SoC architecture. ARIES designed the M100PF and M100PFS system-on-modules (SoM) delivering effective embedded ecosystems for power computations in applications such as smart embedded vision, industrial automation, communications, and IoT.

Tokyo, Japan. Renesas Electronics Corporation made available an automotive Intelligent Power Device (IPD), RAJ2810024H12HPD, for safe and flexible management of power dissemination in vehicles. The solution delivers the needs of next-generation E/E (electrical/electronic) architectures. It was designed in a TO-252-7 form factor which helps reduce the mounting vicinity by 40% when compared to the conventional TO-263.

Las Vegas. While demonstrating at CES 2023, HERE Technologies showcased its HERE platform, a fully capable solution that adapts search outcomes by using the data of customized points of interest (POIs). The HERE platform is controlled by HERE Workspace and HERE Search designing maps and search functions with information tailored outcomes.

Codasip, along with Intel, are providing educational tools for future RISC-V developers in the form of undergraduate and graduate curriculum combing assets such as Codasip RISC-V IP cores, Codasip Studio development environment, and Intel's FPGA platforms. The provided lessons use a project-based RISC-V learning opportunity.

Stuttgart, Germany. Just push a button, and you are working with Vector’s Calibration Data Management System (vCDM) 21.1 software-as-a-service. The calibration data solution allows teams to effectively communicate information by making it accessible to all members. When data is in need of a change, multiple users may merge consistently traceable information without any additional challenges.

TDK Corporation released a full-scale fabrication of InvenSense IAM-20685, the tiniest ASIL-B monolithic 6-axis MEMS IMU in compliant with ISO 26262 for ADAS and autonomous car systems. “Thanks to its 6-axis integration and its ASIL-B compliancy at the component level, the IAM-20685 simplifies automotive ADAS systems development, helping overcome weaknesses of other technologies,” said Alberto Marinoni, Sr Director, Product Marketing Automotive at InvenSense, a TDK Group company.

u-blox announced its M2-JODY-W3 Modules built on the NXP Q9098 chip running on Linux or Android OS. The card modules integrate the JODY-W3 Wi-Fi 6 and BLUETOOTH 5.3 connectivity module with the utilization of an M.2 card for authorized JODY-W3 interfaces, including PCIe, SDIO, and high-speed UART.