Embedded Computing Design

BRESSNER Technology released its Nuvo-10108GC and Nuvo-10208GC edge AI GPU computing platforms with up to two RTX A6000, RTX A4500, or RTX 4080 GPUs. The platforms are powered by Intel Core 12th and 13th generation CPU with up to 24 cores and 32 threads.

Sunnyvale, California. Synopsys, Inc is expanding its ARC Processor IP portfolio with its RISC-V ARC-V Processor IP. The series will consists of low to high performance options to fit the intended application allowing the flexibility designers need. “RISC-V processors are gaining in popularity as more designers look for greater design flexibility and more options,” said John Koeter, senior vice president of product management and strategy for IP at Synopsys.

Santa Clara, California. OpenHW Group publicized its CORE-V CVA6 Platform project, an open-source FPGA-based software design and test environment for RISC-V processors. The muli-member project will deliver client and server-compliant open-source processor designs utilizing the CV-Mesh clustering Network-on-Chip (NoC).

RISC-V Summit, Santa Clara, California. According to CAST, Ubilite, Inc. has licensed a RISC-V IP core for its next generation of Wi-Fi chipsets with an ultra-low power consumption rivaling Bluetooth Low Energy. Peter Gammel, Chief Executive Officer, Ubilite said, “We expect the RISC-V processor core we’ve licensed from CAST to help us maintain — and extend — the advantages of our low-power Wi-Fi SoCs over competing IoT products.”

Cupertino, California. Ventana Micro Systems Inc. released its Veyron V2, claiming it is the most powerful, and complete RISC-V processor offered in the form of chiplets and IP. A 40% performance improvement was created utilizing significant microarchitecture enhancements, superior high performance processor fabric architecture, and enhanced cache hierarchy. A Software Development Kit (SDK) is delivered with proven software building blocks from Ventana’s RISC-V platforms.

BeagleBoard.org released its BeagleV-Fire SBC employing Microchip’s PolarFire MPFS025T FCVG484E 5x core RISC-V System on Chip (SoC) with innovative FPGA fabric. The solution comes in a small footprint with flexible I/Os that make it ideal for applications including IoT, robotics, and AI. The BeagleV-Fire is delivered with pre-installed Ubuntu for Linux compatibility.

Munich, Germany. Rohde & Schwarz released its four or eight channel R&S MXO 5 oscilloscopes built on Rohde & Schwarz’s next-generation MXO-EP processing ASIC technology ensuring more signal activity in both time and frequency domains over competing oscilloscopes. The eight-channel R&S MXO 5 oscilloscope is the first of its kind with 4.5 million acquisitions and 18 million waveforms per second across multiple channels.

Transcend released a portfolio of JEDEC compliant low power industrial-grade DDR5 5600 DRAM modules. The modules are designed utilizing innovative DRAM chips delivering speeds of up to 5600 MT/s. Reduced loading times and enhanced access to memory are employed leveraging 32-bit channels as it consumes a mere 1.1V.

TQ released its 100 mm x 100 mm MBa8MP-RAS314 single board computer (SBC) utilizing NXP Semiconductors' i.MX 8M Plus processor, delivering a a long-term industrial option with Raspberry Pi. Interfaces include 2 x Gbit Ethernet, 4 x USB 3.0, 1 x USB 3.0 OTG, audio, HDMI, LVDS, MIPI-DSI, MIPI-CSI, SD card interface, NXP-based WiFi-5 module, and Raspberry Pi compatible I/O connector.

Microchip is packing up in Chandler, Arizona and will start its trip to the RISC-V Summit in Santa Clara, California, November 7^th and 8^th, 2023, and November 6 being Member Day. Microchip will be demonstrating its market leading FPGA solutions for the intelligent edge and how it leverages the RISC-V ISA to design heterogenous processing architectures for non-proprietary instruction set architectures.

Advantech’s Embedded-IoT World Partner Conference (WPC) will host collaborators all around the world to help shape the future of embedded and emerging business technology. From November 30 – December 2, 2023, the WPC will be held in Linkou Taiwan and will examine a broad range of topics including AIoT, EV infrastructure, robotics, and more.

Experience a new level of accuracy and clear medical imaging with Leadtek's cutting-edge display technology, set to revolutionize the visualization of healthcare data.

Shenzhen, China. MYIR released its MYC-YT113i CPU Module with an integrated Allwinner’s T113-i dual-core ARM Cortex-A7 processor utilizing 128MB on-chip DDR3 memory and external DDR3 memory options of 512MB/1GB. The solution fits snuggly in a miniscule 39mm by 37mm design carrying IO signals through 140-pin stamp-hole interface and 50-pin LGA pads.

Baden-Dättwil, Switzerland. Syslogic announced the RML A4NX, an NVIDIA Jetson Orin NX powered rugged computer with eight GMSL interfaces and up to 100 TOPS of AI performance utilizing 16GB of RAM. The solution is available in GMSL and PoE models including the ability to connect to eight high-resolution GMLS2 cameras (power over coax or ethernet) or up to four GMSL2 stereo cameras. PoE interfaces add the capability to integrate lidar or radar sensors into the environment.

Phison Electronics is extending its series of PCIe 5.0 and CXL 2.0 compatible redriver and retimer data signal conditioning ICs. The solutions have the capability to integrate in both Intel- and AMD-based platforms for applications such as artificial intelligence and machine learning (AI+ML), edge computing, high-performance computing, and many data-intensive needs. “Phison has focused industry-leading R&D efforts on developing in-house, chip-to-chip communication technologies since the introduction of the PCIe 3.0 protocol, with PCIe 4.0 and PCIe 5.0 solutions now in mass production, and PCIe 6.0 solutions now in the design phase,” said Michael Wu, President & General Manager, Phison US.

San Jose, California. AVerMedia released its fanless AI Box PC D315AOP powered by the NVIDIA Jetson AGX Orin. The box PC is ideal for real-time video feeds for autonomous mobile robots (AMRs), smart security, and intelligent inspection. It is delivered with a 120-pin high-speed connector for MIPI SerDes cameras and a 10GigE Vision camera connector.

Qualcomm Technologies, Inc. will be bringing a RISC-V based wearable platform to Wear OS by Google. The framework is expected to expand the products compatible within the environment. The platform will leverage low-power high-performance custom computers.  

St. Julians, Malta. SmartCow released its self-contained rugged edge AI camera, Sphinx, with Gigabit Ethernet 5G connectivity and NVIDIA Jetson Orin NX and Xavier NX system-on-modules. The Sphinx comes with dual image sensors with built-in IR illumination and low-light performance. Modular connectivity enables the easy integration of peripheral sensors such as air-quality sensors, LiDAR, and radar.

IC Nexus introduced its NSD3310WX-HL-KK3, a 10-inch TFT LCD display that sets new standards in ruggedness, affordability, and performance. The display leverages a 64-bit Cortex-A35 CPU and connects via Dual 10/100M/Gb Ethernet (LAN2 optional). It consists of a projected capacitive (PCap) touchscreen display at 1280 x 800 pixels and brightness standard of 1000cd/m². The display is protected by high impact resistance cover glass that meets IK08 standard.

San Jose. California. Cadence Design Systems introduced its innovative AI IP and software tools for on-device and edge AI processing. The scalable Cadence Neo Neural Processing Units (NPUs) support AI performance utilizing low energy while delivering up to 80 TOPS in a singular core. The NPUs offer both classic and new generative AI models for offloading AI/ML performance from any host processor (application processors, general-purpose microcontrollers, and DSPs) leveraging AMBA AXI interconnect.