Embedded Computing Design

GERMANY. ICP Germany released its E410-13CMI fanless embedded PC leveraging 10th generation Intel Core I3, I5, I7 and I9 desktop processors with up to 10 processor cores and 35 watts and includes two network ports with Intel® i219-LM GbE and i210-AT GbE network IC, four USB 3.0, 8 GPIO, six USB2.0 ports with audio functionality.

The Pico-ITX board features low power consumption and a 100 x 72 mm footprint which ICOP used to release its Pico-ITX VDX3-PITX board including Vortex86DX3 1GHz SOC that supports 2 GB DDR3 RAM, LAN, SATA DOM, MicroSD, 4x USB, 2x 8-bit GPIO, 11-bit ADC, and Audio.

Grenoble, France. Teledyne e2v introduced an 8 GB Space DDR4 memory with single-event latch-up (SEL) immunity beyond 60 MeV.cm²/mg while targeting 100 krad total ionizing dose (TID) and SEU/SEE characterization beyond 60 MeV.cm²/mg. The 8GB DDR4 has a form factor of 15mm x 20mm x 1.92mm and a transmission rate of 2400 MT/s to connect to current high-end space processors such as, AMD/Xilinx VERSAL ACAP, space FPGAs, MPSOCs, Microchip RT PolarFire, and many proprietary ASICs.

CAMARILLO, Calif. Semtech Corporation released information of its partnership with Amazon Web Services, Inc. (AWS) to license its LoRa Cloud global navigation satellite system (GNSS) features. "We are excited about the opportunities created with the integration of LoRa Cloud geolocation services into the AWS IoT Core platform. This greatly expands the availability of LoRa Cloud geolocation services across the globe, making it easier for developers to build world class asset tracking and monitoring solutions to connect and enable new IoT solutions," said Mohan Maheswaran, president and CEO, Semtech.

Munich. MVTec Software GmbH released two versions of 22.11 of its HALCON standard machine vision software, the Steady edition, and a Progress edition. With 3D Gripping Point Detection technology, the HALCON 22.11 has the ability to distinguish surfaces where suction gripping can be applied ridding the need to train differing surfaces. “The 3D Gripping Point Detection…offers an easy way to efficiently automate a complex application,” says Mario Bohnacker, Technical Product Manager HALCON at MVTec.

Fremont, Calif. The LoRa Alliance revealed that LoRaWAN certification is accessible for end-devices utilizing static context header compression (SCHC). The accreditation of IPv6 over LoRaWAN using SCHC validates that the end-device reaches the operational constraints of the LoRaWAN IPv6 Adaptation Layer Specification TS010-1.0.0. A precondition of SCHC over LoRaWAN is the end-devices in use need to currently be LoRaWAN Certified.

Munich, Germany. Infineon Technologies AG released its EasyPACK 4B lead-type to its Easy power module series. Targeting photovoltaic string inverter applications (1500 V _DC solar string inverters), the series reaches 352 kW and a 40% improved increase in power output when juxtaposed with previous generation models.  The robust F3L600R10W4S7F_C22 comprises of advanced three-level NPC (ANPC) topology, 1200 V CoolSiC Schottky diode, 950 V TRENCHSTOP IGBT7 chip technology for up to 600 A.

Gothenburg, Sweden. RT-Labs launched its U-Phy software-centric solution for utilizing Fieldbus industrial communication protocol using Profinet and EtherCAT on open hardware devices. Included is a modifiable application programming interface (API) and the ability to target code for differing communication protocols.

The need for wireless rechargeable sensor networks (WRSNs) is a must with Smart technologies taking over everything from our homes to our transportation. WSRNs are ideal for military and ecological disaster applications amongst others.

Nijmegen. Nexperia adds ‘ASFETs for Hotswap and Soft Start’ family with 25 V and 30 V devices with SOA. The PSMNR67-30YLE ASFET produces 2.2x stronger SOA (12 V @100 mS) with an R_DS(on) (max) as low as 0.7 mΩ.

Wilmington, MA / Munich, Germany. Analog Devices, Inc. revealed its 5-port LTC4296-1 and LTC9111  solution for single-pair Power over Ethernet (SPoE), Power Sourcing Equipment (PSE), and Power Device (PD).  Analog Devices’ SPoE platforms focus on obstacles facing the supply of energy and data transmission (over one kilometer) to edge devices including asset health, environmental conditions, and security metrics.

South Burlington, VT. OnLogic released its Factor 202 Raspberry Pi Compute Module 4 powered industrial controller leveraging a Quad-Core ARM Cortex-A72 64-bit SoC and up to 8 GB onboard LPDDR4 memory, 32 GB onboard eMMC storage, and 2 TB of M.2 2280 SATA storage. Other features include an operating temperature range of -20 to 60°C, options for DIN Rail or wall mounting, 8-24V power input, onboard digital I/O, additional analog inputs, and an available 2.7 inch capacitive touchscreen.

Uppsala, Sweden. IAR Systems revealed its complete support for the recent availability of IAR Embedded Workbench meant for RISC-V for the CoDense expansion of Andes Technology’s AndeStar V5 RISC-V processor. The CoDense in AndeStar V5 is intended for the compression of code with standard RISC-V instructions. CoDense in AndeStar V5 is an Andes-extended feature for code size compression on top of the RISC-V standard instructions.

Munich, Germany. OKdo released the ROCK 5B octo-core single-board computer (SBC) powered by a Quad Arm Cortex A76 CPU and Quad Arm DynamIQ Cortex A55 ARM Cortex processor cores. The Arm Mali-G610 GPU delivers graphics standards consisting of Open GL ES3.2, Vulkan 1.2, and Open CL 2.2. The SBC utilizes a Rockchip RK3588 SoC with an embedded Arm Mali graphics processor (GPU) and Neural Processing Unit (NPU).

WAKEFIELD, MA. PICMG revealed key extensions to the COM-HPC Computer-on-Module (COM) standard with the authorization of COM-HPC 1.15 for Functional Safety (FuSa). COM-HPC 1.15 is a set of safety protocols that develop the FuSa ability of “safety island” blocks on recent chipsets out to the holistic environment.

MUNICH. onsemi displayed a series of new MOSFET devices  in a 5mm x 7mm form factor at electronica ’22. The TCPAK57 family of top-cool devices include 40V, 60V, and 80V versions with the capability of operating at junction temperatures (T_j) of 175°C and are AEC-Q101 qualified and PPAP collaboration ready. Included motor control, DC/DC conversion, and a 16.5mm² thermal pad on the top to dissipate into a heatsink through general PCBs.

Klein-Winternheim, Germany. SYSGO's Separation Kernel PikeOS 5.1.3, a MILS based (Multiple Independent Levels of Security) real-time operating system and hypervisor, received security accreditation standard Common Criteria (CC), ISO 15408. SYSGO achieved level EAL 5+, based on its application processor architectures (ARMv8, x86-64 and PPC). The PikeOs was devised semi formally and verified against intricate vulnerabilities.

Munich. Rohde & Schwarz released its new R&S NRP90S and R&S NRP90SN power sensors with a frequency scale of 50 MHz to 90 GHz, dynamic range from -70 dBm to 20 dBm, and speeds of 50,000 measurements per second.

Irvine, Calif. Telit released its SE250B4, an Android centered SoM driven by the Qualcomm QCM2290 system-on-chip (SOC) incorporating Qualcomm’s Adreno GPU 702 at 845MHz. The SE250B4 supports various program features and wireless capabilities such as LTE Cat. 4, Wi-Fi 5, Bluetooth 5.0, and GNSS.

BOSTON. Recently, The Industry IoT Consortium® (IIC®) released, an Industrial Internet Reference Architecture (IIRA), to focus on questions raised within current industrial IoT systems. “As the industrial IoT becomes common knowledge and widespread across industries, how to architect and update systems remains relevant and evolving,” said Shi-Wan Lin, CTO, Yo-i Information Technology and one of the authors of the framework.