Embedded Computing Design

Wilmington, MA & Munich, Germany. For the last-mile smart building connectivitiy, Analog Devices, Inc. announced its LTC4296-1 5-port SPoE PSE with Classification and LTC9111 SPoE PD with Polarity Correction. Both offer support for SPoE and Power over Data Line (PoDL) variants of single-pair powering. “The Intelligent Edge is one of the most exciting developments of the digital era as computing power is pushed to previously inaccessible applications and locations,” said Leo McHugh, Vice President of Industrial Automation at Analog Devices.

Munich, Germany. Infineon Technologies AG unveiled the result of its collaboration with TSMC, the Arm v8-M architecture powered SLC26P. It is a security IC with a focus on high volume payment applications built on the future-proof 28 nm technology node. Previous technologies maturity, such as 90 nm, 65 nm, and 40 nm, are a factor for necessity in next-generation security applications.

Geneva (Switzerland) and Bernin (France). “The automotive industry is facing major disruption with the advent of electric vehicles,” said Bernard Aspar, Chief Operating Officer of Soitec.  Having deciding on a path toward the inevitable, STMicroelectronics, along with Soitec, are ramping up their cooperation on Silicon Carbide (SiC) substrates by way of STMicroelectronics utilizing Soitec’s SmartSiC technology for a transition to 200mm SiC wafers. “The transition to 200mm SiC wafers will bring substantial advantages to our automotive and industrial customers as they accelerate the transition toward electrification of their systems and products. It is important in driving economies of scale as product volumes ramp,” said Marco Monti, President Automotive and Discrete Group, STMicroelectronics. 

TOKYO. “High levels of integration and the flexibility of programmability helps manufacturers reduce component counts, saving board space and power,” said Susie Inouye, Principal Analyst at Databeans.  With this in mind, Renesas Electronics Corporation released its VersaClock 7 configurable clock generators with 8-12 differing outputs, an embedded crystal oscillator, 150fs typical RMS 12k-20MHz phase jitter, 1.8V/2.5V/3.3V flexible power rails, digital holdover and hitless switching, SPI / I2C/ SMBUS interface support, PCIe Gen 1-6 support, and up to 27 customizations of external EEPROM. All of this is included in a 5 x 5mm, 6 x 6 mm QFN form factor designed for robust computing, wired infrastructure, and data centers.

The Atlas VPN team released a report that 59.58 million new Windows malware was identified in the previous three quarters of 2022. This is a 95.6% of the entire malware uncovered in that time. With 30% of the global OS market share, Windows may be the most targeted because of the abundance of use.

Munich, Germany. Infineon Technologies AG partnered with 3D Time-of-Flight (ToF) specialist pmdtechnologies to release the IRS2975C imager sensor a performance update of the IRS2875C. The IRS2975C contains a half-quarter video graphics array (HQVGA) resolution of 240 x 180 pixels with a chip size of 18 mm ² for a 1/6" image circle.

Lattice Semiconductor revealed its Lattice Avant, a new FPGA platform with 2.5X lower power, 2X faster throughput at lower power, connectivity with configurable SERDES up to 25 Gbps, PCIe Gen 4, high performance I/O including memory interface support for LPDDR4 and DDR5, software support leveraging existing Lattice software solutions, and in a 6X smaller package size.

BRUSSELS, Belgium. “The future for Europe as a region of semiconductor manufacturing excellence is brimming with possibility,” said Laith Altimime, president of SEMI Europe when responding on the progress made with the European Chips Act detailing the quick start of the “general approach,” in 2023. Member states as well as the Czech Presidency of the Council reached an agreement on Europe’s advancement in manufacturing next-generation semiconductors.

IRVINE, Calif. Menlo Micro leveraged its Ideal Switch technology and announced a micromechanical power switch able to withstand 10A in a 5mm x 5mm surface-mount form factor. The MM9200 Ideal Switch has upgraded features such as continuous current carry ((AC or DC): +/- 10A), Voltage standoff ((AC or DC): +/- 300V), switching time of 10μs to open, 10μs to close. The MM9200 Ideal Switch comes with enough endurance for 1 billion switching operations for a 1,000x better life expectancy than previous generation electromechanical relays.
 

ROHM Semiconductor and Shenzhen BASiC Semiconductor revealed a collaboration on SiC power devices targeting improved performance for economical SiC solutions for electric vehicle powertrains. Weiwei He, General Manager of Shenzhen BASiC Semiconductor Ltd., says “Amid the undergoing technological revolution of new energy vehicles, the emergence of SiC power devices stands out as the key to improving electric drive efficiency.

e-con Systems released its NeduCAM25, a complete HD (65 fps) global shutter FPD-LINK III camera module built around onsemi's AR0234 sensor to photograph rapid moving items at 120 fps with the absence of any rolling shutter artifacts. The NeduCAM25 utilizes the FPD-LINK III interface with protected coaxial cable to efficiently transmit both power and data up to 15m away with low latency.

Taipei, Taiwan. Neousys Technology released its Nuvo-2610VTC series, an in-vehicle fanless computer leveraging an Intel Elkhart Lake quad-core processor, the Nuvo-2610VTC series. Integrated in the Nuvo-2610VTC series are robust I/Os including, ifour Gigabit PoE+ ports via M12 x-coded connectors, two USB 3.1 ports with the screw-lock mechanism, isolated DIO, and 15kV ESD protected COM port.

GERMANY. ICP Germany released its E410-13CMI fanless embedded PC leveraging 10th generation Intel Core I3, I5, I7 and I9 desktop processors with up to 10 processor cores and 35 watts and includes two network ports with Intel® i219-LM GbE and i210-AT GbE network IC, four USB 3.0, 8 GPIO, six USB2.0 ports with audio functionality.

The Pico-ITX board features low power consumption and a 100 x 72 mm footprint which ICOP used to release its Pico-ITX VDX3-PITX board including Vortex86DX3 1GHz SOC that supports 2 GB DDR3 RAM, LAN, SATA DOM, MicroSD, 4x USB, 2x 8-bit GPIO, 11-bit ADC, and Audio.

Grenoble, France. Teledyne e2v introduced an 8 GB Space DDR4 memory with single-event latch-up (SEL) immunity beyond 60 MeV.cm²/mg while targeting 100 krad total ionizing dose (TID) and SEU/SEE characterization beyond 60 MeV.cm²/mg. The 8GB DDR4 has a form factor of 15mm x 20mm x 1.92mm and a transmission rate of 2400 MT/s to connect to current high-end space processors such as, AMD/Xilinx VERSAL ACAP, space FPGAs, MPSOCs, Microchip RT PolarFire, and many proprietary ASICs.

CAMARILLO, Calif. Semtech Corporation released information of its partnership with Amazon Web Services, Inc. (AWS) to license its LoRa Cloud global navigation satellite system (GNSS) features. "We are excited about the opportunities created with the integration of LoRa Cloud geolocation services into the AWS IoT Core platform. This greatly expands the availability of LoRa Cloud geolocation services across the globe, making it easier for developers to build world class asset tracking and monitoring solutions to connect and enable new IoT solutions," said Mohan Maheswaran, president and CEO, Semtech.

Munich. MVTec Software GmbH released two versions of 22.11 of its HALCON standard machine vision software, the Steady edition, and a Progress edition. With 3D Gripping Point Detection technology, the HALCON 22.11 has the ability to distinguish surfaces where suction gripping can be applied ridding the need to train differing surfaces. “The 3D Gripping Point Detection…offers an easy way to efficiently automate a complex application,” says Mario Bohnacker, Technical Product Manager HALCON at MVTec.

Fremont, Calif. The LoRa Alliance revealed that LoRaWAN certification is accessible for end-devices utilizing static context header compression (SCHC). The accreditation of IPv6 over LoRaWAN using SCHC validates that the end-device reaches the operational constraints of the LoRaWAN IPv6 Adaptation Layer Specification TS010-1.0.0. A precondition of SCHC over LoRaWAN is the end-devices in use need to currently be LoRaWAN Certified.

Munich, Germany. Infineon Technologies AG released its EasyPACK 4B lead-type to its Easy power module series. Targeting photovoltaic string inverter applications (1500 V _DC solar string inverters), the series reaches 352 kW and a 40% improved increase in power output when juxtaposed with previous generation models.  The robust F3L600R10W4S7F_C22 comprises of advanced three-level NPC (ANPC) topology, 1200 V CoolSiC Schottky diode, 950 V TRENCHSTOP IGBT7 chip technology for up to 600 A.

Gothenburg, Sweden. RT-Labs launched its U-Phy software-centric solution for utilizing Fieldbus industrial communication protocol using Profinet and EtherCAT on open hardware devices. Included is a modifiable application programming interface (API) and the ability to target code for differing communication protocols.