Embedded Computing Design

Monheim am Rhein, Germany. SEGGER’s J-Trace PRO, USB 3.0, for E-Series SiFive RISC-V cores offers streaming trace, Live Code Profiling, and Live Code Coverage for real time data processing for addressing runtime hotspots and opportunities to enhance them. Included are J-Link’s features such as high-performance flashloaders, up to 4 MB/s download speed, and an unlimited number of breakpoints in the flash memory of MCUs.

Concurrent Technologies released its Intel® Core™ i7 processor powered Helios, an ITAR-free Commercial Off The Shelf (COTS) rugged industrial computing vision system with optimal Size, Weight, Power and Cost (SWaP-C) envelope able to withstand the harshest edge environments. Included is an Nvidia® graphics module with adequate I/O and storage plasticity for command-and-control display, degrade vision enhancement, and 360° vehicle navigation.

Munich, Germany. Infineon Technologies has set a new benchmark in 950 V superjunction (SJ) technology with its CoolMOS PFD7 high-voltage MOSFET family including an embedded body diode for ultra-low reverse recovery charge (Q _rr) and reduced switching losses (E _OSS, Q _OSS, and Q _g) for better efficacy in hard- and soft-switching applications, with the effect of up to 4°K lower MOSFET temperature than previous technology.

CAMARILLO, Calif. Semtech Corporation revealed its HotSwitch platform with embedded secure circuity, dynamic behaviors (limited rush current, proper loading sequence), and safety features (overcurrent, voltage) for a smaller BOM and a reduced PCB area. The HotSwitch system can embed IEC 61000-4-2 level compliant ESD protection for a variety of applications.

Taipei, Taiwan. Neousys Technology introduced the Nuvo-2600 series compact fanless computer driven by Intel Elkhart Lake quad-core processor. "Enclosed in ruggedized compact dimensions, Nuvo-2600 series features an Intel® Atom® x6000E quad-core processor, wide temperature fanless operation, 4x PoE+ GbE ports, and flexible expansion from mPCIe, PCIe, or a SuperCAP UPS. It is the perfect multi-purpose embedded computer for machine vision and autonomous warehouse applications," says Kaichu Wu, Product Manager of Neousys Technology.

Munich, Germany. Infineon Technologies AG released its XENSIV connected sensor kit (CSK), a blend of XENSIV sensors with advanced processing for applications centered around the PSoC 6 microcontroller. OPTIGA Trust M secures the connection with an Adafruit compatible modular board design for use of differing sensors.

Agile Analog released a full set of the key analog IPs set in six blocks around the client’s processor and memory hardware for critical analog tasks needed for an interface between the digital and analog realm. "Effectively this provides a foundation toolkit for all the analog parts that a design might possibly need to fast track, simplify and re-risk the design process," says Barry Paterson, Agile Analog's CEO, "We have included all the features and functions that a customer would require so that they can select exactly what they require from the set without worrying that they missed something vital.

SABERTEK released its Micro Genie solution with support for GPS, Bluetooth (BLE), accelerometer, inputs, outputs, and LTE connectivity with pre-configured provisions for a bi-directional upstream and downstream data flow.

Hsinchu, Taiwan. Airoha Technology announced it began to provide a Broadband System-on-Chip (SOC) solution powered by RDK-B that enables the use of current hardware and software with coaxial cable and DOCSIS interface standards. The Airoha provided software supports routing for Wi-Fi, device management, diagnostics, DNS, and IoT interfaces, such as Bluetooth, Thread and Zigbee.

SANTA CLARA, Calif. Marvell  unveiled its FIPS-certified LiquidSecurity 2 (LS2- converged security platform) hardware security module (HSM) adapter advanced solution driven by cloud-enhanced Marvell OCTEON® data processing unit (DPU) for enabling encryption, key management, authentication, and other HSM services within the cloud.

Innoscience Technology announced a full range of 650V E-mode GaN HEMT 190mΩ, 350mΩ and 600mΩ R_DS(on) components in general 8x8 and 5x6 DFN bundles. Qualified to JEDEC standards, the 650V HEMTs are certified Dynamic High Temperature operating life test (DHTOL) dependability testing according to JEP180. The JEP180 is JEDEC’s new guidelines for GaN technology. The 650V HEMT (InnoGaN) have a projected life expectancy of 36 years at 80% (520V; 150°C; 0.01% failure rate).

SAN CARLOS, CA. Check Point® Software Technologies Ltd. unveiled its Check Point Quantum Titan, part of the Check Point Quantum cyber security platform utilizing AI with deep learning capabilities for preventing 5X more DNS exploits and 4X more phishing when juxtaposed with previous generation technologies. Frank Dickson, IDC Group Vice President of Security and Trust, explains “Check Point looks to prevent these elusive cyberattacks with Titan, the newest release of their Quantum security platform. Check Point applies AI deep learning threat prevention, automation, threat intelligence analytics, and unified security management to simplify operations and increase security effectiveness across the network, data center, cloud, endpoints and IoT.”

Munich, Germany. Infineon Technologies announced the release of ModusToolbox 3.0, an updated design solution with improved multi-core project workflow support, graphical tool for board support package (BSP), and backend system enhancements and infrastructure support for ModusToolbox Packs. The ModusToolbox 3.0 is ideal for consumer IoT, industrial, smart home, and wearables.

Westford, MA. Swissbit released its iShield HSM (hardware security module), a plug-and-play metal-housed USB-A module for securely storing cryptographic keys for IoT ecosystems. It supports OpenSC open-source software stack, and PKCS#11 and PKCS#15 cryptographic standards.

MILPITAS, Calif. SEMI reported in its 200mm Fab Outlook to 2025 report that the global manufacturing of semiconductors is expected to boost 200mm fab capacity 20% from 2021 to 2025. The additional output will add 13 new 200mm lines as production reaches more than 7 million wafers per month (wpm). Plans to meet the markets growing demand has companies like ASMC, BYD Semiconductor, China Resources Microelectronics, Fuji Electronics, Infineon Technologies, Nexperia and STMicroelectronics reveal plans for new 200mm fabs.

MILPITAS, Calif. In its 300mm Fab Outlook to 2025 report, SEMI compiled data that shows an expansion of 300mm fab capacity will expand to a 10% compound average growth rate (CAGR) from 2022 to 2025, reaching 9.2 million wafers per month (wpm). “While shortages of some chips have eased and supply of others has remained tight, the semiconductor industry is laying the groundwork to meet longer-term demand for a broad range of emerging applications as it expands 300mm fab capacity,” said Ajit Manocha, SEMI President and CEO. “SEMI is currently tracking 67 new 300mm fabs or major additions of new lines expected to start construction from 2022 to 2025.”

SAN JOSE, Calif. Cadence Design Systems, Inc. released its Cadence Certus Closure Solution for the automation and acceleration of a full design closure cycle (from signoff optimization through routing, static timing analysis (STA) and extraction) overnight. Benefits of the solution include: Innovative scalable architecture, Incremental signoff, Improved engineering productivity, SmartHub interface, 3D-IC design efficiencies.

Flex Power Modules launched its non-isolated and unregulated BMR313 Intermediate Bus Converter (IBC) that provides peak power rating of 3 kW in a 23.4 x 17.8 x 7.65 mm form factor, with 908 W/cm3 power density. The BMR313 carries an input voltage range between 40-60 V, 10-15 V of output with 97.3% efficiency at 54 V input, and continuous output of 1kW. The BMR313 is designed for cold wall mounting and offers the generally used LGA footprint and pinout.

MILWAUKEE. Rockwell Automation, Inc. launches its FactoryTalk® Design Hub™ for industrial automation projects requiring modern security standards. The new design allows member access to designs on-demand from any browser with updatable and flexible software.

Thalwil, Switzerland. Move-X released its LoRa connectivity platform, Cicerone board, integrating u-blox positioning technology and u-blox cloud positioning service (CloudLocate). CloudLocate offers power saving ability at the edge when it analyzes and locates position in the cloud, not on the device, saving 10X energy over standalone GNSS.