Embedded Computing Design

SANTA ROSA, Calif. Keysight Technologies, Inc. used its CyPerf, to demonstrate the capacity of the F5 BIG-IP Next Edge Firewall cloud-native network function (CNF), powered by the 3rd Gen AMD EPYC processors. "We were confident that this proof-of-concept configuration would be powerful, with the automation and efficiency of running the new Edge Firewall CNF on AMD EPYC CPUs with 64 cores,” said Ryan Howard, Principal Solution Engineer, Business Development, F5.

Wilmington, Mass. Analog Devices, Inc. released the ADIN2299, a multiprotocol (PROFINET, EtherCat, EtherNet/IP, Modbus TCP) industrial ethernet switch platform for operation in a star, line, or ring topology. The 194 CSPBGA (Chip Scale Package Ball Grid Array) includes a communication controller, two port 10/100Mbps ethernet switch, memory, physical layer (PHY), protocol stacks, with the RTOS, file system, drivers, and TCP/IP.

CWD Limited developed the CWD CBTLRM02, dual combo module incorporated in ATEX certified smart ID cards, and integrated with Semtech's LoRa Connect™ platform with LoRaWAN® standard connectivity and Bluetooth® Low Energy (BLE).

ICP Germany launched, the ND118T, a small and multifunctional board in the PICO-ITX form factor for low energy consumption in industrial ecosystems.

The EAC-5000 is powered by NVIDIA’s® Jetson AGX Orin™ platform and is ideal for many solutions including: automated agricultural machinery, in-vehicle computing, robotic control, machine vision, intelligent video analytics, mobile robots, and other embedded AI applications.

SiTime provides an alternative MEMS oscillator with system-level techniques for fixing the problem of dense integration design of Dojo power module. 

The new eFuse Protection ICs Series features protection, sensing, and control features in a single chip. 

HALCON 22.11 has a planned release of Novenmber 22, 2022 with a new feature enabling bin picking of foreign objects. 

The TB67S549FTG has a wide operating range for space sensitive applications. 

The DP2000 provides higher output speed with low current measurements. 

The OTA RF charging platform allows the monetization of underused low-frequency bands with “Power as a Service” to alleviate the need for disposable batteries.

SEMI predicts 29 million wafers a month (200mm equivalent) for 2023.

The TSV782 will bring high-speed and precise signal conditioning to STMicroelectronics 5V OP-AMP Family.

Infineon is expanding its family of AC-DC controller ICs to help amplify one of the industries fasting growing markets, battery-powered appliances.

AVerMedia released the AGX Orin Box PC powered by the high performance and efficient NVIDIA Jetson Orin Nano system-on-modules (SOMs).

Covid 19 brought into play the need for more sufficient air quality with sterilization for both water and surface. The new SPSL from Silanna UV will “produce UV emissions from 340 nm to 210 nm, covering most of the UV spectrum.”

LANDSHUT, GERMANY. HiveMQ released HiveMQ Enterprise Extension, a “scalable solution… to deploy business critical IoT systems,” said Christian Götz, CEO and Co-founder of HiveMQ.

New DSCL allows for the implementation of the digital circuits needed to manage analog blocks in mixed signal solutions.

5G Standalone mmWave for Fixed Wireless Access

AVA Charging, a new SaaS service from Nokia.