Embedded Computing Design

Munich. Rohde & Schwarz released its new R&S NRP90S and R&S NRP90SN power sensors with a frequency scale of 50 MHz to 90 GHz, dynamic range from -70 dBm to 20 dBm, and speeds of 50,000 measurements per second.

Irvine, Calif. Telit released its SE250B4, an Android centered SoM driven by the Qualcomm QCM2290 system-on-chip (SOC) incorporating Qualcomm’s Adreno GPU 702 at 845MHz. The SE250B4 supports various program features and wireless capabilities such as LTE Cat. 4, Wi-Fi 5, Bluetooth 5.0, and GNSS.

BOSTON. Recently, The Industry IoT Consortium® (IIC®) released, an Industrial Internet Reference Architecture (IIRA), to focus on questions raised within current industrial IoT systems. “As the industrial IoT becomes common knowledge and widespread across industries, how to architect and update systems remains relevant and evolving,” said Shi-Wan Lin, CTO, Yo-i Information Technology and one of the authors of the framework.

El Dorado Hills. CA. Blaize® and J-Squared Technologies Inc are teaming up to enable the delivery of the Blaize® Graph Streaming Processor (GSP®) Architecture Hardware and Software Technologies. According to the press release, the companies plan to revolutionize programmability with the efficacy of its GSP architecture to embedded environments, especially where settings are detrimental.

MUNICH, Germany. NXP Semiconductors released its NXP analog front-end platform (N-AFE) family developed for software configuration with eight universal analog input components that supply reliable transfer of data and the ability to monitor ecosystems within factory automation. “Software-defined factories are the next evolution of the Industry 4.0, and this software-configurable analog front-end family will help achieve that milestone,” said Jens Hinrichsen, Executive Vice President and General Manager of Advanced Analog at NXP.

SAN FRANCISCO. MLCommons released its findings from the industry-standard MLPerf Training, HPC, and Tiny benchmark suites. The full open-source professionally reviewed benchmark suites scale ULP components from a few microwatts for disruptions up to robust multi-megawatt data center platforms and supercomputers. The recent MLPerf solution has a 5X increase in power capable of expanding speed and intelligence at all scales.

Munich, Germany. Infineon Technologies AG commercially released its industrial high density serial F-RAMs, the 8- and 16-Mbit EXCELON F-RAM memories. Both the 8-and 16-bit memories focus on non-volatile data-logging needs for the next-generation automotive and industrial systems to mitigate data loss at the edge. Also featured is a wide voltage operation from 1.71 V to 3.6 V, support up to 54-MBps of data throughput over a low-pin count interface, and offered in a RoHS-compliant, 24-ball FBGA package.

IRVINE, Calif. Telit released a Cat 13 variant of the Telit LN920 M.2 LTE data card series supporting full compatibility with current Cat 6 and Cat 12 LN920 data cards. The LN920A13 comes powered with the needed speed of 150 Mbps for mobile computing, enterprise routers, video streaming and IoT devices. The download speed of 400Mbps was designed for large bundled data from the edge. Included with the Cat 13 variant is a GNSS location and WCDMA (3G) fallback for scalability within solutions centered around the LN920 series.

WAKEFIELD, MA. PICMG’s new COM Express 3.1 specification has been approved to strengthen PCIe Gen 4 and USB4. Updates include a specified 16Gps connector throughout family Type 6, 7, and 10 pinouts, SATA Gen 3, and a CEI signaling-enabled 10 GbE interface and IPMB management interface for the Type 7 pinout, a component of COM.0 R3.1. Improvement with the specification includes optional USB4 (Type 6), MIPI-CSI connectors (Types 6, 10), SoundWire (Types 6, 10), and SPI interface (Types 6, 10).

SANTA ROSA, Calif. Keysight Technologies, Inc. revealed a set of 80Gbps USB adhering to the specification requirements implemented by the USB Implementers Forum (USB-IF).

VersaLogic released the E9 module, a dual 10 Gigabit Ethernet expansion board delivering two independent IEEE 10Gb Ethernet RJ-45 ports that are backward compatible with slower ports (5GbE, 2.5GbE, and 1GbE), and will power signals up to 100m on Cat 6A cable.

Wincomm, introduced its new WLP 7 J 20 series powered by Intel’s Elkhart Lake Celeron J6412 2.0GHz quad core and is available in 10.1(16:9), 10.4 (4: 15 (4:3), 15.6(16:9), and 21.5(16:9) inches. IOs Included in the WLP 7 J 20 are up to 4 USB (2 x USB3.2, 2 x USB 2.0), 3 x COM(1 X RS-232, 2 X RS-232/422/485), 2 x LAN(1 x 2.5Gbps), 1 x HDMI 2.0b, 1 x VGA, and expansion slot with 1 x PCIex1 Gen III, 1 x M.2 E key for WiFi/Blus tooth module, 1 x M.2 B key for PCIex1/USB, 4G/5G SIM card, and support for Windows 11.

Sophia Antipolis, France. In the world today, we are staring at disaster with the war in Ukraine that is leading to a global energy crisis. Critical infrastructure including transportation, electricity, natural gas, and water plants must be secured from outside nefarious attacks. There are 120 countries using Tetra (Terrestrial Trunked Radio) networks. Work has begun to make certain that ETSI TETRA technology standard is fully secured from devious individuals or groups. ETSI released two specifications (ETSI TS 100 392-7 and ETSI TS 100 396-6) created by top professional from ETSI quantum safe cryptography group.

KIRKLAND, Wash., Nov. 07, 2022 Alliance Memory today announced its technology lineup for electronica 2022, taking place Nov. 15-18 at the Trade Fair Center in Munich, Germany. Exhibiting in Hall C3, Stand 328, the company will be highlighting its latest SRAM, DRAM, eMMC, and flash memory ICs for the communications, computing, embedded, IoT, industrial, and consumer markets.

WILMINGTON, Mass. & LOWELL, Mass. UMass Lowell collaborated with Analog Devices, Inc., and the Analog Devices Foundation to create a research lab embedding next generation technology into students for an interactive learning experience within the realm of radio frequency and microwave technologies.

Shenzhen, China. MYIR released its ARM+FPGA SoM MYC-JX8MMA7 CPU Module utilizing NXP i.MX 8M Mini quad-core ARM Cortex-A53 plus 400MHz Cortex-M4 processor and Xilinx XC7A25T Artix-7 FPGA. Supplied with a gold-finger-edge-card connector, the MYC-JX8MMA7 CPU Module can connect two USB Host and one OTG, one Gigabit Ethernet, two SFP network interfaces, WiFi/Bluetooth module interface, USB 2.0 based M.2 Key B 5G Module interface, LVDS and HDMI display interfaces, MIPI and Parallel CSI interfaces, Audio, and one 2 x 20-pin UART/I2C/SPI/GPIO extension header which is compatible with Raspberry Pi interface. The base model features 2GB LPDDR4, 8GB eMMC and 32MB QSPI flash for ARM MPU, 256MB DDR3 and 32MB QSPI flash for FPGA as well as two dedicated PMIC (ROHM BD71847AMWV).

Munich, Germany; Seoul, South Korea. Codasip shared news the that SiliconArts has embraced Codasip 7-series RISC-V processors with Codasip Studio customization tools. Codasip’s RISC-V processor IP combined with SiliconArts ray tracing GPUs are designed for complete optimization of demanding graphic applications. Ron Black, CEO, Codasip, commented, "It's becoming extremely difficult to make performance gains from scaling semiconductors to smaller nodes. RISC-V combined with the customization capabilities of Codasip Studio enable our customers to make significant performance gains."

Santa Clara, Calif. SiFive, Inc. now offers the SiFive Performance P670 and P470 RISC-V processors based on the ratified RISC-V Vector v1.0 Specification including RISC-V Vector Cryptography extensions, SiFive WorldGuard system security, full RISC-V RVA22 profile compliance , Advanced Interrupt Architecture (AIA) compliant interrupt controller, more support for Message Signal Interrupts (MSI) and virtualization (including a separate IOMMU for accelerating virtualized device IO), and scalability with multi-core, multi-cluster support for up to 16 cores.

Vecow’s ECX-3000 PEG Series leverages the processing power of 12th Gen Intel Core i9/i7/i5/i3 processors with Intel UHD Graphics 770 utilizing Intel’s R680E chipset with LAN ports including 2.5G, 2.5G PoE+, 2.5G PoE+ with X-Coded M12 and 1G, while supporting high-speed data transfer up to 20G USB3.2 Gen2x2. The ECX-3000 PEG Series merges P-cores and E-cores with Intel Thread Director, handling up to 4 PCIe expansion slots for NVIDIA/AMD graphics card with up to 200W power and support for PCIe 5.0 and DDR5 4800MHz memory up to 64GB.

TEL AVIV, ISRAEL POLYN Technology announced NeuroVoice, an analog neuromorphic chip employing both voice detection (VD) and voice extraction (VE) operating at 100 µW with inference performance in 20 µsec.