Embedded Computing Design

A quick jaunt down I-65 from Indianapolis will get us to our next stop on the Road to embedded world, New Albany, IN, and the home of Samtec USA.

Keysight Technologies, Inc. announced that it is the first company to gain acceptance from PTCRB validation group (PVG) for 5G new radio (NR) test cases that support Release 16 (Rel-16) specifications defined by the 3rd Generation Partnership Project (3GPP) telecommunications standards organization.  

While at the Rev 3 conference, Domino Data Lab unveiled its latest platform, Domino 5.2. This new platform continues Domino’s progress towards furthering enterprises wanting to become more model-driven by allowing data science and IT teams to develop and deploy more models faster, while slashing data/infrastructure complexity and costs, and extending autonomous model performance monitoring into Snowflake’s Data Cloud.

New Omni Antennas Are Designed for High Performance in Extreme Weather

X-FAB Silicon Foundries, together with Attopsemi, revealed that the newest version of Attopsemi‘s I-fuse IP with its next generation architecture has been effectively demonstrated on X-FAB’s XH018 180 nm process technology.

The joint effort delivers Microsoft Azure IoT cloud reference implementation integrating Arm trusted firmware and based on STM32U5 IoT discovery kit.

STMicroelectronics released a new AWS FreeRTOS-qualified, TF-M-based reference implementation, working in conjunction with Amazon Web Services (AWS), an ST Authorized partner, to easily and securely connect Internet of Things (IoT) devices to the AWS cloud.

The guidelines enable Wi-Fi service providers to expand into home-based applications using motion detection, gesture recognition and biometric measurement for healthcare, security, smart homes and more.

As electronics continue to invade more and more aspects of our daily lives, there is an obvious trend toward greater integration. Other than just simply making space for a rigid 2D circuit board (PCB) within a product, electronic functionality will be either mounted conformally onto surfaces or incorporated within the structural materials.

Advanced Thermal Solutions, Inc. (ATS) is now delivering DIY cold plates for engineers to custom fit onto devices where electronics need to be thermally managed for accurate implementation.

Rambus Inc. announced it has signed an agreement to acquire Hardent, Inc. The signed agreement expands the team of engineers at Rambus and hastens the development of CXL processing solutions for next-generation data centers.

DIGISTOR is redefining secure Data At Rest storage with drives to carry Common Criteria validation, the DIGISTOR FIPS 140-2 L2 M.2 NVMe SED.

XJTAG released a new software designed to speed up the development and debugging of boundary scan setups. The software can also be utilized to help curtail production line operators being distracted by too much information during test runs.

OK3568-C single board computer(SBC) is designed with SoM FET3568-C on carrier board by four ultra-thin connectors. The board guarantees the SoM source fully available to accomplish fast evaluation processes. The board is designed with ESC solutions, simplifying designing reference to help lesson their their time-to-market.

Researchers from Japan design a tunable physical reservoir device based on the dielectric relaxation at an electrode-ionic liquid interface.

ETSI released a Group Report, ETSI GR SAI 006, outlining the role of hardware in the security of artificial intelligence (AI).

With 5G wireless controlling the landscape of embedded design in 2022, Microchip’s 8-bit PIC and AVR microcontroller (MCU) families are adding market value. Microchip Technology Inc.  announced the release of five new product families and over 60 new individual devices that offer embedded designers simple solutions to common problems.

Kontron introduced its COM-HPC Client COMh-caAP and COM Express compact Type 6 COMe-cAP6. The new modules are based on 12th Gen Intel Core processors (H-series, former codename Alder Lake P).

Dimension Four announced a partnership with Memfault to support IoT companies in developing scalable and efficient devices. Device makers can more quickly build two key components of their IoT design, device-to-app data transfer, and robust remote device diagnostics.

Winbond Electronics Corporation announced significant enhancements to its DDR3 product on the ultra-high-speed performance.