Embedded Computing Design

With 5G wireless controlling the landscape of embedded design in 2022, Microchip’s 8-bit PIC and AVR microcontroller (MCU) families are adding market value. Microchip Technology Inc.  announced the release of five new product families and over 60 new individual devices that offer embedded designers simple solutions to common problems.

Kontron introduced its COM-HPC Client COMh-caAP and COM Express compact Type 6 COMe-cAP6. The new modules are based on 12th Gen Intel Core processors (H-series, former codename Alder Lake P).

Dimension Four announced a partnership with Memfault to support IoT companies in developing scalable and efficient devices. Device makers can more quickly build two key components of their IoT design, device-to-app data transfer, and robust remote device diagnostics.

Winbond Electronics Corporation announced significant enhancements to its DDR3 product on the ultra-high-speed performance.

Innoscience Technology announced an ultra-high-density 140W power supply demo that uses the company's high- and low-voltage GaN HEMT devices to attain efficiencies of over 95% (230VAC; 5V/28A). Measuring just 60x60x22mm (2.4x2.4x0.9in) the PSU has a class-leading power density of 1.76W/cm3 (29W/in3).

TouchNetix announced a fully integrated aXiom touchscreen chip offering a new 3D sensing capability by detecting air gestures allowing for touchless functions in a variety of automotive, industrial, and consumer environments.

e-con Systems launches qSmartAI80_CUQ610, a Qualcomm AI vision kit based on Sony STARVIS IMX415. This ready-to-deploy AI camera kit is suitable for running image-based machine learning and deep learning models at the edge.

Review Display Systems (RDS) announced availability of a complete range of industrial specification, wide aspect ratio 7.0-inch TFT display modules.

Keysight Technologies, Inc. introduced a new 120 Giga Baud (GBd) High-Performance Bit Error Ratio Test (BERT) solution (M8050A) for validating next generation chip deployments of up to 120 GBd for 1.6T (or one trillion bits per second) market with unachieved signal integrity. 

congatec has made available new Computer-on-Modules for 5G connected smart factories and industrial automation designed to simplify and accelerate the development of collaborative robotics and material handling systems.

The fifth visit on our road to embedded world is Arezzo, Italy, for a sneak peek at what SECO is planning for embedded world 2022.

Battery Energy Storage Systems (BESS) require communication capabilities to connect to batteries and peripheral components, communicate with the power grid, monitor systems remotely, and maybe one of the keys to solve the energy crisis and make the world more sustainable.

Toshiba Electronics Europe GmbH announced a series of Mikroelektronika Click boards featuring Toshiba bipolar stepper motor drivers to allow for quick and easy device evaluation and prototyping.

While the global edge computing market is expected to double in size by 2026, Recab UK is bringing the latest generation of congatec’s computer-on-modules (COMs) to businesses across the UK now.

Reduce the size and extend the life of bioimpedance (BioZ) remote-patient monitoring (RPM) devices with the MAX30009 low-power, high-performance BioZ analog front-end (AFE) from Analog Devices, Inc. (ADI).

NXP Semiconductors announced a new device in its EdgeLock secure authenticator family, designed with the flexibility, adaptability and versatility needed to help ensure security across multiple standards in various IoT ecosystems.

The next stop on our road to embedded world brings us to Taipei, Taiwan for a quick look at what iBase Technology is presenting at embedded world 2022.

Sequitur Labs announced the release of its EmSPARK Security Suite for the NVIDIA Jetson edge AI platform. It features a generally available development kit and pre-built Trusted Applications providing robust security features and functions needed to protect AI models at the edge.

OK3568-C single board computer (SBC) is populated with SoM FET3568-C on carrier board by four ultra thin connectors and ensures the SoM source is available to achieve users' fast evaluation purpose. The OK3568-C is designed with ESC solution which simplifies designing reference to help users to shorten their product time-to-market.

Swissbit is adding a new product category to its security solutions portfolio, iShield FIDO2, its first authenticator for the FIDO2 open authentication standard. The login process using iShield FIDO2 offers maximum security for accessing web services and online accounts through asymmetric cryptography and through a hardware security key, as well as supporting USB Type-A and NFC for use with mobile devices.