Embedded Computing Design

Munich, Germany. Infineon Technologies released its Solid-State Isolators (iSSI) featuring drivers leveraging coreless transformer technology for faster and more efficient switching along with circuit protection functionalities that outperform those of optical-based Solid State Relays (SSR). The iSSI enables the driving of Infineon’s OptiMOS and CoolMOS, resulting in a 70 percent reduction in power dissipation compared to general solid-state relays using SCR (silicon-controlled rectifier) and Triac switches.

Nuremberg, Germany.  Swissbit will be exhibiting its PCIe family with focus on the N5200 SSD and its leading IOPS per watt ratio at embedded world 2024 in booth 1-543. Swissbit will also reveal the new iShield Key Pro featuring USB-C compatibility, alongside CmReady-certified memory cards aimed at optimizing license protection efficiency.

SEPA Europe introduced its HZ30B, an active chip cooler featuring an innovative method utilizing an integrated MF17B05 RaAxial mini fan housed within an aluminum pinbloc heat sink rather than being conventionally surface-mounted. The overall height of the HZ30B is 8mm and delivers a thermal resistance of 4.7 K/W.

SolidRun released its new Ryzen V3000 CX7 COM Module leveraging  the 8-core/16-thread Ryzen Embedded V3C48 processor with AMD’s 6nm “Zen3” architecture. The module delivers processing power, thermal efficiency, and high-speed I/O connectivity to the COM Express Type 7 form factor.

Frankfurt / Bad Homburg, Germany. MEMPHIS Electronic revealed a lead-free memory portfolio including the first generation DDR1 to the current DDR5. MEMPHIS will be showcasing the new memory modules at embedded world 2024 in hall 1, booth 340. The DRAM devices are said to be a plus to long-life electronic manufacturers because businesses will not have to rely on the exemption clause (7c-I) to the RoHS directive anymore.

Friedberg, Germany. IMAGO Technologies introduced its Vision Cam XM2, a compact, yet powerful smart camera leveraging the NVIDIA Jetson Orin module. Utilizing the camera reduces the requirement for extra hardware and integrates seamlessly into existing systems. A high-resolution sensor delivers capture capabilities of up to 5 megapixels per image and 165 frames per second (fps) at full resolution. At VGA resolution, the Vision Cam XM2 can capture up to 1,400 fps.

Green Hills Software will be exhibiting its embedded software technology during embedded world 2024 in Hall 4, Stand 325. See compelling solution demonstrations that tackle real-world challenges. Collaborations with the following partners will be highlighted: Arm, Altia, Excelfore, Google Android, Tata Elxsi, and others. Running on the newest processors from Infineon, NXP, Qualcomm, Renesas, ST and TI.

Altium will be attending embedded world 2024 with presentations covering electronics development, sourcing components intelligently, design productivity, and connecting Into Altium’s ecosystem. Visit Booth 4-305 for expert presentations, discussions, and giveaways.

Visit Hall 1, Stand 352 at embedded world 2024 where Yaskawa will be exhibiting its "Experience Connectivity" where its presenters will showcase the all-in-one chip TRITON, and its real-time Ethernet communication controller, the ANTAIOS, for automation and industry 4.0 applications.

During embedded world 2024, IC’Alps will exhibit its solutions in analog, digital, and mixed-signal circuit design for Healthcare, Automotive, Industrial, Aerospace, IoT/AI and Digital Security applications.

Bosch will be showcasing its solutions for hearables, wearables, and air quality applications during embedded world 2024 while located in Booth 4A-512. According to Bosch, it will bring the world's smallest accelerometers, BMA530 and BMA580, and the BMV080, the world's smallest particulate matter air quality sensor.

Axiomtek released its new ROS 2 AMR controller, the ROBOX500, designed for heavy-duty industrial AMR’s powered by the 12th Gen Intel Core i7 processor (code name: Alder Lake P). The solution collaborates with Linux Ubuntu 22.04 LTS OS with a software bundle including ROS 2 nodes with docker images, a web-based management system, AprilTag and shape detection, precise positioning, and obstacle avoidance.

Wakefield, Massachusetts. PICMG ratified the ModBlox7 base specification, a groundbreaking solution focused on the industrial demand for modular and interoperable embedded box PCs by setting parameters for a flexible mechanical architecture and compatible modules contained in a 1.4-inch horizontal pitch (7 HP) chassis. Mounting options for up to 12 of the 7 HP units include interconnection on walls, DIN rails, or insertion into a 19” sub-rack.

Västerås, Sweden. Percepio revealed that its Percepio DevAlert and its Device Firmware Monitor (DFM) solutions earned a technical cybersecurity review certificate by independent cybersecurity firm Triop AB. During the review, there were no found critical, high, medium, or low-impact security vulnerabilities.

Kraków, Poland. AVSystem is attending embedded world 2024 located in hall 5 at stand 456 from April 9th to 11th. AVSystem’s will showcase its IoT solutions as well as a joint venture with Semtech.

Wixom, Michigan. Acromag released its XMC-ZU5EV module combining an AMD (Xilinx) Zynq UltraScale+ with a quad-core ARM Cortex A53, a dual-core ARM Cortex R5, and FPGA logic in a single chip. Also included are dedicated processing blocks for graphics and Video.

Chicago, Illinois. Newark will now carry NI’s LabVIEW+ Suite that includes LabVIEW plus, TestStand, DIAdem, and FlexLogger. The software bundle contains tools for test, analysis, and measurement. Newark Vice President, Global Product & Supplier Management, Lee Turner, said, “The LabVIEW+ Suite can help development engineers make faster decisions, prototype more efficiently, and validate their work with greater ease. With its ability to deliver a wealth of usable data, this suite is a valuable asset for any engineer looking to streamline their workflow."

Chandler, Arizona. Microchip Technology released its PolarFire SoC Discovery Kit leveraging the PolarFire MPFS095T SoC FPGA highlighting a quad-core 64-bit CPU based on the RISC-V Instruction Set Architecture (ISA). The kit supports rapid examination of application concepts, firmware development, and code debugging.

BlackBerry Limited released its fifth generation QNX Software Development Platform (SDP) 8.0 that delivers a scalable high-performance real-time operating system when combined with the next generation QNX OS 8.0. The platform has been designed on a decade of safe and field proven technology maintaining its POSIX API for a prompt beneficial environment for both QNX and Linux developers.

ByteSnap Design released its Automated Electronic Product Design Service offering hands-free design solutions aimed at accelerating product time to market. ByteSnap defines specification requirements, creates a product's path, establishes project timelines, and brings together development and testing activities, all while adjusting to ever changing requirements.