Technology - Analog & Power - PCBs & Components - Page 4

How to Overcome the Power-Heat Dissipation Challenge in Embedded Motor Control Systems

Andy Phillips

February 1, 2021

PCBs & Components

The Modularization of Electronic System Design

Cliff Ortmeyer

February 25, 2021

Designing an Automatic Bicycle Wheel Light PCB

Jeremy S. Cook

February 24, 2021

MVTec Presents New Concept Feature at the embedded world DIGITAL

Tiera Oliver

February 23, 2021

Board-to-Board Connectors Designed and Tested for Special High-Speed Applications

February 16, 2021

Grounduino Nano: Extra Ground, Power, and Capacitor for the Arduino Nano

Jeremy S. Cook

February 5, 2021

TE Connectivity's New Board-to-Board Stacking Connectors Offer a Way to Upgrade COM Express Applications to 16 GT/s Speeds

Tiera Oliver

February 1, 2021

(A proof-of-concept COM-HPC Server module (Image source: ADLINK))

COM-HPC Provides Server-Level Compute Power for Edge Computing Applications

Max Maxfield

February 1, 2021

Flex Power Modules Releases BMR492 Series of Digital Eighth-Brick Intermediate Bus Converters

Perry Cohen

January 28, 2021

Infineon Expands EiceDRIVER Portfolio

Perry Cohen

January 25, 2021

New Vishay Intertechnology Through-Hole Inductor Packs a 420 A Saturation Current into 1500 Case Size

Tiera Oliver

January 18, 2021

Vishay Intertechnology introduced a new through-hole inductor designed to deliver a 420 A saturation current for 30 % inductance reduction in a 1500 case size.

Guerrilla RF Releases GRF5508, GRF5510 Linear Power Amplifiers

Perry Cohen

January 13, 2021

Guerrilla RF introduced the GRF5508 and GRF5510, two new linear power amplifiers the company has released in an effort to expand into the cellular market. The InGaP HBT amplifiers were designed by the company for 5G and 4G wireless infrastructure applications, which require native linearity over temperatures of -40°C to 85°C.

Gateworks Releases GW16143 GNSS/GPS Mini-PCLe Adapter

Perry Cohen

December 8, 2020

Superior Sensor Technology Releases SP160 Pressure Sensor

Perry Cohen

December 7, 2020

Microchip?s Low-Power Radiation-Tolerant (RT) PolarFire FPGA is Available in Engineering Silicon, On a Path to Full QML Class V Spaceflight

Tiera Oliver

December 3, 2020

Can You Stand the Heat?

JC Ramirez

November 23, 2020

15 Ways to Maximize the Value of Unit Tests in Safety Critical Projects

November 23, 2020

Effect of Temperature Inversion on Lower Nodes

eInfochips

October 28, 2020

FTDI Chip Honors Digi-Key with Distribution Award

FTDI

October 22, 2020

Dev Kit Weekly: GaN Systems Audio Evaluation Bundle

Brandon Lewis

October 3, 2020

Electronic Device Design Tips: Operating in Harsh Environments

Mark Bingeman

September 25, 2020

Products designed for space are exposed to the some of the harshest environments. They must operate reliably under intense vibration, mechanical shock, wide temperature swings, and more.