Application - Networking & 5G - Short-Range Wireless/PAN

Introducing the CYW20822 Bluetooth Module

Embedded Computing Design Staff

September 8, 2025

Infineon’s 20822 module is the ideal turnkey solution delivering a ton of performance and power efficiency in a cost-effective package that contains everything developers will need to integrate Bluetooth into their products.

Networking & 5G - Short-Range Wireless/PAN

Taoglas Expands Low-Cost, Compact Chip Antenna Range for Wi-Fi 6/7, UWB, and ISM Applications

Tiera Oliver

December 2, 2025

San Diego, CA, 2 December 2025 – Taoglas, a trusted provider of advanced RF and antenna solutions, today announced the expansion of its embedded antenna portfolio with a new range of Low Temperature Co-fired Ceramic (LTCC) chip antennas optimized for Wi-Fi 6/7, Ultra-Wideband (UWB), and ISM connectivity. The new ILA.257, ILA.68, and ILA.89 deliver ideal performance in ultra-compact packages - with minimal keep out area - designed for next-generation IoT, consumer, industrial, and wearable applications where space, efficiency, and reliability are critical.

Networking & 5G - Short-Range Wireless/PAN

Mouser Product of the Week: STMicroelectronics ST67W Wi-Fi 6/BLUETOOTH 5.4/Thread Modules

Tiera Oliver

December 1, 2025

Requirements for wireless connectivity in embedded IoT and industrial environments are driven by demands for increased performance, low-cost, robust long-term operation, and efficient networking and connectivity in smart home, smart appliance, healthcare, and industrial IoT applications.

Networking & 5G - Short-Range Wireless/PAN

Product of the Week: Infineon Technologies’ AIROC CYW55913 Connected Microcontroller

Tiera Oliver

November 17, 2025

Today’s modern and continuously evolving connected devices and environments, such as smart homes, industrial, wearables, and other IoT applications, require solutions that are compact, power-efficient, and provide constant and reliable wireless connectivity. These solutions benefit from simplified designs that accelerate development time, promote low latency, and provide secure connectivity on a single platform.

Ditch the Dongle: Engineered for Intel Evo

Embedded Computing Design Staff

August 19, 2025

Ditch the dongle with Engineered for Intel Evo, a verified program that meets Intel’s strict direct-to-host wireless connection requirements. Powered by Infineon’s CYW20829, the first program co-engineered with Intel at the chip and SDK level, physical security is enhanced while meeting CRA and RED certifications. This innovation brings significant advancement to the wireless connectivity space, streamlining development and elevating the user experience.

Short-Range Wireless/PAN

Product of the Week: Infineon Technologies’ AIROC CYW55913 Connected Microcontroller

Tiera Oliver

October 20, 2025

Morse Micro Announces Mass Production of MM8108 Wi-Fi HaLow SoC, Modules, Evaluation Kit, and HaLowLink 2

Tiera Oliver

September 23, 2025

Unboxing the CYW20822 Bluetooth Module

Embedded Computing Design Staff

September 22, 2025

Application Highlight: Electronic Shelf Labels Leverage Bluetooth for Success

Ken Briodagh

September 22, 2025

Unboxing the AIROC CYW20829 Bluetooth LE MCU Evaluation Kit

Embedded Computing Design Staff

August 4, 2025

Want to get started with the latest Bluetooth 5.4 supported Bluetooth LE MCU? View everything you need to get started with the AIROC™️ CYW20829 Bluetooth®️ LE MCU Evaluation Kit here.

Shelly Announces Portfolio of Shelly Wave Devices with Z-Wave Long Range

Tiera Oliver

July 22, 2025

Introducing the AIROC™️ CYW20829 Bluetooth

Embedded Computing Design Staff

July 21, 2025

Learn about the latest Bluetooth offering from Infineon in the AIROC™️ CYW20829 Bluetooth®️ LE MCU. See if it is right for your applications with the latest Bluetooth®️ LE 5.4 support, up to 2300 meters range without an external PA, ultra-low latency with an average of 1 ms sub event interval, and more.

Application Highlight: Infineon Leverages Bluetooth for Remote Controls

Ken Briodagh

July 21, 2025

Bluetooth Audio is Changing. Here’s What You Need to Know

Embedded Computing Design Staff

June 16, 2025

LE Audio brings in a suite of changes, including a new generic audio framework and a new audio codec. The latest spec introduces ISOC channels, and at a high level, this enables lower latency between devices, bidirectional communication, and broadcasting. This broadcasting feature is a big change in LE Audio since it will enable one-to-many devices capability, whereas before Classic Audio was limited to point-to-point communication.

What is Channel Sounding?

Embedded Computing Design Staff

June 2, 2025

Distance measurements via Bluetooth are getting a big improvement with the upcoming Channel Sounding feature. This explainer video gives a quick, high-level overview of existing Bluetooth distance measurement techniques and the working principles behind the new Channel Sounding feature.